Tessera Introduces One of the World's Thinnest Wafer-Level Chip-Size Packaging Technologies for Image Sensors and Other Optical Devices.

SHELLCASE([R])RT Delivers High Yield and Reliability in a Miniaturized Wafer Level Package

SAN JOSE, Calif. -- Tessera Technologies, Inc. (Nasdaq:TSRA), a leading provider of miniaturization technologies for the electronics industry, today announced SHELLCASE([R]) RT, one of the world's thinnest, wafer-level chip size packaging (WLCSP) technologies developed to provide key benefits to Original Equipment Manufacturers (OEMs) and others developing advanced electronics which integrate cameras.

Built upon Tessera's foundational wafer-level encapsulation technology, SHELLCASE([R]) RT delivers high yields by protecting image sensors and other optical devices from contamination from the initial stage of packaging. In addition, the platform's enhanced reliability is engineered to open up new market opportunities, such as the use of cameras in harsh environments, including automotive electronics. As one of the thinnest WLCSPs available on the market today (at ~500microns), SHELLCASE([R]) RT also enables very low profile camera modules, providing OEMs greater design flexibility and a powerful tool in developing thinner portable electronics.

SHELLCASE([R]) RT is a member of Tessera's industry-leading SHELLCASE([R]) technology family and leverages Tessera's established SHELLCASE([R]) OP and SHELLCASE([R]) OC technologies. According to analyst firm Prismark, in 2006, approximately 225 million image sensors will be packaged in Tessera's SHELLCASE([R]) technology, representing an approximate increase of 96% over 2005. According to market research firm Techno Systems Research (TSR), the market for image sensors within camera phones alone is expected to more than double from approximately 413 million units in 2005 to 940 million units in 2009. This represents a significant future growth opportunity for Tessera's technologies.

Through the introduction of SHELLCASE([R]) RT and SHELLCASE([R]) CF--a high-yielding wafer level solution Tessera announced in July of 2006 that is fully compatible with conventional Chip-on-Board (COB) processes--the company is offering a range of advanced technologies designed to address a broader set of applications and markets.

Mike Bereziuk, Tessera's executive vice president, product division, stated, "We are excited to be expanding our wafer level technology offering with the introduction of SHELLCASE([R]) RT, an advanced WLCSP technology designed to enable our customers to build higher yielding, lower profile camera modules for products which integrate a camera, such as camera phones, PDAs, laptops, and automotive-based electronics. SHELLCASE([R]) RT, combined with SHELLCASE([R]) CF, which we introduced earlier this year, enables Tessera to offer a full suite of advanced wafer-level solutions that address the majority of the image sensor market. The breadth and depth of our SHELLCASE([R]) technology family illustrates our commitment to support our customers in meeting the rigorous requirements of imaging in electronics today."

SHELLCASE([R]) RT Technology Overview

The primary application for SHELLCASE([R]) RT today is image sensors which are integrated into camera phones and consumer electronics. SHELLCASE([R]) RT is designed to provide high assembly yields largely irrespective of the imager's resolution or pixel size through the use of its innovative encapsulation method, which protects the sensor's imaging area from contamination by a glass cover at the initial stage of packaging. SHELLCASE([R]) RT also meets JEDEC MSL 1 reliability standards, addressing the more stringent reliability requirements of a broader range of applications, such as automotive electronics. At approximately 0.5mm in thickness, SHELLCASE([R]) RT is engineered to meet the industry's increasing demand for ultra thin electronics. As compared to SHELLCASE([R]) OC, the platform also accommodates narrow scribe lines (down to 100micron) as well as smaller and finer pitch bond pads.

Tessera is currently licensing this technology to interested parties. In addition, Tessera is offering related services, such as technology transfer and training. Prototype samples for evaluation are available. For additional information, please go to www.tessera.com

About Tessera Technologies, Inc.

Tessera Technologies is a leading provider of miniaturization technologies for the electronics industry. Tessera enables new levels of miniaturization and performance by applying its unique expertise in the electrical, thermal and mechanical properties of materials and interconnect. As a result, Tessera's technologies are widely adopted in high-growth markets including consumer, computing, communications, medical and defense. Tessera's customers include the world's top semiconductor companies such as Intel, Samsung, Texas Instruments, Toshiba, Micron and Infineon. The company's stock is traded on the Nasdaq National Market under the symbol TSRA. Tessera is headquartered in San Jose, California. www.tessera.com.

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected. Factors that might cause or contribute to such differences include, but are not limited to, fluctuations in Tessera's operating results due to the timing of new license agreements and royalties, Tessera's ability to protect its intellectual property and the risk of a decline in demand for semiconductor products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2005, and its Quarterly Report on Form 10-Q filed for the quarter ended September 30, 2006 include more information about factors that could affect the company's financial results.

Note: Tessera, SHELLCASE and the Tessera logo are registered trademarks of Tessera, Inc. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

NOTE TO EDITORS: In the second paragraph of this release, there is a tilde between "at" and "500microns". This symbol may not appear properly in some systems.