Teradyne Demonstrates its Technological Leadership at International Test Conference.

Business/Technology Editors

ITC

ATLANTIC CITY, N.J.--(BUSINESS WIRE)--Oct. 3, 2000

Teradyne Meets the "Test Challenges of Faster and Smaller

Technologies" With Cutting-edge Test Solutions

Teradyne, Inc. (NYSE:TER) announced today that it will introduce several new products at the International Test Conference (ITC). Teradyne will also be showcasing its vast array of test systems that cover high-performance VLSI test, advanced mixed-signal, including systems-on-a-chip (SOC), high speed memory test, FLASH memory and microcontroller test. (See Booth #903.) Teradyne provides test solutions for test challenges supporting this year's ITC theme: Test Challenges of Faster and Smaller Technologies.

Teradyne product demonstrations at ITC (Oct. 3-5) include:

Catalyst Tiger             The first over 1.5 Gbps SOC test
                           system. Tiger extends the Catalyst family
                           of test systems and provides even greater
                           throughput, zero-time DSP architecture,
                           IMAGE(TM) software, state-of-the-art analog
                           instrumentation, and 1024 digital pins.

Catalyst                   The first choice in SOC test capability for
                           DSL, wireless, microwave and power
                           management applications as well as the
                           economic leader, introducing parallel SOC
                           test and quad-site testing of Bluetooth(TM)
                           wireless devices.

INTEGRA J750               Delivering up to 1,024 digital
                           channels into a zero footprint system
                           contained entirely within a test head,
                           INTEGRA J750's high-throughput parallel
                           testing capabilities help deliver 95%
                           parallel test efficiency for up to 32
                           devices and features IG-XL test software.
                           It is semiconductor ATE's first
                           test development suite combining the power
                           and performance of the latest PC technology
                           and Windows NT operating system.

New RFID                   Introducing and demonstrating the NEW RFID
                           (Radio Frequency Identification Option)
                           which allows the J750 to test contactless
                           Smart Cards and I.D. Tag Devices

J973EP                     The only VLSI System for structural to
                           full-performance testing is introducing two
                           new options at ITC which include: a
                           Differential Test Option to debug,
                           characterize and production test
                           differential buses, and the 200A Ganged
                           Voltage Source Option to supply high
                           current loads with superior dynamic
                           response.  The J973EP also features Real
                           Time Enabling(TM) which provides the
                           ability to increase frequency, accuracy,
                           timing edgesets, and pattern memory
                           performance.  Real Time Enabling licenses
                           will be ordered and delivered on demand via
                           the web providing additional convenience.

Flash 750                  The FLASH 750 is an integrated test cell
                           which features a new architecture to reduce
                           the cost of test for flash memory - the
                           first with the capability to test 32
                           devices in parallel for cell phone NOR
                           flash devices.

ARIES                      ARIES Memory Test System, the only test
                           platform capable of High Speed Wafer Level
                           Test (HSWLT) DRAM production today, will
                           showcase high-performance device testing at
                           the lowest cost to test. ARIES High-speed
                           RAM system operates at data rates to 1.0
                           Gbit/second while testing up to 16 devices
                           in parallel - the testing choice for the
                           newest generation of devices including
                           High-bandwidth RAMs, Direct Rambus(TM)
                           DRAMs, SLDRAMs and fast SSRAMs

Teradyne, Inc. (NYSE:TER) is the world's largest supplier of automatic test equipment (ATE) and associated software for the electronics and telecommunications industries with 1999 sales of $1.8 billion and more than 8,500 employees worldwide. TERADYNE products are used to test semiconductors, circuit assemblies, telephone lines, networks, computerized telephone systems, and software. Teradyne is also a leading supplier of backplane assemblies and high-density connectors used in high-performance electronic systems in communications and computing. More than 70% of the company's business is driven by Internet growth. Teradyne's web address is www.teradyne.com.

IMAGE, Direct Rambus, and Real Time Enabling are trademarks of Teradyne, Inc. Bluetooth is a trademark owned by Telefonaktiebolaget LM Ericsson, Sweden.