Technical conference.MONDAY, MARCH 27 9 AM- 11 AM NEW! 010--Complete EMC (1) (EMC Corporation, Hopkinton, MA, www.emc.com) The leading supplier of storage products for midrange computers and mainframes. Founded in 1979 by Richard J. Egan and Roger Marino, EMC has developed advanced storage and retrieval technologies for the world's largest companies. Analysis The UMR UMR Unite Mixte de Recherche (French: Mixed Unit of Research ) UMR University of Missouri - Rolla UMR Upper Mississippi River UMR Uniform Methods and Rules (US Department of Agriculture) UMR Unit Manning Report Way Speaker: Ralf Bruening, Zuken Attendees: PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. designers, design engineers and engineering managers interested in EMC analysis. EMC is one of the most critical problems facing the electronics industry today, and the University of Missouri-Rolla EMC lab is a pioneer in this field! A new EMC analysis approach utilizes the EMC Expert System Consortium work at the University of Missouri-Rolla (UMR) EMC lab. Attendees will learn how to bridge the gap between EMC science and practice, as well as how to perform fast analysis of complex PCBs and utilizing EMC-related "what if" capabilities. This approach covers all major EMC effects occurring on PCBs and allows an EMC optimization during the design process. NEW! 011--Mixed-Signal Board Design Speakers: Imran Kahn, Syed Rizvi and Wasif Ali of Nexlogic Attendees: PCB designers and anyone with a basic knowledge of PCB design. Designing mixed-signal boards calls for certain considerations that are critical for achieving optimum performance. Analog and digital devices have different characteristics, including power ratings, current, voltage callouts, and heat dissipation Noun 1. heat dissipation - dissipation of heat chilling, cooling, temperature reduction - the process of becoming cooler; a falling temperature requirements. Attendees will learn the steps to effectively design mixed-signal components on a PCB, as well as the various adverse results of not properly designing these two different technologies on a PCB. 012--Skin Effect on PCB Traces Speaker: Doug Brooks, UltraCAD Attendees: PCB designers and others interested in the skin effect Many of us learned that the impedance of capacitors and inductors varies with frequency, but resistance does not. As rise times continue to get faster and frequency harmonics on our boards continue to get larger, this assumption about resistance is no longer true. Skin effect causes the effective resistance of a wire or trace to increase with frequency. If you don't know Don't know (DK, DKed) "Don't know the trade." A Street expression used whenever one party lacks knowledge of a trade or receives conflicting instructions from the other party. what skin effect is, how it affects resistance and what the proximity effect Proximity effect may refer to:
NEW! 013--Vies and Their Effects on High-Speed Digital Signals Speaker: Robert Hanson Robert Hanson or ... Hansen or ... Hanssen may be:
Attendees." PCB designers, design managers and others interested in the properties behind vies. Vies are much more than holes; they can have a profound effect on your digital signal. This course will cover the mechanical properties of vies--from drilling and plating, to lamination lamination a laminar structure or arrangement. , electrolysis electrolysis (ĭlĕktrŏl`əsĭs), passage of an electric current through a conducting solution or molten salt that is decomposed in the process. and electroplating electroplating: see plating. electroplating Process of coating with metal by means of an electric current. Plating metal may be transferred to conductive surfaces (e.g., metals) or to nonconductive surfaces (e.g. . Attendees will learn more about the capacitance and inductance inductance, quantity that measures the electromagnetic induction of an electric circuit component; it is a property of the component itself rather than of the circuit as a whole. of vies; return current and its relation to vies; through-hole, blind, buried and microvias; methods for drilling; aspect ratios; and cost tradeoffs. Discussion will focus on whether vies and autorouters are HDI HDI Human Development Index (UNDP yardstick of human welfare) HDI Help Desk Institute HDI Humpty Dumpty Institute (New York, New York) HDI High Density Interconnect compatible, via discontinuity and via resonance concerns, capacitance and inductance of vias (through-hole, blind, buried), eliminating reflections of vias, and return current and intelligent via placement. 1:30 PM-5 PM NEW! 020--Wayne's Route Speaker: Wayne Pulliam, AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips. Attendees: PCB designers and anyone else with basic PCB physical design knowledge. Wayne's Route--excellent! This workshop is for anyone wishing to learn hand-routing skills or improve their existing routing skills. This presentation will cover designing single-sided assemblies with four-layer board construction and multilayer assemblies with higher layer counts. An abbreviated overall design now will be followed by a detailed placement and routing strategy. Many specific routing examples will he shown for discussion. General placement and routing tips will be covered throughout the presentation and listed at the end for easy review. NEW! 021--The Lead-Free Mandate and the Production Line Speaker: Robert Hanson, Americom Seminars Attendees. PCB designers, fabricators and anyone worried about the move to lead-free PCB assembly. With the advent of the EU's RoHS and WEEE WEEE Waste from Electric and Electronic Equipment (directive) WEEE Waste Electrical and Electronics Equipment WEEE Waste Electrical and Electronic Equipment directives, the PCB industry must address the legal and technical ramifications ramifications npl → Auswirkungen pl of non-compliance. Legally, the main questions are: Who will catch violators and what type of penalty will they face? On the technical side, what type of failures can you expect on the production line because of printing or components? What are the recommended solder paste Solder paste (or solder cream) is a mix of small solder particles and flux. It is used extensively in the automated soldering processes wave soldering and reflow soldering. formulas for renew and wave? Attendees will learn the facts about issues such as high-temperature renew and wave soldering Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the board. reliability, quality and aesthetics. The dilemma of tin whiskers See metal whiskers. (including real-world tragedy case studies) will also be addressed. 022--EMI and Crosstalk (1) Electromagnetic interference that comes from an adjacent wire. "Alien" crosstalk is interference that comes from a wire in an adjacent cable, for example, when two or more twisted wire pair cables are bundled together. : Theoff, Simulation and Control Speaker: Doug Brooks, UltraCAD Attendees. Attendees of this session should have a basic familiarity with PCB design. Engineers who have not had formal training in crosstalk will find this course useful. Crosstalk is one of the more difficult noise problems for designers to understand and control. And many engineers use rules of thumb that they really don't understand. This course will first look at forwards and backwards crosstalk to help attendees understand the sources and differences between the two. Then results from an analysis tool will be used to help attendees see the strengths and weaknesses behind such tools, and to help the student visualize the crosstalk effects. Finally, some design considerations will be reviewed to show how crosstalk can be managed, minimized, and perhaps even eliminated! NEW! 023--Designing For Asian Fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. Speaker: Happy Holden, Asian Pacific Materials Attendees. PCB designers, design managers, layout technicians and others interested in this topic. If there were ever a time to have a full understanding of DFM DFM Design for Manufacturing (newsletter) DFM Design for Manufacturability DFM Dubai Financial Market DFM Delphi Form (computer filename extension) DFM Distinguished Flying Medal DFM Diesel Fuel Marine , then having your boards built in China is that time! This workshop will highlight the issues, choices, alternatives and conditions that designers need to consider in order to make a printed circuit board manufacturable in Asia, especially China. Attendees will learn how to determine if a fabricator fab·ri·cate tr.v. fab·ri·cat·ed, fab·ri·cat·ing, fab·ri·cates 1. To make; create. 2. To construct by combining or assembling diverse, typically standardized parts: is capable of handling an order; how to use IPC-9151 capability benchmarking to select fabricators; when you should use controlled impedance; plating, finishes and thickness distribution; mechanical and image tolerances; materials, multilayer stackup stack·up n. A deployment of aircraft circling an airport at designated altitudes while awaiting instructions to land. and hole plugging; thieving, plating concerns and why plating thickness varies; calculations vs. 2D field solvers; and much more. 3 PM-4 PM 024--The Impact of Lead-Free on Fabrication Speaker: Zulki Kahn, Nexlogic Attendees: PCB fabricators, PCB designers and anyone interested in manufacturing PCBs in the era of RoHS and WEEE. Get the lead out! The movement to lead-free assembly is having a distinct impact on PCB fabrication. Removing lead from the picture often causes an increase in contact time, bump speed, and peak temperature. In this one-hour workshop, attendees will learn how board thickness and surface finish affect lead-free fabrication. Attendees will learn about lead-free-compliant surface finishes (ENIG ENIG Electroless Nickel Immersion Gold (printed circuit board manufacturing process) , immersion silver, OSP (Online Service Provider) See online service. OSP - Optical Signal Processor , etc.), why they are important to lead-free PCB fabrication, and discuss the various tradeoffs and key advantages associated with each finish. NEW! 025--Decoupling Capacitor Design for High-Speed PCBs Speaker: Bruce Archambeault, IBM (International Business Machines Corporation, Armonk, NY, www.ibm.com) The world's largest computer company. IBM's product lines include the S/390 mainframes (zSeries), AS/400 midrange business systems (iSeries), RS/6000 workstations and servers (pSeries), Intel-based servers (xSeries) Attendees: PCB designers, design engineers and others interested in decoupling Decoupling The occurrence of returns on asset classes diverging from their normal pattern of correlation. Notes: Take for example stock and corporate bond returns, which normally rise and fall together. cap design. Decoupling of power and ground-reference planes is an important issue for both EMI (ElectroMagnetic Interference) An electrical disturbance in a system due to natural phenomena, low-frequency waves from electromechanical devices or high-frequency waves (RFI) from chips and other electronic devices. Allowable limits are governed by the FCC. emissions control Emissions control may refer to:
026--Effective Library and Design Data Management Speaker: Steve Chidester, Cadence Attendees. PCB designers, design managers and CAD librarians. Historically, product data management (PDM (1) (Product Data Management) An information system used to manage the data for a product as it passes from engineering to manufacturing. The data includes plans, geometric models, CAD drawings, images, NC programs as well as all related project data, notes and ) has been focused in the mechanical domain. But board-level library and design data management introduce challenges not present in the mechanical world. This course will describe methods for integrating the board-level design flow with a data management system, how this integration enables the engineering team to collaborate and how this leads to more effective design and manufacturing outsourcing. Discussion will also focus on additional benefits of electronic design management, such as revision control Revision control (also known as version control (system) (VCS), source control or (source) code management (SCM)) is the management of multiple revisions of the same unit of information. and design reuse. NEW! 027--Efficient RF Design Workflows Speakers: Tim Haag and Dale Hanzelka, Intercept Technology Attendees. PCB designers and layout professionals with a basic understanding of RF and digital design. Rapid development of RF circuits demands flexible, layout-driven design capabilities. This often entails constructing a physical layout using parametric RF models, analyzing the circuit with a microwave simulator, and perhaps synthesizing a schematic via the board database. This session will focus on RF design techniques that utilize some of today's top RF design applications. Attendees will discover rapid layout-driven design techniques for creating RF circuits, design optimization See automatic design optimization. through RF simulation, automatic schematic generation, and merging RF circuits into a mixed RF/digital design in a few easy-to-follow steps. FREE TUESDAY! Conference and Expo-only attendees are invited to attend the following Tuesday classes and paper sessions for FREE! Then visit the exhibit show floor for a program of FREE Exhibitor Showcase presentations. Finally, cap off an exciting day at PCB West by networking with your colleagues at the FREE 15th Anniversary Opening Night Reception, followed by the FREE Casino Night
A Casino Night (also called Vegas Nights, Las Vegas Night, Monte Carlo Night) is an entertainment event with a casino theme. Party! TUESDAY, MARCH 28 FREE WORKSHOPS * 9 AM 11 AM NEW! 030--Lead-Free Panel: The Designer Toolkit for RoHS and WEEE Compliance Moderator: Greg Roberts, EMA (1) (Enterprise Management Architecture) An earlier strategic plan from Digital for integrating network, system and application management. It provided the operating environment for managing a multi-vendor network. Design Automation Attendees: PCB designers, design managers and other executive and departmental managers. Waiting until the end of the design cycle to assure RoHS compliance might be acceptable for designs currently in production, but for new designs, companies must consider RoHS compliance at the very beginning of the design phase. The panel agenda will include RoHS and WEEE implications on the design process; managing the impact of RoHS and WEEE on the supply chain, PCB design infrastructure and data management; the practical impact of the directives; and achieving compliance of the electronics and mechanicals under RoHS and WEEE--is declaring self-compliance an option? The panel discussion will be followed by a Q&A session and a networking opportunity to meet each panelist, other knowledge experts, and fellow attendees. NEW 031--Land Pattern Creation "Wayne's Way" Speaker: Wayne Pulliam, AMD Attendees: PCB designers and anyone with basic knowledge of PCB physical design. This workshop simplifies the land creation process. Attendees will learn how to quickly extract the information needed to make land patterns, calculate pad size and determine pad location. Parts to be discussed include through-hole lead, surface mount, and edge connectors. Learn tips on pad shapes--round or oval vs. rectangular or square. Tips on silkscreen will help you deal with your assembler Software that translates assembly language into machine language. Contrast with compiler, which is used to translate a high-level language, such as COBOL or C, into assembly language first and then into machine language. and engineers. FREE LECTURES * 10 AM-11 AM NEW! 032--Routing for Complex Shapes Speaker: Bruce Rietdorf, Zuken Attendees: PCB designers, CAD managers who are interested in the challenge of routing. This course analyzes the added design difficulties created by flexible circuits, mainly routing for applications with complex shapes. Attendees will review how these barriers can be overcome using design engineering techniques and by applying different software. Discussion will also focus on issues associated with true curved routing, as well as how to deal with the unique problems posed by rigid-flex. NEW! 032--Using Network Analyzers to Measure PCBs at GHz Frequencies Speaker: Bruce Archambealt, IBM Attendees: PCB designers, design engineers and others interested in measurements at GHz frequencies. This course discusses the various calibration techniques, their pros and cons pros and cons Noun, pl the advantages and disadvantages of a situation [Latin pro for + con(tra) against] , and other time domain gating techniques that can extend the useful frequency range of the network analyzer. Understanding the loss for different dielectric materials Dielectric materials Materials which are electrical insulators or in which an electric field can be sustained with a minimal dissipation of power. Dielectrics are employed as insulation for wires, cables, and electrical equipment, as polarizable media for , trace configurations and connectors is vital to optimizing the design. But simple network analyzer measurements can be misleading at frequencies above about 5 GHz. Mismatch between the SMA connectors used to inject the signal and the actual trace on the board can cause resonances that will predict significant distortion on the actual trace. However, this is a measurement artifact A distortion in an image or sound caused by a limitation or malfunction in the hardware or software. Artifacts may or may not be easily detectable. Under intense inspection, one might find artifacts all the time, but a few pixels out of balance or a few milliseconds of abnormal sound that can be eliminated with careful calibration and other techniques. Attendees will learn these techniques and other tricks for using network analyzers at GHz frequencies. NEW! 034--Next-Generation M/ECAD Collaboration Speaker: Chad Hawkinson, PTC (PTC, Needham, MA, www.ptc.com) Long a world leader in mechanical computer-aided design, manufacturing and engineering software, PTC, through acquisitions and reorganization, has transformed itself into a leading provider of Internet-based B2B solutions for discrete manufacturers. Attendees: PCB designers, design managers and others involved in MCAD MCAD Microsoft Certified Application Developer MCAD Mechanical Computer Aided Design MCAD Medium-Chain Acyl-CoA Dehydrogenase (inherited metabolic disease) MCAD Minneapolis College of Art and Design and ECAD ECAD Electronic Computer-Aided Design ECAD European Cities Against Drugs ECAD European Center for Aviation Development ECAD external carotid artery dysplasia design. Even the best implementations of IDF-based or ODB-based integration solutions for MCAD and ECAD leave much room for improvement. Companies must still deal with the challenges resulting from the lack of coordination between mechanical and electrical disciplines during design. Attendees will discuss these problems and the approaches that are being developed to overcome them. Discussion will include the latest approaches to MCAD-ECAD real-time integration, change identification, process management and thermal analysis Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature. Techniques include:
NEW! 035--Matching Router Technology With Design Challenges Speaker: Dave Wiens, Mentor Graphics Mentor Graphics, Inc (NASDAQ: MENT) is a US-based multinational corporation dealing in electronic design automation (EDA) for electrical engineering and electronics, as of 2004, ranked third in the EDA industry it helped create. Attendees: PCB designers, layout technicians and others. The complexity of PCBs continues to steadily rise, driven by requirements for decreased design size and increased functionality. Today's challenges include: high-speed and manufacturability constraints that can easily consume 95% of the signals on a design with several thousand nets, significantly reducing routing flexibility; a choice between multigigabit serial signals traveling in differential pairs or tightly tuned and impedance matched parallel bus paths; and the struggle to get a design done on time utilizing a team with unique skill sets working on multiple continents. Attendees will learn more about current design trends and challenges as well as technologies emerging to cut design time while enabling increased product quality and functionality. FREE PAPER SESSION * 1-1:30 PM NEW! 040--PCI Signaling and Differential Coupling a form of slip coupling used in light machinery to regulate at pleasure the velocity of the connected shaft. See also: differential Speaker: Ray Mitchell Raymond Mitchell (born October 6, 1897 in Gilbert Plains, Manitoba; died June 15, 1984) was a politician in Manitoba, Canada. He served in the Legislative Assembly of Manitoba as a Liberal-Progressive from 1949 to 1958. , PLX Technology PLX Technology, Inc., PLX Technology, Inc. (NASDAQ:PLXT) is based in Sunnyvale, California, USA, and is currently the world’s leading supplier of PCI Express and other standard I/O interconnect semiconductors to the communications, server, storage, embedded-control, and Attendees: PCB designers and other layout professionals interested in PCI Express A high-speed peripheral interconnect from Intel introduced in 2002. Note that although sometimes abbreviated "PCX," PCI Express is not the same as "PCI-X" (see PCI-SIG and PCI-X for comparison). As a result of the confusion, "PCI-E" or "PCIe" is the accepted abbreviation. technology. Get on the PCI Express! One of the challenges of designing boards with PCI Express technology is laying out differential lanes as tightly coupled See tight coupling. pairs. In a tightly coupled pair, the two halves of the differential pair are close enough together that significant crosstalk between the two halves is created. The difficulty in layout is that any perturbations--vias, for example--must occur on both halves of the pair at the same physical location. Attendees will examine the pros and cons of tightly vs. loosely coupled See loose coupling. differential pairs as it pertains to PCI Express. The instructor will discuss both stripline and microstrip architectures as they relate to signal integrity and susceptibility to noise, and share key results and conclusions. FREE PAPER SESSION * 2-2:30 PM NEW! 041--Digital Legend Printing Speaker: Greg Blake, Printar Attendees: Fabricators and anyone interested in learning about digital legend printing on PCBs. Fabricators understand the benefits associated with adding traceability to individual bare printed circuit boards. Traditional traceability schemes add cost and time to the manufacturing process, because an extra (and manually intensive) step involving stamping, scribing, secondary screening or labeling is required. Fabricators have been challenged to accomplish the impossible, that is, implement traceability on their products while at the same time reducing manufacturing costs and production cycle times. Attendees will learn about a viable and cost-effective solution that can help fabricators accomplish both these goals. FREE TUESDAY session end here. Technical Conference course continue on Wednesday. WEDNESDAY, MARCH 29 9 AM-12 PM 050--Designing With BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. Packages Speaker: Wayne Pulliam, AMD Attendees: All PCB interconnect designers currently using or planning to use BGA packages. This presentation will cover footprint construction and placing and routing of BGAs. Attendees will learn how to calculate layer requirements for BGAs based on package information and design rules. Attendees will also learn about general design concerns and pitfalls to be avoided, including tips on placement, general routing, power distribution and assembly. A design checklist is included in the presentation for easy review of the material. This is a must for anyone wanting to design low-cost, low layer-count PCBs with BGAs. 051--Impedance Analysis and Specifications Speaker: Happy Holden, Asian Pacific Materials Attendees: PCB engineers, designers, managers and others interested in controlled impedance boards. This workshop is an introduction to controlled impedance. It explains in simple terms why controlled impedance is required. The various equations will be presented, as well as numerical solutions and field solvers. These will be compared with "as-measured" TDR TDR - time domain reflectometer readings. Resources for impedance analysis on the Internet will be detailed and the variability of impedance due to manufacturing tolerances will be explained. Finally, how controlled impedance should be documented on fabrication drawing will be illustrated. 052--Fundamentals of DFT DFT - discrete Fourier transform Speaker: Gary Ferrari, Ferrari Technical Services Attendees: PCB designers, design managers, layout technicians and others. The term "DFT" (design for test) has a different meaning depending on whether you are dealing with a bare printed board, a final assembly or a board in the field. This course will help you define DFT issues as they relate to design and cost in the fabrication and assembly processes. The discus discus /dis·cus/ (dis´kus) pl. dis´ci [L.] disk. dis·cus n. pl. dis·ci A flat circular surface; a disk. discus pl. disci [L.] 1. signs will focus on fabrication and assembly issues that affect the design of a product. These "snapshots" will fortify for·ti·fy v. for·ti·fied, for·ti·fy·ing, for·ti·fies v.tr. To make strong, as: a. To strengthen and secure (a position) with fortifications. b. To reinforce by adding material. the discussion, as well as provide you with guidelines for applying IPC (1) (InterProcess Communication) The exchange of data between one program and another either within the same computer or over a network. It implies a protocol that guarantees a response to a request. standards to your designs in order to more easily produce cost-effective, right-the-first-time PCBs. 11 AM-12 PM 053--FPGA I/0 Design Speaker: Bruce Riggins, Mentor Graphics Attendees: PCB designers and anyone interested in a more efficient process for designing FPGA (Field Programmable Gate Array) A type of gate array that is programmed in the field rather than in a semiconductor fab. Containing up to hundreds of thousands of gates, there are a variety of FPGA architectures on the market. I/Os. In this workshop, attendees will examine the FPGA I/0 design process in detail and learn to overcome the obstacles to leveraging FPGA devices during complex system design implementation. The class will also examine the FPGA I/0 design process by focusing on the common challenge of connecting a FPGA device to a modern memory device. At the conclusion of the discussion, attendees should understand that FPGA I/0 design is a team sport that can lower PCB manufacturing costs. NEW! 054--The "Ground" Myth Speaker: Bruce Archambealt, IBM Attendees: PCB designers, design engineers and anyone interested in learning more about ground. This presentation discusses the origin of the word "ground," what we really mean when we use the term, and how to optimize our designs to achieve the over all goals for our reference strategy. Ground is considered to be a zero potential region with zero resistance and zero impedance at all frequencies. But this is just not the case in practical high-speed designs. The one thing that should be remembered whenever the term ground is used is that "Ground is a place where potatoes and carrots thrive!" By keeping this firmly in mind, we can avoid many SI and EMC emissions problems. 1:30 PM-5 PM NEW! 060--Advanced HDI Engineering Speaker: Happy Holden, Asian Pacific Materials Attendees: PCB designers design and packaging engineers and others interested in HDI. As finer pitch devices all come into common use higher speed logic, the need for advanced PCBs is essential both as the board and as the package. Attendees will investigate advanced technologies for the interconnection of area array components, from ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. packaging, portable products, high-performance computing High-speed computing, which typically refers to supercomputers used in scientific research. , and telecom to dense multi-chip modules. PCB wiring modeling, design rules, materials and selection of PCB structures (blind, buried and microvias) will be examined and compared. The overview of HDI technology is particularly useful for those not familiar with this technology. 061--Designing With Your 'Thumbs" Speaker: Susy Webb, Suntron Attendees: PCB designers and layout professionals. Have you ever wished someone would compile a list all the general rules of thumb for laying out different kinds of boards? Have you ever wanted to sit with a mentor and really absorb all those little tidbits TidBITS is an award-winning electronic newsletter and web site dealing primarily with Apple Computer and Macintosh-related topics. Internet publication TidBITS has been published weekly since April 16, 1990, which makes it one of the longest running Internet publications. of information that he understands so well and uses so readily? How about a set of general guidelines for routing, planes, stackup, high speed, EMI and more? This course is a compilation of pieces of information gleaned from many technical sources and years of design work. It will provide general rules of thumb for the ways things can be done to achieve successful board designs, and give brief explanations about why they need to be done that way. NEW! 062--Introduction to Fullwave SI and EMC Modeling Speaker: Bruce Archambealt, IBM Attendees. PCB designers design engineers, and anyone interested in fullwave modeling for signal integrity and EMC. Based on the instructor's popular book "EMI/EMC EMI/EMC Electromagnetic Interference/Electromagnetic Compatibility Computational Modeling Handbook," this class provides a summary of the various modeling techniques available today, and more importantly, the strengths and weaknesses of each technique. EMI/EMC compliance and signal integrity are much more important than ever before, due to higher-speed electronics in lower-cost packages. New simulation tools allow a more accurate estimation of the EMI/EMC/SI effects on a system, before that system is ever built. This workshop will help attendees understand which modeling technique will work best for a given set of problems. Class discussion will focus on validation of modeling techniques and modeling codes, as well as standard modeling problems to allow engineers a more complete evaluation against potential vendor software packages. 3 PM-5 PM NEW! 063--E/CIT And Embedded Passives Development Speaker: Richard Snogren, Bristlecone LLC (Logical Link Control) See "LANs" under data link protocol. LLC - Logical Link Control Attendees: PCB designers, design engineers, fabricators and anyone interested in embedded passives. Who says taxpayers don't what they pay for! For the past two years, the Years, The the seven decades of Eleanor Pargiter’s life. [Br. Lit.: Benét, 1109] See : Time NAVSEA-Crane naval base A naval base primarily for support of the forces afloat, contiguous to a port or anchorage, consisting of activities or facilities for which the Navy has operating responsibilities, together with interior lines of communications and the minimum surrounding area necessary for local in Indiana has been assisting industry with emerging interconnect technology development and implementation. This program, known as Emerging Critical Interconnect Technology (E/CIT), encompasses several projects, including Embedded Passives Test Bed. Attendees will learn details about the project's activities: developing and demonstrating processes with current commercial embedded passive material sets; the design, fabrication and testing of high-frequency test vehicles for capacitor and resistor materials; the evaluation of CAD and CAM tool sets; and providing product emulator design, fabrication and reliability testing to OEMs. NEW! 064--Alternative Interconnect and Packaging Technology Speaker: Joe Fjelstad, Silicon Pipe Attendees: PCB designers, product engineers, R&D engineers, manufacturing engineers and others. Traditional approaches to electronic interconnection and packaging are being pressed to their very limits by the ceaseless demand for greater performance at lower cost with reduced power. The result is that new approaches to interconnection are becoming key elements to opening the door to meet those requirements. Future electronic designs will resemble today's, but will also redefine the design practice to capture the potential benefit lying dormant in the IC. The course is designed to help participants understand the ground shift that's necessary to make the step up to the next level of cost and performance. NEW! 065--Grounding to Control Noise and EMI Speaker: Rick Hartley, L-3 Communication, Avionics Systems Attendees: PCB designers, circuit design engineers and managers interested in learning proper circuit grounding techniques. This new short course is an introduction to the concepts needed in high-speed circuits and printed circuit design regarding grounding a circuit for proper operation, to minimize noise and EMI. The course will cover why we call it ground, the many different "things" known as ground, circuit parasitics, high-frequency currents, basic transmission line concepts, partner planes, successful PCB stackups, grounding to help eliminate EMI, splitting vs. not splitting ground (the pros and cons of each), islands in ground, ground in IC packages and connectors, grounded guard traces (the pros and cons), and RF shielding A material that prohibits electromagnetic radiation from penetrating it. Computers and electronic devices used in the home must meet U.S. government standards for electromagnetic interference. techniques. NEW! 066--Constraints-Based High-Speed PCB Design Speaker: Ralf Bruening, Zuken Attendees: CAD managers and PCB designers who are focused on high-speed digital PCB designs. The definition of design constraints within EDA (1) (Electronic Design Automation) Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board. applications has become more important with the rise in component speed and increased board complexity. While the design process is made much "safer" with these constraints, it is easy to over-constrain the design, making it impossible to complete routing and placement. This tutorial will provide an overview of the constraints used in high-speed design, and how to implement them correctly. Attendees will focus on how to judge constraints and any potential trade-offs between different constraints (as these may sometimes contradict), as well as EMC/EMI design constraints. THURSDAY, MARCH 30 9-11 AM 070--Current Flow in PCB Traces Speaker: Dung DUNG. Manure. Sometimes it is real estate, and at other times personal property. When collected in a heap, it is personal estate; when spread out on the land, it becomes incorporated in it, and it is then real estate. Vide Manure. Brooks, UltraCAD Attendees: PCB designers and anyone interested in the flow of currents in PCB traces We have heard the definition "the current is the flow of electrons." But there is considerable confusion over flow as a drift velocity The drift velocity is the average velocity (not speed) that a particle, such as an electron, attains due to an electric field. In general, an electron will rattle around in a conductor at the Fermi velocity randomly. of electrons and flow at the speed of light. Also, people wonder how electrons can flow across a capacitor or out through space (EMI). Attendees will learn what is meant by the "flow of electrons" and why that definition (which has been around for 150 years) is still valid. How can there be a propagation delay The time it takes to transmit a signal from one place to another. Propagation delay is dependent solely on distance and two thirds the speed of light. Signals going through a wire or fiber generally travel at two thirds the speed of light. Contrast with nodal processing delay. as current flows, while current is also constant everywhere along a trace, simultaneously? Learn how currents flow down transmission lines, terminated and unterminated, and down differential traces. NEW! 071--Introduction to Embedded Passives Speaker: Richard Snogren, Bristlecone LLC Attendees: Anyone interested in embedded passives, but unfamiliar with EP technology. This is a practical ground-floor workshop to introduce embedded passives to designers and others unfamiliar with the technology. This course presents market drivers, product performance benefits, and relative cost factors, as well as an overview of the state-of-the-art of embedded passive resistor and capacitor materials and processes. This highly informative workshop is an excellent starting point Noun 1. starting point - earliest limiting point terminus a quo commencement, get-go, offset, outset, showtime, starting time, beginning, start, kickoff, first - the time at which something is supposed to begin; "they got an early start"; "she knew from the for engineers and designers wanting to strengthen their understanding before launching their own embedded passives journey. Embedded passive novices should take this course before taking the more advanced class Thursday afternoon. 9 AM-12 PM NEW! 072--Best Practices in Implementing Lead-Free Assembly, Part 1 Speaker: Ron Lasky, Indium Corp. Attendees: Anyone interested in learning how to implement a lead-free assembly process. This may be the only workshop that focuses on the "how to" of implementing lead-free at your factory. It covers all of the relevant issues: PCB finishes, components, alloys and SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management processes. It also reviews actual implementations of lead-free assembly processes by Motorola and Hewlett-Packard. The workshop will finish with a section on establishing your lead-free implementation plan. The morning course includes a review of current legislation and practices in lead-free electronics assembly. We'll review the current alloys in use and why and how they were selected, as well as PCB finishes and component concerns in lead-free assembly. This is a complete class that can be taken with or without Part 2 on Thursday afternoon. NEW! 073--Materials far Lead-Free, High-Speed and High-Frequency Applications Speaker: Rick Hartley, L-3 Communications
L-3 Communications Holdings, Inc. (NYSE: LLL) is a company that supplies command, control, communications, intelligence, surveillance and reconnaissance (C3ISR) systems and , Avionics Systems Inc. Attendees: PCB designers, circuit design engineers, systems engineers and managers. In a high-speed or high-frequency circuit, performance is dependent upon a number of characteristics and variables. Several of these issues are driven from the PCB's base material characteristics. At high frequencies materials can and do have a profound impact on performance. This course will discuss all of the base materials commonly used in high-speed digital and high-frequency analog circuits (including FR-4), looking at their advantages and disadvantages, and will detail how to calculate their impact on circuit performance, hence how to choose a cost-effective material for any specific application. Attendees will also learn how each of these materials fits into today's lead-free products. 11 AM-12 PM NEW! 074--DFM, Test and Assembly Strategies Speaker: Zulki Kahn, Nexlogic Attendees: PCB designers, test engineers, layout engineers and assembly personnel. Product and technology evolution continues to play a significant and ever changing role in PCB design for manufacture (DFM), test, and assembly. DFM, test and assembly strategies must focus on the OEM's specific product needs and the required techniques and methodologies used. Attendees will learn details of each aspect of DFM, test, and assembly, as well as methods for deploying correct strategies at specific levels of products: consumer, industrial, medical and rail/aerospace. Examples of ineffective DFM, test, and assembly techniques will also be discussed. 1:30 PM-5 PM 080--High-Speed Clock Control Speaker: Robert Hanson, Americom Seminars Attendees: PCB designers, design engineers and others. This class will discuss the issues of skin effect, proximity and dielectric dielectric (dī'ĭlĕk`trĭk), material that does not conduct electricity readily, i.e., an insulator (see insulation). A good dielectric should also have other properties: It must resist breakdown under high voltages; it should not loss on transmission characteristics. Edge rate harmonics, pre-emphasis, equalization In communications, techniques used to reduce distortion and compensate for signal loss (attenuation) over long distances. , harmonic amplification, PAM 4 coding and line length vs. attenuation Loss of signal power in a transmission. Attenuation The reduction in level of a transmitted quantity as a function of a parameter, usually distance. It is applied mainly to acoustic or electromagnetic waves and is expressed as the ratio of power densities. will be covered. 081--Embedded Passives in PCBs Now! Speaker: Richard Snogren, Bristlecone LLC Attendees: PCB designers and others interested in state-of-the-art embedded passives technology. Note. This is not an introductory class. Attendees are strongly urged to take Snogren's "Introduction to Embedded Passives" Tuesday morning. This half-day workshop is an intense review of the state-of-the-art of today's commercially available embedded passive technology. The course starts with passive component functions and performance drivers to embedded passives. This leads into an in-depth discussion of today's commercial material sets; their electrical and physical characteristics; a useable selection rationale; design, test, and trim tools; and DFM guidelines for implementation. The presentation includes a detailed discussion of the relative costs of the various technologies and a methodology for cost analysis. The class concludes with a review of industry initiatives on embedded passives. 082--BF and Microwave PCB Design and Base Materials Speaker: Rick Hartley, L-3 Communications, Avionics Systems Attendees: PCB designers, engineers, technicians and managers. Ultra-high signal integrity and noise control are the keys to full functionality when designing very high frequency analog applications. This workshop is geared to help better understand the "whats" and "whys" of PCB layout and the effect of the PCB materials in high-frequency analog circuits. The course will cover impedance matching Impedance matching The use of electric circuits and devices to establish the condition in which the impedance of a load is equal to the internal impedance of the source. and balance, signal wavelength, propagation delay, critical trace length, noise, reflections, skin effect, loss tangent tangent, in mathematics. 1 In geometry, the tangent to a circle or sphere is a straight line that intersects the circle or sphere in one and only one point. , waveguides and other RF transmission lines, and microstrip vs. stripliue vs. co-planar waveguides. Other highlights include PCB stackups for RF circuits, shields and shielding, RF PCB base material properties, choosing RF base materials, RF PCB fabrication, and RF PCB assembly. NEW! 083--Best Practices in Implementing Lead-Free Assembly, Part 2 Speaker: Run Lasky Attendees: Anyone interested in implementing a lead-free assembly process. In this half-day seminar, you will learn the best practices in SMT processes for lead-free assembly, printing, placement, reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. and wave soldering. Case studies will he reviewed, including a Motorola study on implementing a lead-free process to assemble 9 million cell phones, and a Hewlett-Packard study on large board implementation. You will also learn how to establish your company's lead-free implementation plan. This is a complete class that can be taken with or without Part 1 Thursday morning. 084--Through-Hole to HDI Conversions Speaker: Gary Ferrari, Ferrari Technical Services Attendees: PCB designers, layout technicians and others. The dilemma: Add layers or go to HDI? PCB designers are often faced with the challenge of estimating how many conductive layers a particular board design would require. How many times have we run out of routing channels only to have to add an additional layer pair? This session looks at the variables that must be analyzed to predict the routing requirements of a design as well as alternative HDI structures. Design rules, performance gains and cost comparisons highlight this session. The attendee will gain a clear understanding of the critical identifiers that will lead them to an HDI design, which is a more cost-effective alternative than adding additional layers to a current through-hole design. |
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