Taiyo Yuden Co. Ltd. Unveils Advanced Bluetooth Module Based on Texas Instruments' Bluetooth Chipset.

Business Editors/High-Tech Writers

SCHAUMBURG, Ill.--(BUSINESS WIRE)--Dec. 6, 2000

Taiyo Yuden (U.S.A.) Inc. announced Wednesday a collaboration between its corporate entity, Taiyo Yuden Co. Ltd., and Texas Instruments Inc. (TI), the world leader in DSP and analog, to develop advanced Bluetooth modules based on TI's ROM-based Bluetooth chipset by year's end.

The collaboration, leveraging Taiyo Yuden's expertise in multilayered components combined with TI's high performance wireless networking solutions, will create a wide range of Bluetooth-enabled devices including notebook computers, printers and voice access points.

Recognized as a leader in the development of Bluetooth modules, Taiyo Yuden combines its expertise in multilayered components, high-frequency circuitry design, advanced assembly techniques and evaluation standards with TI's experience in wireless technologies to bring to market a high-performance Bluetooth RF module. The RF module, based on Texas Instruments' design and manufactured by Taiyo Yuden, provides output power of 20dBm and operates in the 2.4GHz band. Leveraging TI and Taiyo Yuden's integration capabilities, the module enjoys a footprint of 20 x 15 x 2.7 mm.

"Taiyo Yuden, combined with Texas Instruments, will deliver leading-edge Bluetooth solutions in order to support a wide range of OEMs looking to implement this next-generation technology," said Christian Dupont, Texas Instruments, general manager, Short Distance Wireless Business Unit, Semiconductor Group. Moreover, Taiyo Yuden will strive to advance Bluetooth by continuing to partner with enterprises that apply their unique technologies to this open specification.

Further extending its position in wireless networking, TI recently unveiled its complete, high-performance Bluetooth chipset. The chipset solution includes the industry's first 0.18 micron, ROM-based Bluetooth baseband with a fully integrated Bluetooth software stack and TI's high-sensitivity (-86 dBm) radio frequency (RF) transceiver. With this technology, TI is able to deliver a highly integrated, high-performance solution, with the price point required, to enable widespread adoption of Bluetooth.

Now in its fiftieth year, Tokyo-based Taiyo Yuden Co. Ltd. is a worldwide manufacturer of surface mount and leaded passive components, power electronics modules and power supplies. With approximately 50 percent of the worldwide market in high-frequency multilayer chip inductors used in cellular phone application, Taiyo Yuden reports annual sales of nearly (U.S.) $2 billion. Worldwide, Taiyo Yuden employs more than 14,000 people, and the company's North American affiliate, Taiyo Yuden (U.S.A.) Inc., operates sales and engineering offices in Chicago, San Jose, Calif. and San Diego County.