TSMC Announces Foundry Industry's First 0.13-Micron Prototyping CyberShuttle; First Shuttle Leaves Ahead of Schedule on Oct. 25, 2000.Business Editors/High-Tech Writers HSIN-CHU, Taiwan--(BUSINESS WIRE)--Oct. 12, 2000 Taiwan Semiconductor Manufacturing Company (NYSE NYSE See: New York Stock Exchange :TSM TSM Tivoli Storage Manager TSM Transportation System Management TSM Taiwan Semiconductor Manufacturing (stock symbol) TSM Taiwan Semiconductor Manufacturing Co. Ltd. ), the world's largest dedicated semiconductor foundry, today announced that it is the first foundry in the industry to offer prototyping of integrated circuits Integrated circuits Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. in the 0.13-micron geometry. TSMC's CyberShuttle(TM) program is already the foundry industry's most active device-prototyping program. Among the launches set through the first half of 2001, 30 percent will be run on the 0.13 process, and another 20 percent will be targeted to TSMC's 0.15 process. Earlier this year, TSMC TSMC Taiwan Semiconductor Manufacturing Company, Ltd TSMC Taiwan Semiconductor Manufacturing Corporation TSMC Traffic Systems Management Center TSMC Toll Station Management Controller TSMC Transportation Supply Maintenance Command TSMC Technical Services Manager Code became the first foundry in the industry to offer prototyping of integrated circuits in the 0.13-micron geometry, the geometry that truly enables high-performance, high-density system-on-chip designs. With CyberShuttle, engineers can validate their designs on TSMC's leading-edge 0.13-micron technology without committing to large-volume wafer starts. This dramatically reduces non-recurring engineering Non-recurring engineering (NRE) refers to the one-time cost of researching, designing, and testing a new product. When budgeting for a project, NRE must be considered in order to analyze if a new product will be profitable. charges for small wafer-volumes, enabling fast, low-cost prototyping. Designers can also use the 0.13-micron CyberShuttle to test-market devices and multiple designs. In addition, library developers can validate their intellectual property (IP) cores. The 0.13-micron CyberShuttle launches will support prototypes across the technology family, including core, high-performance, ultra-high-speed and low-power process options. In the future CyberShuttle is expected to support all TSMC technology offerings, including logic, embedded flash and mixed signal. "Mask costs typically increase with each process generation, so it is an expensive proposition for one designer to run an entire shuttle of wafers just to validate one design," said Mike Pawlik, vice president of corporate marketing for TSMC. "CyberShuttle is TSMC's answer for designers who need access to the world's most advanced semiconductor technology." TSMC's advanced 0.13-micron process delivers the foundry industry's most advanced technology for high-performance, high-density system-on-chip (SOC) designs. The process features a complete technology family, including core, high-performance, ultra-high-speed and low-power offerings. It is ideal for high-performance, high-bandwidth applications, wireless Bluetooth RF applications, and ultra-high-performance CPU CPU in full central processing unit Principal component of a digital computer, composed of a control unit, an instruction-decoding unit, and an arithmetic-logic unit. applications. The process is expected to support all TSMC technology offerings, including logic, embedded flash, embedded DRAM, and mixed signal technologies. Earlier this year, TSMC became the first foundry in the industry to announce multiple customer tapeouts at the 0.13-micron geometry. About TSMC TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading-edge foundry services. TSMC operates seven eight-inch wafer fabs (Fab 3, 4, 5, 6, TASMC TASMC Tel Aviv Sourasky Medical Center (Israel) , WSMC WSMC Willow Springs Motorcycle Club WSMC Washington State Mathematics Council WSMC Western Space and Missile Center WSMC World Space Modelling Championships WSMC Weapon System Management Code WSMC White Sands Missile Center and WaferTech), and two six-inch wafer fabs (Fabs 1 and 2). In addition, the company has begun construction of a $1.2 billion joint venture fab with Philips Semiconductor, which is scheduled to open in Singapore in 2000. TSMC recently broke ground for its first 12-inch fabs, Fab 7 in Tainan and Fab 12 in Hsin-Chu. In 2000, TSMC expects to have the capacity for nearly 3.4 million 8-inch equivalent wafers. Fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. processes offered by TSMC include CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. logic, mixed-mode, volatile and non-volatile memory, and BiCMOS. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. More information about TSMC is available through the World Wide Web at http://www.tsmc.com. Note to Editors: CyberShuttle is a trademark of TSMC. |
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