TRADE NEWS: Agilent Technologies Announces Industry's First HiSIM2.4 Model Extraction Package for DC, RF Parameters.New IC-CAP IC-CAP Integrated Circuit Characterization and Analysis Program Software Package Offers Improved CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. Modeling Efficiency, Accuracy SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif. -- Agilent Technologies This article needs sources or references that appear in reliable, third-party publications. Alone, primary sources and sources affiliated with the subject of this article are not sufficient for an accurate encyclopedia article. Inc. (NYSE NYSE See: New York Stock Exchange :A) today announced the release of the first commercially available HiSIM2.4 Model Extraction Package for DC and RF parameters for advanced complementary metal oxide semiconductor See CMOS. (integrated circuit) Complementary Metal Oxide Semiconductor - (CMOS) A semiconductor fabrication technology using a combination of n- and p-doped semiconductor material to achieve low power dissipation. (CMOS) device models. The package, for use with Agilent's Integrated Circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for Characterization and Analysis Program (IC-CAP) software platform, provides an easy-to-use, efficient and customizable method for measuring and extracting accurate DC and RF parameter values for the HiSIM2.4 model. The HiSIM2.4 device model, developed by Hiroshima University in Japan, is one of the next-generation, industry-standard CMOS compact models for circuit simulation. CMOS devices are used in a wide range of consumer products such as microprocessors, memory and communication applications. Earlier compact models, such as the BSIM BSIM Big Sur International Marathon (California) BSIM Berkeley Short-Channel IGFET Model BSIM Bachelor of Science in Industrial Management 4, were primarily developed for digital circuits and have limitations when used for analog and RF applications at smaller technology nodes. The HiSIM2.4 model calculates the device's surface potential, enabling a more accurate description of the deep sub-micron physical phenomena and resulting in a more accurate description of the internal currents and charges. "Creating accurate device-simulation models for advanced CMOS digital processes is problematic because gate accumulation and tunneling, trap-assisted tunneling, and halo effects are observed at smaller technology nodes," said Roberto Tinti, product manager with Agilent's EEsof EDA (1) (Electronic Design Automation) Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board. division. "Circuit designers can use Agilent's HiSIM2.4 Model Extraction Package to accurately predict the behavior of highly non-linear RF circuits, such as mixers, amplifiers and switches." IC-CAP provides a powerful open and flexible environment for measuring and extracting device models for a broad range of process technologies, including CMOS, BJT See bipolar. and HBT HBT Heterojunction Bipolar Transistor HBT HyCult Biotechnology (Uden, The Netherlands) HBT Hanbury-Brown-Twiss (interferometer) HBT Herring Bone Twill HBT Heflex Bioengineering Test on silicon and compound semiconductors. The HiSIM2.4 package -- the latest in Agilent's series of IC-CAP Device Model Extraction Packages -- gives designers the ability to automatically generate a complete device model for DC and RF parameters or adapt the package to meet specific modeling needs. The HiSIM2.4 Model Extraction Package provides a high-speed link to Agilent's Advanced Design System (ADS) software. ADS supports the latest version of the HiSIM2.41 model, which is necessary to generate an accurate extraction of DC and RF parameters. About IC-CAP Software Agilent IC-CAP software is a device-modeling program that delivers powerful characterization and analysis capabilities for today's semiconductor modeling processes. Providing efficient and accurate extraction of active device and circuit model parameters, IC-CAP performs numerous modeling tasks including instrument control, data acquisition, graphical analysis, simulation and optimization. It is used by semiconductor foundries and design houses to characterize foundry processes. For more information about IC-CAP, visit www.agilent.com/find/eesof-iccap. For more information about the Agilent HiSIM2.41 Model Extraction Package, visit www.agilent.com/find/eesof-hisim24. A high-resolution image of the HiSIM2.41 Model Extraction Package for IC-CAP is available at www.agilent.com/find/eesof_HiSim24_images. U.S. Pricing and Availability The Agilent HiSIM2.4 Model Extraction Package is an option with the IC-CAP 2008 Add-On 1 release. It is available now, with prices starting at approximately $22,000. About Agilent EEsof EDA Software Agilent EEsof EDA is an industry-leading provider of RF-mixed signal circuit and system-design software. The software is compatible with and is used to design the company's test and measurement equipment. Additional information about Agilent's EDA software is available at www.agilent.com/find/eesof. About Agilent Technologies Agilent Technologies Inc. (NYSE:A) is the world's premier measurement company and a technology leader in communications, electronics, life sciences and chemical analysis. The company's 19,000 employees serve customers in more than 110 countries. Agilent had net revenues of $5.4 billion in fiscal 2007. Information about Agilent is available on the Web at www.agilent.com. 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