TI DELIVERS FIRST DSP-BASED OMAP APPLICATION.

The industry's first processor to deliver the performance and power efficiency required for the emerging 2.5 and 3G wireless applications has been made available by Texas Instruments Incorporated (NYSE: TXN) (TI). Based on TI's open and programmable DSP-based OMAP architecture, the new processor will allow the next generation of mobile Internet access devices to run real-time, broadband-enabled wireless applications such as video conferencing, streaming video, Internet audio, mobile commerce, location-based services and firewall security, with the longest battery life on the market.

"Texas Instruments DSP-based OMAP applications processor makes multimedia- rich 2.5G and 3G wireless applications a reality by providing a unique combination of both performance and power efficiency," said Will Strauss, president of analyst firm Forward Concepts. "TI's dual-core architecture allows original equipment manufacturers (OEMs) and applications developers to easily deliver new real-time applications that will greatly enhance the utility of future cell phones and wireless PDAs."

TI's OMAP application processor is a dual-core architecture, based on TI's code compatible, ultra-low power TMS320C55x DSP core and a TI- enhanced ARM microcontroller. This processor, leveraging TI's leading DSP technology, enables up to four times the system performance at a given frequency and as little as one-fourth the power of competing RISC solutions.

"The importance of power efficiency and high performance are set to increase in future mobile phones, and OMAP is well positioned to meet these demands," said Katsumi Ihara, President, Sony's Personal IT Network Company. "By blending OMAP and our consumer electronics strengths, I am sure Sony can deliver unique and attractive next-generation mobile phones in a timely manner."

Featuring TI's DSP/BIOS Bridge technology, the OMAP processor partitions real-time and non-real-time software code between the DSP/RISC architecture to deliver optimal system performance and power efficiency. Real-time, multimedia rich applications such as video conferencing, streaming video, Internet audio, mobile commerce, location-based services and firewall security applications take advantage of the OMAP DSP/BIOS Bridge and TI's DSP technology to significantly enhance application quality and battery life. In addition to the DSP/BIOS Bridge, OMAP processor supports such features as LCD Control/Frame Buffer for 16 bit 1/4' VGA Display, USB Client & Host Control, MMC-SD Support, Bluetooth interface, 3.0v/1.8v Dual Voltage I/O support, Magic Gates, Memory Stick, USB, uWire, camera, and enhanced audio CODEC support.

"The next generation of 2.5 and 3G wireless handsets will bring consumers a wealth of real-time information, available anytime, anywhere. As new applications emerge to take advantage of this broadband access with multimedia functionality, TI's OMAP processor delivers the performance and power efficiency that manufacturers require for next generation real-time communications-based appliances," said Gilles Delfassy, Senior Vice President, TI Worldwide Wireless Communications. "With the introduction and availability of TI's first OMAP standard processor, TI delivers the industry's most advanced architecture that supports 2.5 and 3G handsets, as well as the emerging spectrum of mobile broadband communications-based technologies including personal digital assistants (PDA), Internet-enabled web pads, digital still cameras and Internet audio players."