TI, ARM COLLABORATE ON DSP AND MICROCONTROLLER PLATFORM FOR WIRELESS INFO APPLICATIONS.
The new Dual-Core platform, based on TI's DSP technology and ARM's 32- bit RISC microcontroller core, will be optimized to run current and future wireless cellular applications such as 2G+ and 3G.
The platform, which will be compatible with existing TI and ARM core- based solutions, will offer increased performance and low power consumption required to run real-time audio and video applications on wireless information devices. Although the new platform will primarily be designed for cellular wireless devices, it will also provide broad appeal for other digital wireless applications such as short distance wireless and wireless LAN, TI and ARM said.
"This new agreement demonstrates TI's continuous commitment to the ARM architecture for the development of leading-edge wireless communications solutions based on TI DSP and ARM's next generation processor families," says Gilles Delfassy, director of the Worldwide Wireless Communications Business Unit in TI's Semiconductor Group.
In a separate agreement, TI also licensed the ARM10 processor family to extend the capabilities of its existing DSP and Microcontroller platform for 2G wireless applications.
TI and ARM have a long history of collaboration in the wireless space going back to 1993, including the licensing of cores from the ARM7, ARM9 and ARM10 families, and continuing with the future Dual-Core collaboration announced last week.
"This collaboration is a prime example of the success of the ARM Partnership business model," says Mike Muller, executive vice president of Business Development at ARM. "TI's leading-edge DSP technology and ARM's advanced microcontroller architecture will enable OEMs to be on the leading-edge of next generation multimedia applications."