TERADYNE SELLS ITS FIRST IP750 IMAGE SENSOR TEST SYSTEM IN EUROPE TO SILICON VISION AG.

Silicon Vision AG has purchased an IP750 Image Sensor test system for multisite testing of CCD and CMOS image sensor devices. The IP750, which is based on the popular INTEGRA J750, has been designed and developed by Teradyne's Japan Division. The IP750 has the 100MHz digital tester functionalities, and the state-of-art hardware and software architecture that answer the needs for testing CCD/CMOS image sensor devices, which requires complex functional testing.

The IP750 Image Sensor test system incorporates the Windows NT(R) based IG-XL(TM) software as the test development environment which allows users for quick test program development and maintenance. Furthermore, the IP750 features the unique Integrated Parallel (IP) architecture, where complete parallel processing features are built in several different architecture levels, in both hardware and software. The IP architecture includes the DSP (Digital Signal Processing) functions of image data, which run on the PC under multi-processor, multi-threaded program execution environment.

Silicon Vision AG has selected Teradyne's IP750 test system for engineering, and as their production test solution. Marcus Verhoeven, Manager Test and Quality Control, at Silicon Vision AG said, "The IP750's broad range of image sensor instruments delivers us the most advanced technology for characterizing our new device designs, and its high-parallel test capabilities provide us the lowest cost of test. The IP750's single platform architecture for engineering and production, together with Teradyne's high level of experience, enables us to accelerate the time to market of our products. We appreciate Teradyne's understanding and superior support of our growing business requirements."

Hidenori Oishi, Image Sensor test system Product Marketing Manager said, "We are thrilled to be selected by Europe's high-end provider of CMOS image solutions, and we are happy to welcome Silicon Vision AG as a Teradyne customer. The IP750 is capable to test a large pixels and high speed CCD and CMOS image sensor at low overall cost of test. We look forward to meeting and exceeding Silicon Vision's expectations with the IP750."

The company was founded in 1996. Silicon Vision AG is a company engaged in the development, fabrication and marketing of powerful, compact, application-specific image sensors (TFA sensors). The innovative TFA Technology enables that the whole capability of crystalline ASICs (Application Specific Integrated Circuits), also inside the pixel, is used, and combines it with the superior photoelectric properties of amorphous silicon.

The electronic functions integrated on the chip do not only contain control and read out circuits, but also provide the possibility of on-chip image processing. The 3D integration allows image processing also in "Intelligent pixels", so that optical information is stored, evaluated and application-specifically processed at the same time ("system-on-chip" principle).

The TFA sensors own a lot of advantages compared to conventional devices, such as better colour recognition, improved pixel fill factor utilisation and considerable reduction of chip size. These competitive advantages provide the TFA sensors an excellent position for gaining considerable market share. With visual capabilities of artificial eyes, the TFA sensors enable many enhancements in optoelectronics.

Typical applications include digital cameras, PC and security cameras, GSM cameras, and scanners. With the extraordinary resolution capabilities of the TFA sensors (1 million grey levels!), Silicon Vision addresses high-end applications such as adaptive cruise control, production control, professional digital photography, automation technology (control of highly intelligent production robots) and the digitalisation of 35-mm cinema films.

Silicon Vision AG is headquartered in Siegen, Germany. A new production site for the company's development of future technology is currently being built in Dresden with an investment of 50 million DM, and the young team of 70 employees is set to begin the series production of up to 50 silicon wafers per day still in 2002.

Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and high performance interconnection systems for the electronics, telecommunications and Internet industries. 2000 sales were $3.0 billion and there are currently more than 10,000 Teradyne employees worldwide. Teradyne products are used to test semiconductors, circuit assemblies, telephone lines and broadband networks. Teradyne's backplane assemblies and high-density connectors are used in the communications and computing systems central to the Internet infrastructure. More than 70% of the company's business is driven by Internet growth. Teradyne's World Wide

Teradyne's Japan Division (JD) has the world's largest shipment volume and installed base in the image sensor device test market in the world. Image sensor testing requires a set of test techniques and know-how which is totally different from other semiconductor test techniques. The Japan Division has more than fifteen years of experience in this area, and because of its experienced engineering staff JD can provide total support for the volume production of the customer's new devices.