TELTRONICS SHIPS FIRST 20-20 IXP SWITCH.

Teltronics, Inc. (Nasdaq: TELT) has shipped the first of its newest product, the 20-20 IXP (1) (Internet EXchange Processor) See IXA.

(2) (Internet eXchange Point) A public junction point on the Internet that provides an on-ramp to the Internet as well as a location for carriers to exchange traffic. switch, to George Washington High School Many high schools in the United States are named after George Washington, first President of the United States, including::

George Washington High School (West Virginia) in Charleston, West Virginia
George Washington High School (Chicago) in Illinois

in Manhattan. The company acquired the 20-20 switching product line from the Harris Corporation Harris Corporation NYSE: HRS is an international communications equipment company that produces wireless equipment, electronic systems, and both terrestrial and spaceborne antennas for use in the government, defense, and commercial sectors. on June 30, 2000. The 20-20 IXP switch is a fully integrated, voice/data switching system capable of supporting the most demanding networking and stand-alone private switching system requirements To be used efficiently, all computer software needs certain hardware components or other software resources to be present on a computer system. These pre-requisites are known as (computer) system requirements and are often used as a guideline as opposed to an absolute rule. .

As part of the acquisition, Teltronics acquired Harris' 20-20 switching technology and associated products, supply contracts worldwide, the ClearView call center product line, related software, and various patents and trademarks. Teltronics has provided on-going support for certain of Harris' Communications Products Division customers by shipping spares, line cards, and MAP and LX expansions since the acquisition was completed.

Teltronics has for many years maintained a full-service contract electronic manufacturing facility. Teltronics manufacturing capabilities include circuit board assembly, surface mount, BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. , through hole technology, sub-assembly, and functional testing. The addition of the 20-20 product line has created a need for additional manufacturing capacity. Teltronics has added approximately 13,000 square feet to its existing manufacturing facility to accommodate production of the new 20-20 product line.

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Comment:	TELTRONICS SHIPS FIRST 20-20 IXP SWITCH.
Publication:	EDP Weekly's IT Monitor
Article Type:	Product Announcement
Geographic Code:	1USA
Date:	Oct 2, 2000
Words:	188
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