TEL to Begin Sales of WDF DP, Test Handler that Supports WLCSP and KGD.

Business Editors/High-Tech Writers

TOKYO--(BUSINESS WIRE)--April 12, 2004

Tokyo Electron Limited (TEL) announced Monday that it will begin sales of the WDF DP, a test handler that supports the rapidly emerging packaging and test technologies WLCSP (Wafer Level Chip Size Package) and KGD (Known Good Die).

Current WLCSP and KGD process methods require the use of expensive temporary chip carriers and/or handling equipment that is susceptible to frequent jamming due to the chip package's small profile. It has also caused low throughput and an increase in equipment maintenance expenses resulting from the variety of changeover kits required due to different package sizes. In addition, shrinking electrode pitches in solder bump and other low profile WLCSP and KGD packaging technologies are pushing the accuracy limits of current handling equipment.

Based on the concept of a wafer prober, the WDF DP test handler is capable of testing work-pieces attached to the dicing frame, before or after the dicing process. Because the handling process is wafer-based, high-speed die indexing and contact accuracy of +/-4um for X/Y axes and +/-5um for the Z axis are achieved. By eliminating the material costs and changeover times associated with package-based re-tooling, the WDF DP's wafer level handling concept surpasses current handlers in cost-effectiveness. Because it employs the production-proven wafer table technology of TEL's P-8XL wafer prober (over 6,800 units already shipped), the WDF DP offers production-proven system reliability and positioning accuracy that already meets the requirements of future narrow-pitch packages. The ability to test work pieces attached to the dicing frame means that the WDF DP is also suitable for the testing of ultra-thin wafers with thicknesses of 100um or less.

The greatest feature of the WDF DP is its flexibility. The WDF DP can be used as either wafer prober or as a dicing frame handler. This greatly improves test cell utilization on test floors that process both unframed and framed wafers. There is no need to move equipment on the test floor or change any hardware because the WDF DP automatically switches between wafer and wafer frame handling function.

TEL will begin receiving orders for the WDF DP in May 2004, aiming to sell 50 units in the first year.

About TEL

TEL (Head Office: Minato-ku, Tokyo; President & CEO: Kiyoshi Sato) established in 1963, is a leading supplier of innovative semiconductor and FPD production equipment worldwide. In Japan, TEL also distributes computer network related products and electronic components of global leading suppliers. To support this diverse product base, TEL has strategically located around the world. TEL is a publicly held company listed on the Tokyo Stock Exchange. http://www.tel.com