TDK Develops Multilayer Chip EMI Filter Arrays with ESD Countermeasure Functions.

Tokyo, Japan, Sept 26, 2006 - (JCN) - TDK Corporation has announced the development of the MEA2010LV series of multilayer chip EMI filter arrays with electrostatic discharge (ESD) countermeasure functions. Designed for mobile phones, these new chip products combine the noise countermeasure functions of earlier EMI filter arrays with functions that protect circuits from static electricity. Mass production of the compact chip, which measures 2.0 mm x 1.0 mm x 0.7 mm, is scheduled to start in November 2006.

Mobile phones frequently use EMI filters as countermeasures against noise in CD lines. In recent years, there has been an increasing need for countermeasures that prevent mobile phone malfunctions caused by ESD from the human body. At the same time, smaller phones and an ever-increasing number of functions have resulted in space limitations on circuit boards. In response, TDK developed these new filter arrays as compact components that incorporate ESD countermeasures and noise countermeasures in a single chip. One chip can provide EMI and ESD countermeasures for four signal lines and has the ESD-resistance characteristics of an 8 kV contact.

TDK developed a new material with excellent attenuation characteristics at high frequencies, something that has not been possible with previous ESD countermeasure components. By employing high-precision internal pattern formation technologies and structure optimization technologies, TDK achieved EMI reduction characteristics equivalent to the earlier products over a broad frequency range. The series consists of three products with different capacitances (10 pF, 15 pF, and 22 pF) to provide a range of noise countermeasures tailored to the application.

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