SyChip Announces WLAN6061EB Embedded Module; Next Generation Design Follows the Success of WLAN6065EB and Addresses Key Requirements for Adding Wireless Connectivity to Portable Products.

Business Editors/High-Tech Writers

PLANO, Texas--(BUSINESS WIRE)--June 14, 2004

SyChip, the leader in Radio Frequency Integrated Circuits (RFIC) and Chip Scale Modules/System in Package (CSM/SIP) modules for the wireless mobile market, today announced the launch of its WLAN6061EB, a reduced footprint, 802.11b Wireless LAN embedded module with improved capabilities in performance and flexibility.

Targeting portable communications device manufacturers looking to conserve valuable real estate, the WLAN6061EB is one-third the size (15 x 15 millimeters) of its successful predecessor, the WLAN6065EB, making it one of the smallest, complete Wi-Fi solutions available today.

"The WLAN6061EB represents another big step for SyChip in the WLAN space," said Moses Asom, Co-Founder and senior vice president of marketing and business development for SyChip. "As WLAN applications become more ubiquitous, the requirement for smaller fully integrated module designs with low power consumption and a flexible architecture become a necessity. The WLAN6061EB will address these needs and provide portable communications devices with a reliable, low power, secure and upgradeable solution that will improve their time-to-market."

The WLAN6061EB is a single plug-and-play CSM/SIP radio module for ODM/OEM's requiring Wi-Fi connectivity in portable devices such as smart phones, feature phones, personal digital assistants (PDA), gaming devices and media players. The WLAN6061EB 802.11b solution enables fast design cycles and can be assembled using standard pick and place production equipment. The WLAN6061EB supports three host interfaces: Compact Flash, Secure Digital I/O (SDIO) and Serial Peripheral Interface (SPI), thereby providing maximum design flexibility for customers.

As a next generation solution, the WLAN6061EB provides advanced user and device security in compliance with the IEEE 802.11i standard. The WLAN6061EB also enables a seamless, pin-compatible upgrade path for the 802.11g standard, which will allow devices to exchange data at speeds up to 54 Mbps. This means that customers do not have to redesign their board layout as they upgrade from 802.11b to 802.11g to support this capability. In addition, the module provides low power consumption, helping to extend battery life while leading the industry in IEEE sleep mode measurements.

The WLAN6061EB will support most popular operating systems (OS), including Windows, Linux, Palm and Symbian. The WLAN6061EB also supports certifications from Wi-Fi(R), Cisco CCX, and worldwide radio certifications and emissions requirements.

Sampling of the WLAN6061EB device with lead customers began in March of this year. Volume production of the WLAN6061EB is scheduled to begin in August.

About SyChip, Inc.

SyChip designs, develops and markets Radio Frequency Integrated Circuits and Chip Scale Modules for the wireless mobile market. The company focuses on developing RF modules that are differentiated due to proprietary integration, modular architectures, and low loss Silicon technologies. As a result of the proprietary integration, world-class RF system design, proprietary multi-function ASICs, software and smart utilities, SyChip's RF designs drastically reduce component count, offer very small footprints and are easy to integrate into a mobile device. Customers benefit by significantly reducing their time-to-market, increasing performance and improving reliability of their wireless devices. More information is available at www.sychip.com.