Staktek Enables First Intel Validation of Micron's 4GB DDR2 RDIMMs with High Performance Stakpak.

AUSTIN, Texas -- Patented Stacking Solution Delivers High-Density DDR2 in Registered DIMMs

Staktek Holdings, Inc. (Nasdaq:STAK), a major provider of high-density packaged memory stacking solutions, today announced that its High Performance Stakpak(R) has been successfully demonstrated with Intel Corporation's validation of Micron Technology's 4GB DDR2 RDIMM, as announced today by Micron.(1)

"Staktek has maintained a long-standing relationship with Micron from our earliest TSOP stacking technologies to our high-performance CSP stacking solutions today, and we are excited to be part of their latest success," said Jim Cady, President and CEO of Staktek. "Working with the leaders in memory products, as well as with industry leaders and OEMs, is critical because together we're building next-generation solutions to meet customer demands for increased levels of performance, reliability and system life cycle. Our innovative approach to stacking DDR2 memory components allows the use of standard components to create high-density products."

Based on Staktek's proprietary designs and processes for device stacking, the High Performance Stakpak is comprised of standard chip-scale packaging (CSP) devices, combined with a patented interconnection and thermal management system. This lead-free design also features controlled-impedance elements to support the signal integrity needs of the high-speed DDR2 interface.

Designed for maximum performance and reliability, the High Performance Stakpak is an ideal solution for the next generation of servers, workstations, storage systems, networking switches and routers, as well as a variety of other commercial, industrial and military applications that benefit from an increase in total memory capacity.

"Stacking CSPs for DDR2 memory modules is a significant milestone in expanding the memory capacity of industry-standard DIMMs and embedded system memory modules," said Charles Earnhart, Executive Vice President of Product Operations at Staktek. "Reliability is of paramount importance for products in this category as they must perform at the highest level for many years of service in enterprise and mission-critical applications. By improving system capabilities with our advanced stacking solutions, computer OEMs and designers can significantly extend product performance without compromising on reliability."

The High Performance Stakpak is currently available for DDR1, DDR2 with JEDEC standard ballout patterns and specialty memory devices, such as FCRAM and RLDRAM.

Information on pricing, volume production and technical specifications is available by online request at http://www.staktek.com or by e-mailing requests to [e-mail].

About Staktek Holdings:

Staktek is a major provider of IP and manufacturing services for the cost-effective miniaturization of electronic components and systems for original equipment manufacturers, silicon manufacturers, memory module manufacturers and contract manufacturers. Staktek's high-density memory stacking solutions increase operational performance by doubling, tripling, or quadrupling memory in the same physical footprint as the underlying packaged component. With an IP portfolio of more than 100 patents and patent applications pending, the company offers flexibility for customers, including outsourced manufacturing, technology licensing and custom engineering. Headquartered in Austin, Texas, Staktek employs approximately 400 people at its two world-class manufacturing locations in Austin and Reynosa, Mexico. For more information, visit http://www.staktek.com.

Staktek is a trademark of Staktek Group LP. All other products names noted herein may be trademarks of their respective holders.

(1) BOISE, Idaho, April 11, 2005 - "Micron Technology, Inc. Announces First to Receive Intel Validation of 4 Gigabyte DDR2 RDIMMs Using Stacked Components" (press release).