Staktek Announces Stacking Solution for Mobile Processors and Industry Standard Memory.MobileStak[TM] Enables Smaller Mobile Products by Combining Multiple Heterogeneous Not the same. Contrast with homogeneous. heterogeneous - Composed of unrelated parts, different in kind. Often used in the context of distributed systems that may be running different operating systems or network protocols (a heterogeneous network). Devices into a Stacked Stacked is an American television sitcom that premiered on Fox on April 13, 2005. On May 18, 2006, Stacked was cancelled, leaving five episodes unaired in the United States. The last episode aired on January 11, 2006. Module AUSTIN, Texas -- Staktek Holdings, Inc. (Nasdaq:STAK), a market-leading provider of intellectual property and services for next-generation, chip-stacking and module technologies, announced MobileStak([TM]), a chip-stacking solution that enables smaller mobile products by combining virtually any processor, controller and memory device into a single, small footprint The amount of geographic space covered by an object. A computer footprint is the desk or floor surface it occupies. A satellite's footprint is the earth area covered by its downlink. See form factor. 1. module. Now available for sampling is a MobileStak reference design that integrates the FreeScale i.MX31 processor with a Micron 64MB mobile DRAM device - both supplied in pre-tested BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. packages. The resulting 457-pin BGA module has a size of only 12.3mm x 20.3mm x 2.34mm. The MobileStak designs can integrate a variety of chip packages, as well as devices provided as bare die See bare chip. . The MobileStak is based on Staktek's intellectual property and know-how in producing folded-flex packaging. Over 2.5 million folded-flex stacks based on Staktek's technology have been produced to date. "MobileStak is an innovative form of 3D packaging, and offers the ultimate flexibility in component selection to portable product designers," said Robert Fan, Vice President and General Manager of Staktek's Corporate Strategic Business Development. "MobileStak overcomes common limitations of alternative packaging solutions, such as long lead times, aggregate die yield issues, large minimum volume commitments, and limited choice of components." "We are definitely seeing an increase in the usage of stacked processor and memory solutions across a variety of high-volume portable electronic products, such as smart phones and portable industrial equipment," said Jan Vardaman, President of TechSearch International, an Austin-based technology research firm. "The Staktek MobileStak solution lowers the barrier of entry for an even broader set of products and applications." With MobileStak, multiple, heterogeneous devices like processors, controllers and memories are assembled onto a flex circuit See flexible circuit. with a ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. interface to connect to a system motherboard Also called the "system board," it is the main printed circuit board in an electronic device, which contains sockets that accept additional boards. In a desktop computer, the motherboard contains the CPU, chipset, PCI bus slots, AGP slot, memory sockets and controller circuits for the . The flex assembly is folded, thereby stacking the devices into a single, small footprint module. The resulting BGA solution is just slightly larger than the largest of the stacked packages. Since pre-packaged, pre-tested components can be used to build the MobileStak, issues related to sourcing and handling bare-die can be minimized, and high yields can be achieved. In addition, when a very thin solution is required, bare dies can be integrated into MobileStak to reduce the overall module thickness. More information about Staktek's MobileStak solution is available online at http://www.staktek.com or by contacting sales@staktek.com. About Staktek: Staktek is a market-leading provider of intellectual property and services for next-generation, chip-stacking and module technologies for high-speed, high-capacity systems. Staktek's TSOP (Thin Small Outline Package) A very thin, plastic, rectangular surface mount chip package with gull-wing pins on its two short sides. TSOPs are about a third as thick as SOJ chips. See gull-wing lead, SOP, SOJ and chip package. and BGA memory stacking solutions increase operational performance by doubling, tripling or quadrupling quad·ru·ple adj. 1. Consisting of four parts or members. 2. Four times as much in size, strength, number, or amount. 3. Music Having four beats to the measure. n. the amount of memory in the same physical footprint as required by standard packaging technologies. Staktek's ArctiCore[TM] is a new module technology using a double-sided, multi-layer flexible circuit folded around an aluminum core and is designed for superior thermal, mechanical and electrical performance. With an IP portfolio of more than 200 patents and patent applications pending, the company offers flexibility for customers, including outsourced manufacturing, technology licensing and custom engineering. Headquartered in Austin, Texas, Staktek operates an ISO-certified manufacturing facility in Reynosa, Mexico. For more information, go to http://www.staktek.com. Staktek is a trademark of Staktek Group LP. All other products names noted herein may be trademarks of their respective holders. |
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