Staktek Announces Availability of FlashStak(TM) X-2; New Addition to FlashStak Product Family Doubles Density of NAND Flash Devices for Portable Consumer Electronics.AUSTIN, Texas -- Staktek Holdings, Inc. (NASDAQ NASDAQ in full National Association of Securities Dealers Automated Quotations U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on : STAK), a world-leading provider of intellectual property and services for next-generation, chip-stacking and module technologies, announced FlashStak(TM) X-2, a TSOP (Thin Small Outline Package) A very thin, plastic, rectangular surface mount chip package with gull-wing pins on its two short sides. TSOPs are about a third as thick as SOJ chips. See gull-wing lead, SOP, SOJ and chip package. solution that doubles the density of a single-commodity NAND (Not AND) A Boolean logic operation that is true if any single input is false. Two-input NAND gates are often used as the sole logic element on gate array chips, because all Boolean operations can be created from NAND gates. See flash memory. device in a single TSOP footprint for high-capacity applications in consumer electronics devices, such as USB Flash drives See USB drive. , mobile phones, PDAs and MP3 players. Recently, Staktek licensed this technology to Toshiba for use with its brand of NAND TSOP devices. The latest addition to Staktek's family of Flash-memory stacking products is based on its proven TSOP stacking technologies, which have been deployed in more than 190 million memory products to date. FlashStak X-2 is the only available TSOP stacking using interposer in·ter·pose v. in·ter·posed, in·ter·pos·ing, in·ter·pos·es v.tr. 1. a. To insert or introduce between parts. b. To place (oneself) between others or things. 2. technology that supports NAND devices from multiple vendors, enabling low-profile, high-density storage capacities with readily available, lower-density Flash memory products. "FlashStak X-2 is specifically developed to address the insatiable demand for high-density NAND storage applications," said Robert Fan, Vice President and General Manager of Staktek's Consumer and Emerging Markets Business Unit. "This unique combination of economic double density on demand, standard low-profile form factor and mechanical reliability appeals directly to portable electronics manufacturers as well as Flash memory providers that are meeting the pace of demand for Flash-driven devices. FlashStak X-2 has been verified with multiple devices from leading Flash manufacturers, and Staktek is currently working with multiple customers to support current and future needs with a growing portfolio of flexible solutions." "High capacity portable MP3 devices, portable media players and solid state drives will continue to drive the demand for high-density NAND solutions," said Nam Hyung Kim, Director and Principal Analyst at the market research firm iSuppli Corp., El Segundo, California
El Segundo is a city in Los Angeles County, California on the Santa Monica Bay, incorporated on January 18, 1917. The population was 16,033 at the 2000 census. . "Memory package stacking is one technology that can address the needs of these applications." FlashStak X-2 uses standard design and assembly processes consisting of a singulated printed circuit board (PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. ) interconnect placed horizontally along the edges or leads of the stacked TSOP devices. The resulting stack achieves a typical height profile of less than 2.3mm, excellent product reliability and cost efficiency while maintaining the mechanical robustness of a single TSOP device. FlashStak X-2 is available in two versions to support Flash devices with either one or two chip-enable pins -- 2CE FlashStak and 4CE FlashStak, respectively - covering all NAND flash See flash memory. densities from major manufacturers worldwide. The standard surface-mount technology Surface mount technology (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). assembly and test processes for FlashStak X-2 also support just-in-time business with a 24-hour manufacturing cycle time. Licensing and manufacturing services for the FlashStak X-2 design are now available to OEMs, memory semiconductor companies and third-party memory module manufacturers. Pricing begins at under $2 for high volumes. More information about Staktek and its chip-stacking and module technologies is available online at http://www.staktek.com or by contacting sales@staktek.com. About Staktek: Staktek is a market-leading provider of intellectual property and services for next-generation, chip-stacking and module technologies for high-speed, high-capacity systems. Staktek's TSOP and BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. memory stacking solutions increase operational performance by doubling, tripling or quadrupling quad·ru·ple adj. 1. Consisting of four parts or members. 2. Four times as much in size, strength, number, or amount. 3. Music Having four beats to the measure. n. the amount of memory in the same physical footprint as required by standard packaging technologies. Staktek's ArctiCore(TM) is a new module technology using a double-sided, multi-layer flexible circuit folded around an aluminum core and is designed for superior thermal, mechanical and electrical performance. With an IP portfolio of more than 190 patents and patent applications pending, the company offers flexibility for customers, including outsourced manufacturing, technology licensing and custom engineering. Headquartered in Austin, Texas, Staktek operates an ISO-certified manufacturing facility in Reynosa, Mexico. For more information, go to http://www.staktek.com. Staktek is a trademark of Staktek Group LP. All other products names noted herein may be trademarks of their respective holders. |
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