Spike Technologies Partners with TSMC; World's Largest Dedicated Foundry Approves Spike Technologies as a Design Center Alliance Member.Business Editors/High-Tech Writers MILPITAS, Calif.--(BUSINESS WIRE)--Sept. 30, 2002 Spike Technologies, a leading chip design services company, today announced it has joined TSMC's Design Center Alliance (DCA (1) (Document Content Architecture) IBM file formats for text documents. DCA/RFT (Revisable-Form Text) is the primary format and can be edited. DCA/FFT (Final-Form Text) has been formatted for a particular output device and cannot be changed. ) Program. As a part of the DCA, Spike now offers semiconductor OEMs and fabless companies Fabless Company The Fabless Semiconductor Association (FSA) defines fabless as follows: Fabless (without fab) refers to the business methodology of outsourcing the manufacturing of silicon wafers, which hundreds of semiconductor companies have adopted. fast and easy access to TSMC's advanced process technologies. This alliance couples Spike's extensive experience in addressing deep-sub-micron issues and their comprehensive concept-to-GDSII chip development capabilities with TSMC's 0.18-micron and below process technologies. "Our relationship with TSMC TSMC Taiwan Semiconductor Manufacturing Company, Ltd TSMC Taiwan Semiconductor Manufacturing Corporation TSMC Traffic Systems Management Center TSMC Toll Station Management Controller TSMC Transportation Supply Maintenance Command TSMC Technical Services Manager Code is a formal recognition of our ability to handle complex multi-million gate designs," said Edward Wan, CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of Spike Technologies, Inc. "Our strengths in ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. / SoC design with proven methodologies have resulted in first-silicon success for our customers." "TSMC established its Design Center Alliance to serve our customers with the most qualified, experienced design service providers in the industry," said Dr. Genda Hu, TSMC's vice president of corporate marketing. "Spike has successfully demonstrated its ability to advance design ideas from concept to GDSII GDSII Graphic Design System II , including several very complex SoCs in TSMC's advanced technologies. We are happy to include Spike Technologies as a new member in our Design Center Alliance." Spike Technologies has taped-out numerous multi-million gate designs at 0.13- and 0.18-micron technologies. The company's proven methodology ensures fast implementation with a minimum number of iterations, thus reducing the cycle time and associated costs. "Spike helped in successfully taping out our 20 million gate Network Processor ASIC targeted to TSMC 0.13 micron technology Micron Technology ("Micron") NYSE: MU is a multinational company based in Boise, Idaho, USA, best known for producing many forms of semiconductor devices. This includes DRAM, SDRAM, flash memory, and CMOS image sensing chips. ," said Perry Constantine, President and Chief Executive Officer of Silicon Access Networks, a leading communications semiconductor company. "I was impressed with the technical skills of Spike's physical design team. The tape out was on time and on budget." About Spike Technologies, Inc. Spike Technologies, Inc (www.spiketech.com) was founded in 1994 and has established itself as a chip design company specializing in ASIC design services. Spike is a preferred design partner for some of the top technology companies in the world. Spike has a state-of-the-art design center in Bangalore, India. Spike specializes in offering onsite consulting and turnkey See turnkey system. services in the areas of ASIC Design, verification & implementation. |
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