Speedline Technologies Receives Patent for Enhanced System of Post-Print 2D Inspection of Circuit Boards.

FRANKLIN, Mass. -- -- MPM BridgeVision(R) System Reduces Scrap, Rework With Effective Quantified Bridge Detection Solution--

Speedline Technologies, Inc. (http://www.speedlinetech.com) has been awarded U.S. patent #6,738,505 for its invention of the texture-based method of analyzing potential bridge defects on circuit boards during the post-print inspection process.

Introduced by Speedline in its MPM BridgeVision(R) system, the patent-winning technique assesses the quality of paste deposits utilizing texture-based image acquisition algorithms and a digital camera system. The system is integrated with the contrast-based 2D paste inspection option for the post-print review of printed deposits inside the printer.

The new technology reduces scrap and rework costs by identifying defective and borderline products and preventing them from continuing through the assembly process. The BridgeVision system is immediately available as an option on new - and as an upgrade to installed - Speedline MPM AP Excel(TM) and MPM AP HiE printers running Windows NT.

The patent was awarded for the method of using texture in the detection of paste in the region of interest between the printed deposits. "Prior to our innovation, manufacturers had to either rely on contrast-based methods, where the difference between the pasted deposit and the solder mask was insufficient for repeatable or rapid measurement, or they were compelled to purchase expensive 100-percent 3D AOI systems," said Dr. Gerald Pham-Van-Diep, Director, Advanced Development at Speedline Technologies. "With the BridgeVision system, manufacturers now have a cost-effective option that repeatedly quantifies bridge-like features and is fast enough to allow for inspection of their critical devices."

Additional features of the BridgeVision system include:

--Advanced texture-based image acquisition technology that eliminates false positive detections associated with contrast-based bridge detection systems;

--Error alarms driven by both spike penetration and percentage gap covered measurements;

--Automatic initiation of stencil cleaning based on inspection measurements; and a

--Digital camera that supports highly accurate defect assessment.

--GUI settings to allow for user defined limits for SPC control

"By quickly and efficiently identifying and preventing defective product from continuing through the assembly process, Speedline is demonstrating its technology and process leadership in reducing cost, waste, and inefficiency from the production process," Pham-Van-Diep said.

For more information, contact your Speedline representative or reach Speedline Technologies at 1-508-8520-0083 or http://www.speedlinetech.com.

About Speedline Technologies

Speedline Technologies is the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries. Based in Franklin, Massachusetts, USA, the company sells five, best-in-class brands - Accel microelectronics cleaning, Camalot dispensing systems, Electrovert wave soldering, reflow soldering, and cleaning equipment, MPM stencil and screen printing systems, and Protect global services, support, and training solutions. For more information, visit us at http://www.speedlinetech.com.

Note to Editors: High resolution photo images are available on request.