SpeedFam-IPEC Releases Suite of CMP Processes That Exceed 0.13um Requirements for Copper, Tungsten, ILD, and STI.

Business Editors/High-Tech Writers

CHANDLER, Ariz.--(BUSINESS WIRE)--Sept. 5, 2001

Momentum CMP Processes Proven for Wide Application Base,

Enable Maximum Productivity

SpeedFam-IPEC, Inc. (NASDAQ:SFAM), a leading supplier of high-throughput chemical mechanical planarization (CMP) systems for semiconductor manufacturing, has released a suite of processes of record (POR) at 0.13um for copper, tungsten, inter-level dielectric (ILD), and shallow trench isolation (STI). Developed on SpeedFam-IPEC's orbital hard platen Momentum(TM) CMP tool, the processes exceed the International Technology Roadmap for Semiconductors (ITRS) requirements and will be used at integrated circuit (IC) manufacturing fabs in the United States, Europe and Asia.

"The development of robust PORs on a range of material types at 0.13um further illustrates the universal benefits of the Momentum CMP platform," said Richard J. Faubert, SpeedFam-IPEC president and CEO. "Momentum's orbital hard platen architecture was developed to enhance our customers' productivity through increased process performance at ongoing geometry shrinks. While competing CMP tools may typically excel at one application, our latest PORs demonstrate that Momentum is uniquely suited for advanced device manufacturing for all primary CMP applications."

SpeedFam-IPEC Chief Technology Officer Saket Chadda said, "We developed these processes with a focus on total wafer metrics control. Our PORs exceed industry requirements for the 0.13um technology node, while minimizing cost of ownership for our customers."

All PORs use commercially available consumables currently employed by SpeedFam-IPEC customers around the world. "These are not single-consumable processes. This is a suite of processes from which customers may make selections based on their specific needs," Chadda said.

Each 0.13um POR is available on the Momentum platform for 200mm, as well as for 300mm, device manufacturing. Process parameters for both wafer sizes are virtually identical and deliver similar results.

"Slurry usage for 300mm wafer manufacturing is similar to that of 200mm on the Momentum platform because of Momentum's exclusive through-the-pad slurry delivery system, which results in significant savings compared to slurry usage by traditional 300mm rotational or linear CMP systems," Chadda added.

The flexibility of the Momentum tool architecture is further enhanced by process optimization features that enable new processes to be "dialed in," typically using significantly fewer wafers than traditional CMP tools. SpeedFam-IPEC's tunable Hexazone(TM) carrier technology and an innovative within-wafer non-uniformity (WIWNU) optimizer allow for simultaneous optimization of WIWNU (less than 3 percent with 3-mm exclusion) and within-die non-uniformity (WIDNU) on a single polyurethane pad. When combined with Momentum's multi-zone optical endpoint detection system, total wafer metrics control is achieved.

SpeedFam-IPEC, Inc.

SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of next-generation semiconductor devices, with the world's largest installed base. The company also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on NASDAQ under the symbol SFAM. The company's website is www.sfamipec.com.

This news release contains forward-looking statements related to our suite of CMP processes and our Momentum(TM) product. These statements are subject to known and unknown risks and uncertainties. Actual results may vary. Even if customers react positively to our suite of CMP processes, this response may not translate into sales of Momentum on the scale or in the time frame that we anticipate. Our suite of CMP processes may not continue to perform as it has up to now due to unforeseen technical problems. Current market conditions in the semiconductor industry may cause potential purchasers of Momentum to delay investment in new equipment, which could reduce demand for our suite of CMP processes. Savings from Momentum's through-the-pad slurry delivery system may be less than anticipated. See SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001, and the Quarterly Report on Form 10-Q filed on April 6, 2001, for additional risks affecting the company.