SpeedFam-IPEC Joins as Sponsor of the SRC $1M Copper IC Design Challenge.CHANDLER, Ariz.--(BUSINESS WIRE)--May 24, 1999-- SpeedFam-IPEC (Nasdaq:SFAM SFAM Society for Applied Microbiology SFAM Scenes from A Memory (Dream Theater album) SFAM Seven for All Mankind SFAM Simultaneous Frequency and Amplitude Modulation SFAM San Francisco Attorney Magazine SFAM Sister from Another Mister ), the leading supplier of chemical mechanical planarization (CMP CMP (cytidine monophosphate): see cytosine. (1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information ) systems used in the fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. of semiconductor devices, today announced it has joined contest sponsors Semiconductor Research Corporation (SRC (SouRCe) Contrast with DST, which is an abbreviation of "destination." ), Novellus Systems Novellus Systems develops, manufactures, sells, and services semiconductor equipment used in the fabrication of integrated circuits. It is a leading supplier of chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), chemical mechanical , Inc. and the UMC UMC United Methodist Church UMC United Microelectronics Corporation UMC University Medical Center UMC United Microelectronics Corp (Republic of China) UMC University of Missouri-Columbia Group in the university Cu IC design challenge. SpeedFam-IPEC has committed $50,000 in cash prizes and services to the contest that was announced on May 3, 1999. The SRC Copper IC Design Challenge provides faculty/student (graduate or undergraduate) teams from North American North American named after North America. North American blastomycosis see North American blastomycosis. North American cattle tick see boophilusannulatus. Universities with financial incentives to design a circuit or circuit subsystem (clock network, analog building block, etc.) utilizing the enhanced properties of the Cu interconnect technology to achieve significant functional or performance gains over the same circuit constructed using traditional aluminum interconnect technology. "We are excited about this contest," said Dr. Karey Holland, vice president and chief technical officer for SpeedFam-IPEC, "because it will serve to further promote the proliferation proliferation /pro·lif·er·a·tion/ (pro-lif?er-a´shun) the reproduction or multiplication of similar forms, especially of cells.prolif´erativeprolif´erous pro·lif·er·a·tion n. of Copper interconnect development. We applaud SRC, Novellus and the UMC Group for their foresightedness in issuing this design challenge to the university community." As a result of the finalization of the SpeedFam-IPEC merger on April 6, 1999, the new company is in a strong financial position to fund and execute its plans for continued growth and CMP market leadership. "SpeedFam-IPEC joining as a sponsor in the Copper IC design contest is an example of our commitment to the industry and our total focus on CMP and to copper IC technology as the next emerging technological wave," said Ralph D. Hartung, SpeedFam-IPEC's COO and president of the CMP Group. SpeedFam-IPEC, Inc. SpeedFam-IPEC, Inc. designs, develops, manufactures, markets and supports chemical mechanical planarization (CMP) systems used in the fabrication of semiconductor devices and other high-throughput precision surface processing systems. SpeedFam-IPEC's flat surface processing systems are used in the thin film memory disk media, silicon wafer and general industrial components markets. The company also markets and distributes polishing liquids (slurries), parts and consumables used in its customers' manufacturing processes. SpeedFam-IPEC, Inc. owns a 50 percent interest in each of two joint ventures, SpeedFam-IPEC Co., Ltd. (the Far East Joint Venture) and Fujimi Corp. |
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