Speaker biographies.

DAVE BRADY has over 20 years of electrical engineering and EDA experience, with both PCB and IC design disciplines. Brady helped introduce RTL design and synthesis methods for IC design and developed design methods for concurrent FPGA and PCB design. Brady is currently the integrated system design product marketing manager for Mentor Graphics. E-mail: [e-mail]

DOUGLAS BROOKS has a BSEE and MSEE from Stanford University and a Ph.D. from the University of Washington. He has held positions in engineering, marketing and general management with Hughes Aircraft, Texas Instruments and ELDEC. In 1992 he formed UltraCAD Design Inc., a service bureau in Bellevue, WA. Brooks has written numerous articles and is a frequent speaker at various conferences. He is the author of "Signal Integrity Issues and Printed Circuit Board Design." E-mail: [e-mail]

DOUG BURNS is vice president consulting services/chief scientist of Signal Integrity Software (SiSoft) Inc. Burns has over 20 years of experience leading teams in designing hardware, performing signal integrity analysis, and implementing ASICs for Honeywell, Digital, and Compaq Computer. He holds a BSEE from the University of Massachusetts and an MSEE from Northeastern University. E-mail: [e-mail]

STEVE CHIDESTEB has been at Cadence Design Systems for more than 12 years. He is currently working with a team developing board-level library annd design data management solutions. During his 25 years in the PCB design business, Chidester has worked as a schematic drafter, printed circuit designer and applications engineer. E-mail: [e-mail]

BAIL ROBERT "BOB" COX is a simulation engineer with Micron Technology Inc., where he performs signal integrity analysis, system timing analysis and timing analysis tool development to support the module product group. Cox holds patents at Micron for memory termination on modules and has patents pending. E-mail: [e-mail]

DONNA FAWCETT is senior technical leader of the Advanced PCB Technology Group for Cisco Systems. Prior to joining Cisco, Fawcett was director of engineering for Hadco Santa Clara and Zycon Corp. She holds a BS in chemistry from the University of Wisconsin. E-mail: [e-mail]

BRUCE FIHE has over 35 years of experience in the electronics industry, with the last 18 years spent in printed circuit design and design automation. He worked for companies such as P-CAD, CAD Solutions, ACCEL Technologies, PADS and Innoveda. Fihe is currently an independent training consultant specializing in skills and tools training for PCB design professionals. E-mail: [e-mail]

MICHAEL FITTS is product marketing manager for layout products at Mentor Graphics He has been involved in the design of HDI substrates since 1992. Since 1995, he has been lecturing to and consulting on advanced technology and design. He is a regular speaker at conferences worldwide and has written technical articles for various publications on advanced technology Fitts was formerly president of The Solution Fitts Inc., an electronic engineering consulting firm located near Boulder, CD. E-mail: [e-mail]

JACK R. GEIBIG is a research associate at the University of Tennesee's Energy, Environment and Resources Center. He is currectly working with the EPA and industry partners to evaluate PCB surface finish alternatives. Geibig has a BS in chemical engineering and an MS in environmental engineering. E-mail: [e-mail]

BRAD GRIFFIN is product marketing director, Silicon Design-in, of Cadence Design Systems' Silicon-Package-Board Division. He has over 13 years of experience in EDA technologies that enable the design of integrated circuit packaging and printed circuit board systems. Griffin is a graduate of Arizona State University. E-mail: [e-mail]

ROBERT HANSON, MSEE, is president of AmeriCom Test and SMT Technology Inc. As a digital design engineer at Boeing, Rockwell, Honeywell and Loral, Hanson designed and provided prototype operational analysis on many high-speed designs, including PCBs, for the AWACS, B1-B, 747-400, missiles and ground support test equipment. He currently teaches high-speed digital design courses throughout the United States, Europe and Asia. E-mail: [e-mail]

RICK HARTLEY is a senior design engineer and PCB specialist at L-3 Communication, Avionics Systems. He has 39 years of experience in the electronics industry and has dedicated the past 29 years to PCB and circuit development with emphasis on control of signal integrity and control of EMI, in both digital and RF PCBs. E-mail: [e-mail]

CHAD HAWKINSON is currently the director of high technology market strategy for PTC. He lectures at Northeastern University in high technology operations management, and holds a BS in engineering from Virginia Tech and an MBA from the MIT Sloan School of Management. E-mail: [e-mail]

HAPPY HOLDEN is the manager of Advanced Technology for Westwood Associates. He is responsible for next-generation printed circuit manufacturing strategies, advanced design tools, packaging systems and competitive analysis. Prior to joining Westwood, he was a senior consultant at TechLead Corp. and Merix. He retired from Hewlett-Packard in 1996. He holds a BS from Oregon State University in chemical engineering and an MS in computer science. He has published over 80 technical papers and contributed to three books. E-mail: [e-mail]

BARRY KATZ is president and CTO of Signal Integrity Software (SiSoft)Inc. Throughout his career, Katz has been actively involved with leading-edge high-speed design. Katz has an MSEE degree from Carnegie Mellon and a BSEE degree from the University of Florida. E-mail: [e-mail]

WALTER M. KATZ is chief scientist of Signal Integrity Software (SiSoft) Inc. Dr Katz developed SciCards, the first commercially successful autorouter. More than 20,000 copies of his tools have been used worldwide. He holds a Ph.D. from the University of Rochester and a BS from Polytechnic Institute of Brooklyn. E-mail: [e-mail]

MIKE KIRSCHNER is president of Design Chain Associates. He has 23 years of extensive cross-functional experience in all phases of the product lifecycle, from conception through production and end-of-life at both Electronics OEMs and semiconductor suppliers. Kirschner has a BSEE from Worcester Polytechnic Institute. E-mail: [e-mail]

ROY MAGNUSON is a senior scientist/engineer at Endicott Interconnect Technologies. He has over 20 years of experience in electroless and electrolytic plating at IBM and Endicott. He holds over 20 US patents and has a Ph.D. in inorganic chemistry. E-mail: [e-mail]

VOYA B. MABKOVICH is CTO of Endicott Interconnect Technologies. Markovich is interested in the development of new processes and materials for integrated actives, passives, optical and RF for advanced systems and integrated electronic packaging. He has an MS in chemistry and holds137 US patents. Email: [e-mail]

BOB MCGRATH is a high performance printed circuits design and applications engineer at Teradyne Connection Systems. He has more than 26 years of experience in PCB manufacturing, with expertise in both backplane and daughtercard technologies. McGrath has a BS in industrial technology. E-mail: [e-mail]

DENNIS NAGLE is technical marketing manager in the Silicon-Package-Board division at Cadence Design Systems. He has been involved with high-speed PCB design for over 16 years. Prior to joining Cadence, he worked at Data General Corp and earned a BSEE from WPI. E-mail: [e-mail].

DOMINIQUE NUMAKURA is founder and president of DKN Research, and punisher of EPT Newsletter. He is a 25-year veteran of the PCB and packaging material industries, and has spent much of the last decade developing advanced technologies for high-density substrates and materials. He has written numerous articles for conferences and magazines, and has authored several books on electronics packaging technologies. Numakura has a master's degree in physical chemistry and nuclear chemistry. E-mail: [e-mail]

CHARLES PFEIL is product marketing director for the Systems Design Division of Mentor Graphics. He has worked in the PCB industry since 1966, as a designer, service bureau owner and marketing and/or engineering manager at the following companies: Racal Redac, ASI, Cadence Design Systems, Intergraph, VeriBest, PADS and Mentor. Along with a focus on PCB layout, he has been involved in the specification and development of autorouters at each of these companies. E-mail: [e-mail]

MARK D. POLIKS is a senior scientist/engineer at Endicott interconnect Technologies He was a senior scientist and manager of materials and process development in the organic packaging development group at IBM Microelectronics. Poliks has a Ph.D. in materials science/polymer science and holds 26 U.S. patents. E-mail: [e-mail]

DAVID SBIROLI is a senior technical support engineer with Indium Corp, which he joined in 1993. He holds a bachelor's in mechanical engineering technology and is an SMTA Certified Process Engineer. E-mail: [e-mail]

RONALD D. SCHAEFFEB is CEO of PhotoMachining Inc. He has been involved in laser manufacture and laser materials processing for over 20 years. Schaeffer holds a Ph.D. in physical chemistry from Lehigh University. E mail: [e-mail]

RICHARD SNOGREN has a B.S. in chemistry and biology and over 35 years of experience in engineering and management. He has written a compressive technical book entitled "Handbook of Surface Preparation for Adhesion." Snogren has authored numerous papers and conducted many workshops on embedded passive technology. Snogren was co-founder and president of SAS Circuits (now Coretec Denver) Currently, he is senior staff engineer for Coretec Inc. E-mail: [e-mail]

MARIA LEET SOCOLOF is a senior scientist/senior associate at Abt Associates Inc. She previously served as a senior research associate at the University of Tennessee's Center for Clean Products and Clean Technologies. Socolof has 16 years of experience in the environmental field. She holds a BA cum laude in human ecology/environmental studies from Connecticut College and an MS in environmental health management from the Harvard School of Public Health. E-mail: [e-mail]

MARY SUGDEN is the director of educational services for Printed Circuit Training Inc. A master technician and E/M design engineer, Sugden has 30 years of experience in the design, manufacture and assembly of printed circuit boards. She formerly owned and operated The Copper Connection E-mail: [e-mail]

PER VIKLUND is a product marketing manager at Mentor Graphics responsible for embedded components, RF and advanced packaging solutions. He has more than 25 years experience with electronic design and has spent the last 18 years with design tools for advanced technology layout. E-mail: [e-mail]

RANDY WOLFF has managed the simulation team within Micron Technology's Module Products Group for the last three years. He developed Micron's IBIS and HSPICE modeling program and is currently responsible for IBIS and HSPICE model development for all DRAM products. Wolff graduated cum laude from Montana State University with a BSEE degree. E-mail: [e-mail]