Spansion Introduces Innovative Package-on-Package Solution to Reduce Wireless Device Size; Spansion's Solution Reduces Form Factors as Devices Adopt New Features.SUNNYVALE, Calif. -- Spansion LLC (Logical Link Control) See "LANs" under data link protocol. LLC - Logical Link Control , the Flash memory venture of AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips. (NYSE NYSE See: New York Stock Exchange :AMD) and Fujitsu Limited (TSE See Tokyo Stock Exchange. TSE 1. See Tokyo Stock Exchange (TSE). 2. See Toronto Stock Exchange (TSE). :6702), today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players A digital music player that supports the MP3 format, which was the audio format that started a revolution in online music downloads and distribution. All portable music players, the iPod being the most popular, support MP3 along with one or more other audio formats. . Spansion's new PoP solution vertically combines discrete logic An individual gate on a single chip. Although up to hundreds of thousands of gates are routinely placed on a single chip, discrete logic chips that contain only one or two gates are also manufactured. and memory packages for board space savings, lower pin-count, simplified system integration and enhanced performance. As a result, handset manufacturers can accommodate the growing demand for advanced features in their wireless products without having to increase their size and weight. "As wireless devices become more and more sophisticated, they require Flash memory solutions that offer increased code and data storage in a package that doesn't increase the form factor of the end product," said Amir Mashkoori, executive vice president of Spansion's Wireless Solutions Division. "Just as our initial multi-chip packages helped transform the memory industry by reducing the footprint for system memory, these new PoP solutions represent the next evolution in packaging innovation." Spansion's POP solutions measure approximately 1.4 mm in height and vertically combine a system memory package with a logic chip set package. PoP solutions enable a high degree of flexibility for designers, allowing virtually any POP-enabled memory package to be combined with any PoP-enabled logic chip set in a matter of weeks. PoP solutions also enable high yield utilization of both logic and memory, and simplified test to help reduce time-to-market and maximize cost efficiency. Spansion: Driving PoP Standards, Chipset Support Spansion takes a system-level approach to the design and delivery of Flash memory and is undertaking extensive work to foster PoP standardization. As an active member of JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device , Spansion leads the JC11.2 task group responsible for the PoP design guide generation. The company is also working to help ensure broad availability and interoperability of its PoP solutions through close working relationships with chipset vendors. "Spansion's vision for an efficient and scaleable interface architecture has been integral in driving JEDEC interface standards for package on package," said Lee Smith, senior director of business development for Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, , Inc. "We are now seeing tremendous interest from our customer base in combining Amkor's award winning PSvfBGA bottom logic package with Spansion's top memory package. We are seeing immediate benefits from this collaboration, and have extended our relationship with Spansion to include PoP roadmap alignment, joint stacking and board-level reliability studies, which promise to facilitate PoP adoption in a broader range of applications." Technical Features Spansion has the capability of delivering 8-die solutions in a 128-ball, 12 x 12 mm package with a 0.65 mm pitch. PoP's short trace lengths and low bus capacitance capacitance, in electricity, capability of a body, system, circuit, or device for storing electric charge. Capacitance is expressed as the ratio of stored charge in coulombs to the impressed potential difference in volts. also help to overcome the signal integrity and timing issues associated with emerging 133 MHz (MegaHertZ) One million cycles per second. It is used to measure the transmission speed of electronic devices, including channels, buses and the computer's internal clock. A one-megahertz clock (1 MHz) means some number of bits (16, 32, 64, etc. dual-data rate (DDR (Double Data Rate) Refers to an SDRAM memory chip that increases performance by doubling the effective data rate of the frontside bus. For more details, see SDRAM. DDR - Double Data Rate Random Access Memory ) memory solutions. Spansion's approach reduces pin-count and eliminates printed-circuit board (PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. ) routing between logic and memory, for reduced design complexity. Spansion's PoP solutions include the inherent benefits of its advanced two-bit-per-cell MirrorBit(TM) technology, including the right combination of reliability, cost, performance and density. With the future availability of the ORNAND(TM) architecture, Spansion plans to extend the benefits of MirrorBit technology and believes it will be able to respond to the demand for mass storage solutions in wireless handsets and complement application processors with an optimized code and data storage solution. Availability Samples of 12 x 12 mm and 15 x 15 mm Flash memory PoP solutions are available now for wireless phones and will vary in pricing depending on logic/memory densities and combinations. About Spansion Spansion, the Flash memory venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to developing, designing, and manufacturing Flash memory products. In fiscal 2004, Spansion's total net sales Net Sales The amount a seller receives from the buyer after costs associated with the sale are deducted. Notes: This amount is calculated by subtracting the following items from gross sales: merchandise returned for credit, allowances for damaged or missing goods, freight were approximately $2.3 billion. The company offers the broadest NOR Flash memory portfolio in the industry, for use in the wireless, automotive, networking, telecommunications and consumer electronics markets. The company's portfolio is supported by a worldwide network of advanced manufacturing facilities, system-level expertise and dedicated design support, and an unwavering commitment to our customers' success. Information about Spansion Flash memory solutions is available at http://www.spansion.com. Spansion, the Spansion logo, MirrorBit, ORNAND and combinations thereof, are trademarks of Spansion LLC. AMD is a trademark of Advanced Micro Devices, Inc. Other names used are for informational purposes only and may be trademarks of their respective owners. |
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