Solder bump inspection.IBIS (Interferometric Bump Inspection System) offers production-volume solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. bump inspection on chip carriers. Inspects and reports on the position, height and shape of solder bumps bumps a term used to describe a variety of papulonodular dermatoses in horses, including 'heat bumps', 'feed bumps', 'protein bumps', 'wheat bumps' and others. No specific disease or etiology has been assigned to the term and veterinary dermatologists wish it would disappear from use. on the die-attach side of chip carriers. Can inspect coined and non-coined solder bumps on chip carrier die attach region; scans 3,000 devices/hr. Has parallel digital signal processing See DSP. Digital Signal Processing - (DSP) Computer manipulation of analog signals (commonly sound or image) which have been converted to digital form (sampled). technology and true white light interferometry. [ILLUSTRATION OMITTED] Lloyd Doyle Doyle , Sir Arthur Conan 1859-1930. British writer known chiefly for a series of stories featuring the brilliant detective Sherlock Holmes, including The Hound of the Baskervilles (1902). Ltd., lloyd-doyle.com Booth 8247 |
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