Simplex teams with silicon foundries for deep submicron IC verification; Simplex to develop accurate interconnect models and validate with Foundry Partners.

SAN JOSE, Calif.--(BUSINESS WIRE)--June 9, 1997--Simplex Solutions, Inc. today announced its Foundry Partnerships to provide designers of deep submicron integrated circuits (ICs) with accurate interconnect models for use with the Simplex full-chip physical verification tool suite.

Simplex' initial Foundry Partners are Chartered Semiconductor Manufacturing, NEC Corporation, Taiwan Semiconductor Manufacturing Corporation (TSMC), Toshiba Corporation and United Microelectronics Corporation (UMC). All five companies are partnering with Simplex to develop Ice Cap interconnect models for their deep submicron semiconductor process technologies.

In addition, Simplex has joined the Fabless Semiconductor Association (FSA) to improve the Simplex full-chip physical verification methodology for designers of standard product ICs who use these foundries. "We welcome Simplex as one of our newest associate members," said Jodi Shelton, Executive Director of the FSA. "We support the idea of partnerships that help foundries develop and provide more data to their fabless customers and reduce the barriers to interaction between foundries and fabless companies."

Ice Cap models provide the accuracy required to verify complex, deep submicron designs. Designers use Ice Cap models with Simplex' Fire & Ice and Thunder & Lightning tool suite to perform full-chip extraction and analysis of power grids, clock skew, and reliability prior to tape-out with the foundry.

"Deep submicron design demands a new approach to verification based on highly accurate, full-chip layout extraction and analysis," said Penny Herscher, president and CEO of Simplex.

"Our partnerships with the foundries give fabless semiconductor manufacturers and chip designers the models and tool support they need to increase their confidence in tape-out. We are pleased to partner with Chartered, NEC, TSMC, Toshiba and UMC on interconnect modeling for their deep submicron processes. These companies are the leaders in the foundry business, and together we can help customers design on the leading edge of semiconductor technology while minimizing the risk of design spins."

Simplex and its Foundry Partners will validate the accuracy of the Ice Cap models in two stages: 1) using Simplex' new Barometer product to compare 3-D capacitance extracted by Fire & Ice to the results analyzed by QuickCAP, a 3-D field solver; 2) using a test chip manufactured by each company to compare measurements from their actual silicon with the 3-D capacitance extracted by Fire & Ice. Ice Cap models will be available from Simplex in Q3 1997.

Simplex Solutions, Inc. is a privately-held, electronic design automation (EDA) company pioneering the new market for deep submicron full-chip verification. The company's Fire & Ice and Thunder & Lightning products provide the EDA industry's first fully integrated solution for full-chip IC extraction and analysis.

The tools feature proprietary, context-based 3-D extraction, interconnect modeling, and analysis capabilities that enable designers to perform post-layout extraction and analysis which are essential to the final tape-out process for high-performance microprocessors, ASICs, and ASSPs. The tools are readily incorporated into EDA industry-standard, timing-driven design flows and tool environments. -0-

NOTE TO EDITORS: Fire & Ice, Thunder & Lightning, Barometer, and Ice Cap are trademarks of Simplex Solutions, Inc. QuickCAP is a trademark of Random Logic Corporation

CONTACT: Simplex Solutions, Inc.

Jan Willis, 408/953-1934

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Scott Seiden, 415/637-8212