Silterra demonstrates functional 0.13-micron SRAM.The Joint Development Project (JDP JDP Joint Development Program JDP J D Power & Associates JDP Paris, France - Issy Les Moulineaux (Airport Code) JDP Joint Defensive Planner JDP Junior Development Programme JDP Joint Development Plan JDP Jump-Diffusion Process ) between Silterra Malaysia Sdn. Bhd. and IMEC, Europe's leading independent nanoelectronics research center, has already resulted in functional SRAM See static RAM. SRAM - static random-access memory chips at Silterra's wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. facility in Malaysia. The device, an 8-megabit SRAM, was fabricated in the all-copper, foundry compatible 0.13-micron CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. process technology jointly developed by both companies. "We are thrilled that the device works so well on the very first 0.13-micron wafer we ran in our fab," said Bruce Gray Bruce Gray (born Robert Bruce Gray on September 9, 1939) is a Puerto Rican character actor. Gray was born in San Juan, Puerto Rico to Canadian parents. He was raised on the island until the age of ten when, in 1946, his parents relocated to Saginaw, Michigan then in , president and interim CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of Silterra. "The project is right on schedule with this demonstration of the phenomenal capabilities of both companies. We are now fine tuning the process, putting the customer design kit together, and we should be ready to start production in 2005 as planned." A team of Silterra and IMEC engineers has worked diligently since the JDP was launched in July of this year. Two SRAM chips, an 8-megabit and a smaller 4-megabit device, were both functional on the initial development lot processed in Silterra's fab in Kulim, Malaysia. The process, based on IMEC's 0.13-micron technology platform, is major foundry compatible and supports up to eight layers of copper wiring. "The achievement of these results with Silterra in only four-and-a-half months is simply amazing," stated Prof. Gilbert Declerck, president and CEO of IMEC. "I am very proud of the team's flawless execution, dedication and commitment to the project. The success highlights the benefits of collaboration between IMEC and the industry." The new technology at Silterra, named CL130G, will enable electronics companies to produce communication, computation and digital consumer products more cost effectively and with vastly more functionality. Silterra plans to distribute the design kit to customers in Q2 2005 and start pilot production in July. |
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