Siltec holds groundbreaking ceremony for new wafer facility.

SALEM, Ore.--(BUSINESS WIRE)--Feb. 16, 1995--Siltec Corp. held a groundbreaking ceremony recently for its new $250 million silicon manufacturing facility in Salem.

The new facilities, scheduled for completion in mid-1996, will produce 150- and 200mm silicon polished and epitaxial wafers for the domestic and worldwide semiconductor industry. The South Salem plant will ultimately employ approximately 400 people in addition to the 750 employees of the current North Salem facilities.

Roger Gertenrich, mayor of Salem, Stanly Myers, Siltec president and CEO, Shigeru Masuda, Siltec chairman of the board, and Hisahi Uchida, Siltec senior executive vice president, led the ceremony, which included brief remarks by Larry Glassock, president of the Salem Economic Development Corp. (SEDCOR). SEDCOR was instrumental in assisting Siltec during the site selection process for the new facility.

Siltec manufactures and markets silicon wafers, the strategic material from which integrated circuits and semiconductor devices are fabricated. Siltec's manufacturing operations for polished and epitaxial silicon wafers are located in Salem, with marketing and sales offices in Palo Alto, Calif. Siltec is part of the Mitsubishi Materials Corp. Silicon Division.

For more information, please contact Paula Riley, communications manager, Siltec Silicon, 2445 Faber Place, Suite 100, P.O. Box 10445, Palo Alto, Calif, 94303, 415/853-5051, fax [phone].

CONTACT: Siltec Silicon

Paula Riley, 415/853-5051