Siemens and Micro-ASI Expand Strategic Relationship; Micro-ASI Becomes North American Licensee for Polymer Stud Grid Array Technology.Business Editors and High-Tech Writers BRUCHSAL, Germany--(BUSINESS WIRE)--March 16, 2001 Siemens Electronics Assembly Systems Inc. (Siemens EAS (Electronic Article Surveillance) A security system for preventing theft in retail stores that uses disposable label tags or reusable hard tags attached to the merchandise. ), a division of Siemens Production and Logistics Systems AG, Friday concluded agreements granting Micro-ASI Inc. North American North American named after North America. North American blastomycosis see North American blastomycosis. North American cattle tick see boophilusannulatus. licenses for Siemens' Polymer Stud Grid Array (PSGA PSGA Polymer Stud Grid Array (chip scale package) PSGA Pharmaceutical Sourcing Group Americas PSGA Puget Sound Grantwriters Association (Seattle, WA) PSGA Pedal Steel Guitar Association (TM)) technology, allowing Micro-ASI to fabricate the PSGA substrate and utilize it in the assembly of electronic components. The agreement builds upon a strategic relationship, announced in May 2000, which allows the two companies work together to provide cost-effective, high-volume flip-chip manufacturing to OEMs and other electronics manufacturers. Udo Wiggermann, Siemens Electronics Assembly president of Substrate Technology said, "Micro-ASI has the expertise and, above all, the key industry relationships for working with Siemens technology to accelerate early qualification and high-volume deployment." "This agreement is an important step in deepening our relationship with Micro-ASI," said Pat Trippel, president of Siemens EAS. "Micro-ASI is a great partner to help us showcase our capabilities to a wide range of customers." Based on injection molding injection molding n. A manufacturing process for forming objects, as of plastic or metal, by heating the molding material to a fluid state and injecting it into a mold. of readily available polymer materials, PSGA(TM) technology is a compelling and innovative approach to low-cost, high-density substrates that offers improved package reliability for fine geometries. PSGA(TM) substrates are formed with integrally molded studs, which eliminate solder bumping A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip. and provide critical technical benefits. The PSGA(TM) substrate manufacturing process is simpler than that of conventional high-density substrates, providing considerable cost advantages. Under the terms of the agreement, Siemens will immediately begin technology transfer to Micro-ASI, who will implement an aggressive program to fabricate and assemble the PSGA(TM) substrate. "Our agreement with Siemens is central to our core strategy to bring revolutionary improvements in packaging and interconnect to the electronics industry," said Cecil E. (Sandy) Smith, Micro-ASI's chairman, president and chief executive officer. "We believe the Siemens PSGA(TM) technology can meet long-standing industry needs for a low-cost, high-density semiconductor substrate. We further believe that accelerating deployment of this technology as the key element of Micro-ASI's Si-Star(TM) program can, at last, dramatically enable cost-effective flip-chip applications for our customers." It is recognized that both Siemens and Micro-ASI bring deep strengths and competencies to this relationship. Each party plans to continue the development of PSGA(TM) technology. Micro-ASI, with strong, established customer relationships, is positioned to accelerate PSGA(TM) qualification by major semiconductor companies. Micro-ASI plans to use the PSGA(TM) substrate internally for its own customers, in addition to marketing PSGA(TM) substrates and PSGA(TM) assembly to external customers. Micro-ASI also plans to create new substrate improvements, wafer-interconnect solutions and derivative products based on PSGA(TM) technology as key elements of its Si-Star(TM) program. The high level of interest in the PSGA(TM) substrate shown by the semiconductor industry, coupled with Micro-ASI's systems design and manufacturing excellence, gives them great confidence that PSGA(TM) technology will meet the present and future packaging needs of the industry. About Siemens The Substrate Technology business unit of Siemens Production and Logistics Systems AG develops and provides innovative technologies and equipment for the semiconductor and PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. manufacturing industries manufacturing industries npl → industrias fpl manufactureras manufacturing industries npl → industries fpl de transformation . Technical support, sales and marketing are handled worldwide by regional sales offices or authorized distributors. As a trendsetter trend·set·ter n. One that initiates or popularizes a trend: "The Golden State, ever the trendsetter, reformed its property tax" New York. in the BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. and CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P market, Polymer Stud Grid Array (PSGA(TM)) IC package technology increases yield and reliability for back-end semiconductor and electronic products. Siemens MicroBeam(TM) Series laser machines, used in PSGA(TM) manufacturing, are also used for drilling and structuring substrates and PCBs, setting new standards in accuracy and throughput. Both technologies focus on the ongoing miniaturization min·i·a·tur·ize tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es To plan or make on a greatly reduced scale. min of electronic products such as mobile phones, portable computers, PDAs and other products in the telecommunications and data communications industry segments. About Micro-ASI Micro-ASI, Inc. is a Dallas-based high-density interconnect (HDI HDI Human Development Index (UNDP yardstick of human welfare) HDI Help Desk Institute HDI Humpty Dumpty Institute (New York, New York) HDI High Density Interconnect ) company that leverages advances in silicon, substrate, assembly and test capabilities to enable dramatic improvements in the packaging of and interconnection across semiconductors. The company emphasizes flip chip and flip-chip module semiconductor packaging. This technology, along with other intellectual properties, enables Micro-ASI to significantly enhance new and existing electronic products through performance gains, physical size reduction, thermal improvements and/or cost reductions at the module or board level. Micro-ASI provides a "one-stop shop One-Stop Shop A company or a location that offers a multitude of services to a client or a customer. The idea is to provide convenient and efficient service and also to create the opportunity for the company to sell more products to clients and customers. ," from initial design and prototyping through volume assembly and test. |
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