Siemens Introduces Smart Integrated Digital Echo Canceller for Datacom and Telecom Applications.

SAN JOSE, Calif.--(BUSINESS WIRE)--Jan. 25, 1999--

New advanced network ASIC provides digital echo canceling of both

acoustical and electrical echoes

Siemens Microelectronics, Inc., today introduced the Smart Integrated Digital Echo Canceller (SIDEC PEB 20954), a 32-channel, Application Specific Integrated Circuit (ASIC) designed to provide digital echo canceling in Mobile Switching Centers and Interworking Units for wireless or terrestrial communications.

The new 32-channel chip was developed to meet the growing demand in the data communications and telecommunications markets for lower cost, higher density, and greater flexibility digital echo canceling to link ATM and PDH/SDH networks. The echo-canceling processing and performance is fully compliant with the ITU-T G.168 (International Telecommunications Union, Telecommunication Standardization Sector).

The SIDEC provides independent and simultaneous electrical and acoustical echo canceling for up to 32 data channels, with an end echo path delay of up to 63.75 ms. The device can also be operated in a 16-channel mode where an end echo path delay of up to 127.75 ms is canceled. The SIDEC contains 2.048 MHz input and output interfaces. With channel individual selectable A-Law coding and mu-Law coding on the near end as well as on the far end side the SIDEC can be used for law conversion purposes.

The SIDEC also features a Serial Control Interface and a Microprocessor Interface that can be operated in SIEMENS/Intel or Motorola mode allowing for easy monitoring and control of internal states. This makes the SIDEC particularly well suited for telecommunications and data communications applications, including routers, switches, access concentrators, Internet access equipment, voice over IP equipment, voice over frame relay and ATM gateways, satellite transmission equipment, international exchanges, wireless base stations, and mobile switching centers.

"The SIDEC is an extremely stable and reliable hardware solution for digital echo canceling that does not require software, DSP, nor any external memory to function," said Klaus Luecke, director of product development for Data Access for Siemens Microelectronics Datacom ICs division. "The device nicely complements the QuadFALC (PEB22554 HT), the four-port Framer And Line Interface Component (FALC) Siemens introduced last year for four-port T1 or E1 solutions, and the Interworking Element IWE8 (PXB4220)."

Using low-power 3.3V technology, the part is 5V tolerant and comes in a 144-pin TQFP package.

Major features of the SIDEC include: -0-

--   Simultaneous and channel individual echo canceling of 32 channels
     with 63.75 ms end echo path delay or 16 channels with 127.75 ms
     end echo path delay.

--   Echo return loss enhancement of greater than 30 dB (ERLE),
     greater than 36 dB in steady state

--   2.048 MHz PCM input and output interfaces with selectable mu- and
     A-Law coding

--   Selectable mu- to A-Law and A- to mu-Law conversion on a per
     channel or global basis

--   Smart Non Linear Processing and various options for comfort noise
     injection

--   Flexible Microprocessor Interface (SIEMENS/Intel or Motorola
     type)

--   256 kbit/s serial control interface

--   Maskable disabling functions:

--   2100 Hz tone with/without phase reversal detection

--   2010 Hz continuity check (SS7)

--   via PCM timeslot 16-bit a, b, c, or d

--   via Microprocessor Interface or Serial Interface

--   Watchdog Timer

--   Various clock modes for 32.768 MHz and 8.192 MHz

--   0.35 mu-, 3.3 V-optimized technology

--   3.3 V I/O capability with 5.0 V input tolerance

--   Plastic Package TQFP-144

SIDEC engineering samples are available immediately, and production quantities will be available later this quarter. For quantities above 5,000, the price will be below $150.00 (US), which is equivalent to less than $5.00 per channel.

A complete hardware evaluation and tools package (EASY954), which includes a CD-ROM containing PC Evaluation Software, Device Driver Software, a User Manual, Datasheet and Application Notes, is available to assist designers in the design-in process. For more information on the evaluation kit, contact your local Siemens Sales Office or Siemens Sales Representative.

Additional information is also available by contacting the Siemens Technical Help Desk at 800-77-SIEMENS and ask for literature pack number M12P055. More information on the new SIDEC solutions can be found on the World Wide Web at http://www.siemens.de/semiconductor/sidec or at the Siemens Semiconductor Web Site at http://www.siemens.de/semiconductor.

About Siemens

Siemens' Semiconductor Group is a leading worldwide provider of innovative semiconductor solutions. Dedicated Customer Solution Centers are focused on the computer peripherals, communications, wireless, and the automotive and industrial markets with the singular goal of making Siemens customers successful in their respective markets. The comprehensive product line of Siemens Semiconductors serves a wide range of customers active in telecommunications, automotive and consumer electronics, data processing and automation. Siemens Microelectronics is its U.S. affiliate. In fiscal 1997/98, the Semiconductor Group achieved sales of $3.8 billion (DM 6.7 billion) and employed 25,000 people worldwide. The group plans to go public.

For more information, contact Siemens Microelectronics, Inc., 10950 N. Tantau Avenue, Cupertino, CA 95014; (800) 77-SIEMENS; 408-777-4500; or see http://www.smi. siemens.com.