SensoNor, an Infineon Technologies Company, Selects MEMS Equipment Package from SUSS for Production of Tire Pressure Sensors.Business Editors MUNICH, Germany--(BUSINESS WIRE)--Jan. 19, 2004 SUSS suss tr.v. sussed, suss·ing, suss·es Slang 1. To infer or discover; figure out: "I think I'm good at sussing out what's going on" Ry Cooder. MicroTec AG (ticker symbol Ticker Symbol An arrangement of characters (usually letters) representing a particular security listed on an exchange or otherwise traded publicly. When a company issues securities to the public marketplace, it selects an available ticker symbol for its securities which investors FWB (Fixed Wireless Broadband) See fixed wireless. :SMH SMH Sydney Morning Herald (Australia) SMH St Michael's Hospital SMH Shaking My Head SMH Strong Memorial Hospital SMH Sanders Morris Harris Inc. SMH Screening for Mental Health, Inc. ) today announced that SensoNor, one of the major MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. manufacturers for the global car manufacturing industry, has chosen SUSS MicroTec MEMS production systems for the manufacture of tire pressure sensors. The three systems consisting of two MA150e production mask aligners and an ABS150e volume production bond cluster will support the advanced photolithographic and high volume aligned bond processes at the facility. Tire pressure monitoring is expected to become the main driver for MEMS based pressure sensors. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. the European Commission's NEXUS report the production volume for automotive pressure sensors will increase from 80 million units in 2000 up to 230 million by 2005. A new US Traffic Safety regulation paves the way for semiconductor makers to provide automakers with 80 million chips a year in North America North America, third largest continent (1990 est. pop. 365,000,000), c.9,400,000 sq mi (24,346,000 sq km), the northern of the two continents of the Western Hemisphere. alone. Lithography and wafer-to-wafer bonding are two important steps in the MEMS fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. process. Lithography typically is the transfer of a desired pattern onto photosensitive A material that changes when exposed to light. See photoelectric. material by selective exposure to a light source. SUSS full field production mask aligners have the special merit of an extremely large depth of field, which makes them the ideal solution for the exposure of thick resist layers for high aspect ratio microsystems. All systems can be equipped with special large exposure gap optics that increases collimation collimation /col·li·ma·tion/ (kol?i-ma´shun) 1. in microscopy, the process of making light rays parallel; the adjustment or aligning of optical axes. 2. and helps to maintain steep resist side walls up to several hundred microns. The high-intensity optics of the production aligner helps to reduce process time, while allowing very high throughput. Wafer-bonding is used to join two or more micromachined wafers to form complex 3-D MEMS devices. The SUSS ABS150e production bond cluster offers superior process performance especially for challenging bonding applications, such as anodically bonded triple wafer stacks. Equipped with the unique patented SUSS laser pre-bonding option the bond cluster demonstrates a post-bond alignment potential of less than 1 micron, the highest alignment precision for multiple wafer bonding available in the market today. This high level of post-bond alignment accuracy helps boost yields and ensure device functionality. Presently, SUSS MicroTec is the leading company offering a complete range of equipment for MEMS production. The company's coating and exposure tools can be used for lithography processes. SUSS substrate and device bonders can be utilized for wafer-level and device packaging, as well as for wafer probing. About SUSS MicroTec SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Tec-DAX segment of the German Stock Exchange. All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made. |
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