Semtech Smashes Packaging and Performance Barriers to Protecting Low-Voltage ICs.

Business Editors & High-Tech Writers

NEWBURY PARK, Calif.--(BUSINESS WIRE)--Nov. 13, 2001

Flip-Chip Package Slashes Size While a 3.3V Operating Voltage Guards

Sensitive Circuits Against ESD Damage and Latch-Up

Semtech Corp. (Nasdaq:SMTC), a leading supplier of analog and mixed-signal semiconductors for communications, computers and industrial equipment, today announced the SFC3.3-4 Low-Voltage ChipClamp(TM) TVS (transient voltage suppressor) array, a breakthrough ESD-protection device for portable and low-operating-voltage electronics.

The SFC3.3-4 is the industry's first TVS device to marry a 3.3V working voltage with space-saving flip-chip packaging to yield unprecedented mechanical and electrical performance. The quad array -- the device protects four separate data or I/O lines -- squarely matches the key design requirements of a wide range of low-voltage and portable electronic products, including cellular phones, personal digital assistants, notebook and handheld computers, portable instrumentation, pagers, "smart" cards and MP3 players.

According to Tom Dugan, Semtech's director of Marketing for Protection Products, "The IC technology trend to 0.18-um and below CMOS fabrication has forced down operating voltages while increasing susceptibility to damage from electrostatic discharge (ESD) and other voltage transients. Breakdown voltages for gate oxides are approaching a few tens of volts while tight space and low-power requirements continue to challenge equipment designers.

"Fortunately, the SFC3.3-4, with its unique combination of 3.3V operating voltage and flip-chip packaging, gives designers an effective answer to these vexing dilemmas."

In particular, by offering a quad array in a 0.50-mm-pitch flip-chip package, the SFC3.3-4 gives equipment designers the ultimate space-saving technology for meeting tight mechanical constraints. Compared with an SC70 package, which requires 9mm(2) of board space, the 1-x-1.5-mm flip chip occupies only 1.5mm(2). It also has a lower profile -- less than 0.65 mm -- and needs no underfill material.

Moreover, the flip-chip design offers improved electrical performance over conventional packages by virtually eliminating parasitic inductance caused by leads and bond wires. The result is virtually none of the voltage overshoot that acts to raise clamping voltage.

As for its industry-leading 3.3V operating voltage, the SFC3.3-4 achieves this key value without making any performance compromises. Competitive circuit protection devices use a reverse avalanche phenomenon and suffer performance degradations below 5V operating voltages. Specifically, where Zener diodes and other pn-junction devices introduce unacceptably high junction capacitance and leakage currents, the SFC3.3-4, a complex four-layer nppn device built on Semtech's proprietary EPD fabrication process, maintains superior clamping performance and DC electrical characteristics.

For example, because the EPD process and four-layer structure clamp uses a "punchthrough" rather than avalanche mechanism, the SFC3.3-4 produces a "snap-back" effect that lowers the clamping voltage across the device. The process and structure underlying SFC3.3-4 also account for its 0.05-uA (typical) reverse leakage current. In comparison, the reverse leakage current of low-voltage silicon avalanche devices can reach several milliamps, making them a poor choice for battery-operated equipment.

The SFC3.3-4 is rated to handle 200W of peak pulse power (tp=8/20 usec.) and meets the protection requirements of IEC 61000-4-2 for ESD, IEC 61000-4-4 for EFT, and for IEC 61000-4-5 for lightning.

Key Features of the SFC3.3-4:

-- 6-bump, 0.5-mm-pitch flip-chip package occupies 1.5 mm(2) and stands less
than 0.65 mm high

-- Lack of leads and bond wires virtually eliminate parasitic inductance

-- 3.3V working voltage protects the most sensitive low-voltage ICs

-- EPD process makes no performance compromises at low voltage

-- "Snap-back" effect initially reduces clamping voltage as current rises

-- Meets IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge)

Pricing and Availability

The SFC3.3-4 Low-Voltage ChipClamp(TM) TVS (transient voltage suppressor) quad array is available now in tape and reel format. Pricing starts at $0.34 each for production quantities of 10,000 pieces.

About Semtech

Semtech Corp. is a leading supplier of high-quality analog and mixed-signal ICs for power management, over-voltage and transient protection, human interface devices & system management, high-performance applications and advanced communications. Publicly traded since 1967, Semtech is listed on the Nasdaq National Market under the symbol SMTC.

For more information, contact Semtech Corp. at 652 Mitchell Road, Newbury Park, CA 91320; phone [phone]; e-mail to [e-mail]; or visit its Web site at www.semtech.com.