Semtech Integrates ESD Protection with EMI/RFI Filter on Space-Saving Flip Chip; Small Chip Scale Package Offers Huge Enhancements for Portable Device Design.

Business Editors & High-Tech Writers

NEWBURY PARK, Calif.--(BUSINESS WIRE)--Oct. 24, 2001

Semtech Corp. (Nasdaq:SMTC), a leading supplier of analog and mixed-signal semiconductors for communications, computers, and industrial equipment, today announced the newest member of the ChipClamp(TM) family of flip chip protection products.

The new SFC2282-50 is a combination T-filter and TVS (transient voltage suppressor) device in an ultra-slim 6-bump, 0.5 mm pitch package, ideal for use in portable and handheld electronics where space is at a premium.

The SFC2282-50 provides bi-directional filtering of EMI/RFI signals and offers effective suppression of electrostatic discharge (ESD) in excess of 15kV (air discharge) and 8 kV (contact discharge), per IEC 61000-4-2, Level 4. The product features dual-stage TVS protection to optimize clamping characteristics and thereby minimize stress on protected circuits. Each device protects two data or I/O lines and can replace up to 10 discrete components in a compact package that measures less than 1.5 x 1.0 x 0.65 mm.

The combination TVS/T-filter device features solid state silicon-avalanche technology for maximum protection of delicate CMOS semiconductors. The SFC2282-50 also offers exceptionally low insertion loss in the pass band (0 to 10 MHz) and good attenuation at high frequencies (100 MHz to 3 GHz). Furthermore, the flip chip design of this transient voltage suppressor significantly minimizes parasitic inductance, which virtually eliminates voltage overshoot from leads and interconnecting bond wires.

"Flip chip design marries significant board space savings and increased component reliability," stated Tom Dugan, Director of Marketing for Protection Products at Semtech. "The small footprint and performance-enhancing capabilities of this TVS device offer engineers great advantages for designing cell phones, PDAs, handheld PCs, smart cards, digital cameras, and most other portable electronics. Engineers can finally add capabilities and functions to their product lines without compromising device size or product performance."

The state-of-the-art design of the SFC2282-50 combines several manufacturing techniques and completely eliminates all external plastic packaging as well as intermediate level connectors and interposer layers with significant benefits: improved performance, maximum board space savings, and minimal manufacturing costs.

Key Features of the SFC2282-50

-- Flip Chip bi-directional EMI/RFI filter with integrated ESD protection to
IEC 61000-4-2, Level 4

-- Compact chip scale (1.5 x 1.0 x 0.65 mm maximum) requires minimal board
space

-- Replaces up to 10 discrete components to allow greater product functionality


-- Solid-state silicon avalanche technology for superior clamping performance
and product reliability

-- Eliminates need for underfill material

-- Low pass band insertion loss (0 to 10 MHz)

-- Dual-line protection and filtering; 100 MHz to 3GHz attenuation

-- 5V TVS working voltage

-- Devices are compatible with current pick and place equipment and assembly
methods

Pricing and Availability

The SFC2282-50 is sampling now, with production units scheduled for availability in early December 2001. Pricing for the device is $0.33 per unit in 10,000-unit quantities. Products are delivered in EIA 481 standard, tape and reel packaging.

About Semtech

Semtech Corporation is a leading supplier of high-quality analog and mixed-signal ICs for power management, over-voltage and transient protection, human interface devices & system management, high-performance applications, and advanced communications. Publicly traded since 1967, Semtech is listed on the NASDAQ National Market under the symbol SMTC. For more information, contact Semtech Corp. at 652 Mitchell Road, Newbury Park, CA. 91320; phone [phone]; e-mail to [e-mail]; or visit its Web site at www.semtech.com.