| Title |
Author |
Type |
Date |
Words |
| Laser system with an integrated, automated film transport and positioning device for the coating of silicon wafers. |
|
|
Feb 7, 2013 |
151 |
| Gartner: worldwide WFE expenditure to drop 13.3% YoY in 2012. |
Liu, Ken |
|
Oct 17, 2012 |
412 |
| Panasonic to close U.S. plant making silicon wafers for solar panels. |
|
|
Mar 26, 2012 |
126 |
| Panasonic to close U.S. plant making silicon wafers for solar panels. |
|
|
Mar 26, 2012 |
126 |
| Influence of injection velocity and joint geometry on quality of insert molding. |
Lin, Chung-Chih |
Report |
Feb 1, 2012 |
5091 |
| TSMC plans to build 18-wafer fab in Central Taiwan Science Park. |
Liu, Philip |
Brief article |
Dec 13, 2011 |
273 |
| Wafer price hikes to impact Taiwan's chip making industry. |
Liu, Ken |
Brief article |
Jun 22, 2011 |
246 |
| Sino-American Silicon, Wafer Works plan bold expansions this year. |
Liu, Ken |
Brief article |
Jun 22, 2011 |
223 |
| TSMC to double output capacity in five years. |
Liu, Ken |
Brief article |
May 6, 2011 |
289 |
| Taiwan's electronics industry may suffer market downturn earlier on supply chain crisis. |
Liu, Ken |
|
Apr 18, 2011 |
319 |
| UMC scrambles to boost 300mm capacity to combat nearest competitor. |
Liu, Ken |
Brief article |
Apr 13, 2011 |
205 |
| Quake-induced orders inundate top two foundries' capacities. |
Liu, Ken |
Brief article |
Apr 8, 2011 |
245 |
| Formosa Sumco pledges not to cash in on quake crisis. |
Liu, Ken |
Brief article |
Mar 16, 2011 |
226 |
| Merrill Lynch forecasts wafer shortage to hit chipmakers in May. |
Liu< Ken |
Brief article |
Mar 16, 2011 |
248 |
| Sino-American Silicon pursues ambitious goal. |
Liu, Ken |
Brief article |
Jan 31, 2011 |
275 |
| Walsin Lihwa to build a mega solar-energy silicon wafer plant in Jiangsu. |
Liu, Philip |
Brief article |
Jan 14, 2011 |
254 |
| TSMC, Tsinghua University co-announce feats on 65nm teamwork. |
Liu, Ken |
Brief article |
Dec 17, 2010 |
270 |
| Green Energy to open crystalline silicon wafer factory. |
Liu, Ken |
Brief article |
Nov 11, 2010 |
225 |
| TSMC starts building one more huge 300mm fab. |
Liu, Ken |
Brief article |
Jul 19, 2010 |
357 |
| Top two silicon foundries expect to see record April revenue. |
Liu, Ken |
Brief article |
May 6, 2010 |
232 |
| UMC issues bright Q2 biz forecast. |
Liu, Ken |
Statistical data |
May 4, 2010 |
451 |
| TSMC ships 600,000 AEC-Q100 verified 0.25-micron EmbFlash wafers. |
Liu, Ken |
Brief article |
Apr 26, 2010 |
223 |
| Nanya, Inotera accelerate cutting-edge process project. |
|
Brief article |
Jan 28, 2010 |
185 |
| Optimize the process of slicing of silicon wafer with neural networks and determination of cutting force. |
Pascu, Nicoleta; Dobrescu, Tiberiu; Simion, Ionel; Dobre, Daniel |
Report |
Jan 1, 2010 |
1120 |
| Electrolytic in-process dressing (ELID) grinding for silicon wafers. |
Dobrescu, Tiberiu Gabriel; Ghinea, Mihalache; Enciu, George; Nicolescu, Adrian Florin |
Report |
Jan 1, 2010 |
1431 |
| TSMC closes 32nm project to focus on 28nm bid. |
|
Brief article |
Nov 26, 2009 |
179 |
| UMC snaps up orders from TSMC's major customers. |
|
Brief article |
Oct 29, 2009 |
290 |
| Sino-American silicon inundated with orders. |
|
|
Sep 3, 2009 |
351 |
| Hon Hai ventures into LED wafer ingot segment. |
|
Brief article |
Jun 18, 2009 |
205 |
| Analysis of mold insert fabrication for the processing of microfluidic chip. |
Shen, Y.K.; Lin, J.D.; Hong, R.H. |
Technical report |
Jan 1, 2009 |
4470 |
| Engineering of Si[O.sub.2]-Au-Si[O.sub.2] sandwich nanoaggregates using a building block: single, double and triple cores for enhancement of near infrared fluorescence. |
Xu, Shuping; Hartvickson, Shay; Zhao, Julia Xiaojun |
Technical report |
Apr 1, 2008 |
392 |
| Surface grinding method of silicon wafers. |
Dobrescu, Tiberiu; Anghel, Florina |
Report |
Jan 1, 2008 |
1154 |
| Flattening process of silicon wafers. |
Dobrescu, Tiberiu; Dorin, Alexandru |
Report |
Jan 1, 2008 |
1392 |
| Pressure-Sensitive Adhesive Film For The Surface Protection Of Semiconductor Wafers And Method For Protection Of Semiconductor Wafers With The Film: No. 7,201,969; Masafumi Miyakawa, Makoto Kataoka, Jun Nakashima, Yoshihisa Saimoto, Shinichi Hayakawa and Yasuhisa Fujii, assignors to Mitsui Chemicals, Inc., Tokyo, Japan. |
|
|
Jun 1, 2007 |
335 |
| A study to improve wafer productivity and quality in semiconductor slicing. |
Dobrescu, Tiberiu |
Report |
Jan 1, 2007 |
1751 |
| A study of silicon wafers plane lapping process. |
Dobrescu, Tiberiu; Dorin, Alexandru |
Report |
Jan 1, 2007 |
1661 |
| PPS runs rings around semiconductor wafers. |
Blanco, Alice |
Brief Article |
Aug 1, 2004 |
290 |
| Light scattering by metallic particles on silicon wafers. (General Developments). |
|
Brief Article |
Jul 1, 2002 |
285 |
| THICKNESS VARIATIONS MEASURED IN SILICON WAFERS. |
|
Brief Article |
May 1, 2001 |
188 |
| NIST CONDUCTS WAFER FLATNESS WORKSHOP. |
|
|
Mar 1, 2001 |
154 |
| TAKING THE TEMPERATURE OF RAPID THERMAL PROCESSING (RTP) SYSTEMS. |
|
Brief Article |
Sep 1, 2000 |
295 |
| Stalled Thai Wafer Fab May Be Revived. |
|
|
Sep 27, 1999 |
156 |
| Mosel Vitelic Plans 12-inch Wafer Fabs. |
|
|
Jul 8, 1999 |
222 |
| Motorola & Infineon Claim Better Yields With 300mm Wafers. |
|
|
Jun 10, 1999 |
180 |
| MEMC Announces Third Quarter 1998 Results. |
|
|
Oct 27, 1998 |
1755 |
| MEMC Announces Intention to Raise $200 Million in Equity Capital Through a Private Placement and a Rights Offering. |
|
|
Oct 22, 1998 |
683 |
| Ibis Technology Corporation Awarded $762,000 in New Development Contracts. |
|
|
Oct 7, 1998 |
484 |
| TTI Bolsters Management Staff; Silicon Wafer Distributor Expands Staff as They Ramp Up in Reclaim and Virgin Test Wafer Markets. |
|
|
Oct 6, 1998 |
247 |
| Silicon Genesis Corporation and LG Siltron Inc. Enter Into Process Services Agreement; Companies Forge Alliance to Accelerate Commercial SOI Acceptance. |
|
|
Oct 5, 1998 |
483 |
| Lucent Selects Applied Materials' Epi Centura for SiGe Applications; Applied Materials' Epi Technology Preferred for Fast-Growing New Silicon Germanium Market. |
|
|
Oct 2, 1998 |
292 |
| Solitec Wafer Processing Inc. Acquires Wafer Track Business From Ultratech Stepper East Inc. |
|
|
Oct 1, 1998 |
524 |
| MEMC Receives an Additional $100 Million Credit Facility and Extends Outstanding Debt With VEBA AG. |
|
|
Oct 1, 1998 |
443 |
| VEBA AG Says News Report On MEMC Sale "Not True". |
|
|
Sep 24, 1998 |
173 |
| TTI Names New Executive Vice President of Silicon 2000 Division. |
|
|
Sep 17, 1998 |
251 |
| MEMC Comments On Third Quarter Outlook. |
|
|
Sep 15, 1998 |
608 |
| Mattson Technology Teams With Sandia National Laboratory On Leading Edge RTP Technology Development. |
|
|
Sep 9, 1998 |
756 |
| Ramtron and Cubic Produce Improved Mass Transit Smart Card Chip; Innovative Chip Design to Fuel Wide Usage of New Fare Collection Technology. |
|
Article |
Jul 24, 1998 |
308 |
| RELTEC Selects Broadcom's VDSL Silicon for Its DISC*S Broadband Access Equipment. |
|
|
Jul 13, 1998 |
778 |
| NWL Proudly Unveils Fab 3 with a Grand Opening in South Wales; Fab 3 to Provide 0.35 um 8-Inch Wafers From New Facility. |
|
|
Jul 10, 1998 |
359 |
| NWL Proudly Unveils Fab 3 with a Grand Opening in South Wales; Fab 3 to Provide 0.35 um 8-Inch Wafers From New Facility. |
|
Article |
Jul 10, 1998 |
359 |
| Altera Receives First WaferTech Production Silicon |
|
|
Jul 6, 1998 |
772 |
| IMP Wafer Foundry CD-ROM Introduces Eight New Process Technologies. |
|
|
Jun 24, 1998 |
518 |
| Major Laboratory Evaluates Isonics' Isotopically Pure Silicon-28 Wafers For Next-Generation Circuit Applications |
|
|
Jun 23, 1998 |
593 |
| Conductus Concludes Successful Manufacturing Development Program |
|
|
May 28, 1998 |
663 |
| Applied Materials Announces Voluntary Separation Plan. |
|
|
May 26, 1998 |
281 |
| Comdisco To Provide $56 Million Equipment Management Program for Micronas Intermetall's Semiconductor Facility in Freiburg, Germany. |
|
|
May 7, 1998 |
582 |
| HP Selected as Key Test Provider for Siemens and Motorola "Semiconductor300" Joint Venture. |
|
|
May 4, 1998 |
570 |
| Kopin Corporation Reports First Quarter 1998 Financial Results. |
|
|
Apr 29, 1998 |
1092 |
| Ibis Technology Names Okmetic of Finland as Exclusive Sales Representative for Europe. |
|
|
Apr 24, 1998 |
391 |
| MEMC Announces First Quarter 1998 Results. |
|
|
Apr 23, 1998 |
1343 |
| Lam Announces Fiscal 1998 Third Quarter Results. |
|
|
Apr 16, 1998 |
1069 |
| SpeedFam International Receives Multiple Orders for Polishing Tools From Wacker Siltronic. |
|
|
Apr 14, 1998 |
519 |
| NWL and Artisan Components To Develop Process Perfect Memories and Cell Libraries for Foundry Customers. |
|
|
Apr 6, 1998 |
416 |
| Ibis Technology Awarded $1,040,000 in SIMOX-SOI R&D Contracts. |
|
|
Mar 16, 1998 |
515 |
| XeTel Corporation Announces Ultra Chip Scale Package Board Assembly. |
|
|
Mar 3, 1998 |
402 |
| Intel Breaks Ground on its First 300mm Chip Development Plant. |
|
|
Feb 18, 1998 |
335 |
| NWL Partners to Bring Advanced Digital Logic and Mixed Signal Technology for Complete IC Manufacturing Solutions. |
|
|
Feb 16, 1998 |
471 |
| Ibis Technology Corporation Expected to Report a Net Loss Per Share of $0.29-$0.33 for Fourth Quarter 1997. |
|
|
Feb 3, 1998 |
846 |
| Cree Research Announces $2.4 Million Supply Pact With Asea Brown Boveri AB |
|
|
Jan 8, 1998 |
447 |
| Therma-Wave Receives Fab-Wide Order From European Foundry; Newport Wafer-Fab, Ltd. Purchases Therma-Wave Metrology Equipment. |
|
|
Jan 6, 1998 |
378 |
| Cree Research Acquires Industrial Site |
|
|
Nov 21, 1997 |
637 |
| ATTENTION BUSINESS/TECHNOLOGY EDITORS: |
|
|
Nov 20, 1997 |
638 |
| Eaton Thermal Processing Systems Announces Sale of Rapid Thermal Processors to Implant Center, Inc. |
|
|
Nov 10, 1997 |
912 |
| MEMC and China Sijia Semiconductor Materials Dedicate the First Silicon Wafer Joint Venture in China. |
|
|
Oct 17, 1997 |
501 |
| Cree Research Reports Record First Quarter Revenues |
|
|
Oct 16, 1997 |
863 |
| Atmel Announces Joint-Venture Fab in Malaysia |
|
|
Oct 14, 1997 |
326 |
| MEMC Comments on Preliminary Third Quarter Results and Near-Term Outlook. |
|
|
Oct 14, 1997 |
565 |
| Asyst Technologies Announces Major Order From Europe's Largest Pure Wafer Foundry. |
|
|
Oct 2, 1997 |
565 |
| Cyril F. Hannon Appointed Chief Executive Officer of Wafer Technology, Malaysia. |
|
|
Sep 25, 1997 |
481 |
| Electroglas Receives Major Order from Motorola for Multiple Horizon 4090 Systems; Flagship probers become wafer probing solutions at three Motorola facilities. |
|
|
Sep 16, 1997 |
459 |
| Electroglas, Inc. Added to S&P SmallCap 600 Index. |
|
|
Sep 3, 1997 |
274 |
| Ibis Technology Corporation Completes Warrant Redemption and Receives $10.2 Million From Warrant Exercise. |
|
|
Sep 2, 1997 |
278 |
| NEC Electronics Adds $120 Million in Capital Equipment |
|
|
Aug 28, 1997 |
787 |
| Acorn Announces Quarterly Results for Its Subsidiary |
|
|
Aug 21, 1997 |
336 |
| Symbios Logic to Phase Out Wafer Fabrication Manufacturing in Fort Collins. |
|
|
Aug 20, 1997 |
661 |
| Cree Research Reports Fourth Quarter and Fiscal 1997 Year End Results Fourth Quarter Earnings are $0.06 per Share Annual Revenues Increase 92% |
|
|
Aug 4, 1997 |
793 |
| IBIS Technology Corporation Announces Redemption of Warrants. |
|
|
Jul 24, 1997 |
385 |
| MEMC Reports Second Quarter Net Sales Of $245.8 Million. |
|
|
Jul 24, 1997 |
1576 |
| National Semiconductor Invests $100 Million to Expand 8-Inch Wafer Facility in Santa Clara, Calif. -- Company to Add 100 Jobs in Silicon Valley. |
|
|
Jul 22, 1997 |
375 |
| TelCom Semiconductor Announces Record Second Quarter 1997 Financial Results. |
|
|
Jul 17, 1997 |
967 |
| Komatsu Silicon Celebrates Grand Opening of Hillsboro, Ore. Project. |
|
|
Jul 16, 1997 |
507 |
| MEMC to Invest $250 Million on 300mm Facilities in Japan and the United States. |
|
|
Jul 11, 1997 |
734 |
| SierraTherm Inc. and Advanced Control Enterprises Enter Into a Joint Agreement for the Supply of Control Systems for Semiconductor Fabrication Equipment. |
|
|
Jul 8, 1997 |
335 |
| SubMicron Systems Corporation Announces Retirement of John Traub from Remaining Positions |
|
|
Jul 3, 1997 |
131 |
| YieldUP International Awarded Equipment Order From Exsil. |
|
|
Jun 27, 1997 |
432 |
| Mitsubishi Silicon American a leader in CFC elimination. |
|
|
Jun 27, 1997 |
319 |
| YieldUP International announces patent on cleaning and drying technology for use in Semiconductor and other related industries. |
|
|
Jun 25, 1997 |
572 |
| Ibis Technology receives order to supply Bookham Technology, Ltd. with SIMOX-SOI wafers for ASOC Active Integrated Optical Circuits. |
|
|
Jun 24, 1997 |
912 |
| UMC offers customers volume production at 0.35 micron technology; Xilinx producing industry's fastest 5V FPGA at UMC Fab. |
|
|
Jun 16, 1997 |
427 |
| TSMC and Avant! Join in Qualifying Star-Hspice for VDSM Designs |
|
|
Jun 10, 1997 |
773 |
| AMCC announces two-phase, $70-million manufacturing facility expansion that will add world-class bipolar/BiCMOS production line. |
|
|
Jun 9, 1997 |
1055 |
| Seagate Announces Expansion of Wafer Fabrication Operations in Springtown, Northern Ireland |
|
|
Jun 6, 1997 |
479 |
| IBIS Technology Corporation sees lower than anticipated second quarter results. |
|
|
Jun 6, 1997 |
332 |
| Cree Research Exhibits Emerging Semiconductor Technology at Lehman Brother's High Technology Expo |
|
|
May 28, 1997 |
472 |
| IBIS Technology Reports SIMOX-SOI Technology is Adopted in Commercial Product. |
|
|
May 21, 1997 |
631 |
| Acorn Announces Results for Two Subsidiaries |
|
|
May 15, 1997 |
412 |
| Newport Wafer-Fab Hires COO; Steve Della Rocchetta Provides Extensive Foundry Experience. |
|
|
May 13, 1997 |
411 |
| Electroglas to open new East Coast customer service facility. |
|
|
May 7, 1997 |
382 |
| Ibis Technology Corporation announces first quarter results. |
|
|
May 2, 1997 |
618 |
| MEMC reports first quarter net sales of $222.3 million; Net sales increase 10% over 1996 fourth quarter. |
|
|
Apr 23, 1997 |
1220 |
| Therma-Wave delivers metrology systems to Samsung's first U.S. fab. |
|
|
Apr 22, 1997 |
367 |
| Subsidiary of Semiconductor Packaging Materials Co. Announces Initiation of Silicon Wafer Reclaiming in Singapore and Investment of EDB Ventures 2 Pte Ltd |
|
|
Apr 17, 1997 |
329 |
| ATMI's Epitronics unit promotes three; New responsibilities reinforce customer partnering strategy. |
|
|
Apr 9, 1997 |
557 |
| Ibis Technology announces availability of SIMOX-SOI wafer product -- ADVANTOX. |
|
|
Apr 7, 1997 |
695 |
| Chartered Semiconductor, HP to establish joint-venture company; joint-venture company to be called Chartered Silicon Partners; Singapore Economic Development Board part of joint venture. |
|
|
Apr 3, 1997 |
814 |
| Acorn Announces Results for Two Subsidiaries |
|
|
Apr 1, 1997 |
549 |
| A.D. TECH Reports Fourth-Quarter and Year-End 1996 Results; 1996 EPS $0.37 vs. 1995 EPS $0.00. |
|
|
Mar 27, 1997 |
350 |
| Applied Materials Ships Industry's First 300mm Production System; 300mm RTP System Sets Industry Milestone. |
|
|
Mar 20, 1997 |
544 |
| Lattice Semiconductor to Provide Funding for Seiko Epson Semiconductor Fab |
|
|
Mar 17, 1997 |
544 |
| TSMC announces resignation of Don Brooks; Dr. Morris Chang to take reins as president May 1. |
|
|
Mar 4, 1997 |
648 |
| Silicon Valley Group Partners With NASA to Advance State-of-the-Art Reflective Optics; Program leverages U.S. government and industry expertise to enhance semiconductor technology. |
|
|
Mar 3, 1997 |
551 |
| Ibis Technology Corporation announces promotions of three key professionals. |
|
|
Feb 20, 1997 |
467 |
| Microchip Technology garners ISO 9001 Certification. |
|
|
Feb 11, 1997 |
439 |
| Applied Materials Receives $105 Million Order from Korea's Anam Industrial Co. Ltd. |
|
|
Feb 11, 1997 |
392 |
| Ibis Technology Corporation announces fourth quarter and year end results; Revenues increase sharply; Net loss narrows. |
|
|
Feb 5, 1997 |
973 |
| MEMC announces fourth quarter 1996 results. |
|
|
Jan 27, 1997 |
1579 |
| Novellus Systems reports record results. |
|
|
Jan 20, 1997 |
1062 |
| Silicon Valley Group Reports First Quarter Results. |
|
|
Jan 20, 1997 |
749 |
| ASM Introduces Epsilon 2000 Epitaxial Reactor |
|
|
Jan 14, 1997 |
299 |
| Semiconductor Packaging Materials Co. Announces That It Expects Fourth Quarter Results to be Below Analyst Expectations |
|
|
Dec 30, 1996 |
288 |
| QUICKLOGIC and TSMC partner for 0.5 micron Amorphous Silicon Process. |
|
|
Nov 25, 1996 |
768 |
| PRI wins $4.5-million contract from Mitsubishi Silicon America Corp. |
|
|
Nov 19, 1996 |
403 |
| Mitsubishi Silicon America Announces New Vice Presidents. |
|
|
Nov 6, 1996 |
453 |
| Semitool Reports Fourth Quarter And Fiscal 1996 Results |
|
|
Oct 31, 1996 |
1104 |
| Ibis Technology Corporation announces third quarter results. |
|
|
Oct 30, 1996 |
883 |
| Silicon Valley Group Reports Fourth Quarter Results. |
|
|
Oct 28, 1996 |
1027 |
| Construction of MEMC KULIM begins immediately. |
|
|
Oct 17, 1996 |
604 |
| MEGA Set to Deliver Systems to Silicon Houses |
|
|
Oct 14, 1996 |
409 |
| Corporate Profile for Chartered Semiconductor Manufacturing, dated Oct. 11, 1996. |
|
|
Oct 11, 1996 |
348 |
| Cree Research Signs $2.7 Million License Agreement With Shin-Etsu and Sumitomo |
|
|
Oct 8, 1996 |
655 |
| FSA 1996 Wafer Demand Survey Revised; Fabless Companies Growth Still Expected to Exceed Industry Average. |
|
|
Sep 27, 1996 |
534 |
| JMAR Industries reports affirmation of wafer supply and technology agreement with IMP. |
|
|
Sep 25, 1996 |
336 |
| Credence Systems Announces Delivery of Seven New SC 212 Systems to Lucent Technologies for Testing DSPS, ASICS. |
|
|
Sep 18, 1996 |
378 |
| TI and Anam of Korea To Cooperate on Advanced Logic Wafer Manufacturing |
|
|
Sep 5, 1996 |
493 |
| Cadence And TSMC Join On Deep Submicron Models |
|
|
Aug 26, 1996 |
810 |
| Ibis Technology Corporation announces sharply increased revenues in fiscal 1996 second quarter and first half; expanded manufacturing capacity anticipated in FY96 second half and FY97 as new Ibis 1000 SIMOX implanters come on line. |
|
|
Jul 30, 1996 |
993 |
| ACORN ANNOUNCES QUARTERLY RESULTS FOR TWO SUBSIDIARIES |
|
|
Jul 22, 1996 |
366 |
| Advanced Silicon wafers for low power applications; ATMI's Epitronics & Nippon Steel announce North American and European Delivery of 8-inch SIMOX wafers. |
|
|
Jul 16, 1996 |
465 |
| Ibis Technology board member to receive nation's highest technology honor; President Clinton honors Dr. Peter Rose with 1996 National Medal of Technology. |
|
|
Jul 9, 1996 |
405 |
| Siltec Corp. Changes Name to Mitsubishi Silicon America Corp. |
|
|
Jul 1, 1996 |
268 |
| INTEGRATED SILICON SOLUTION, INC. ANNOUNCES JOINT VENTURE WITH TSMC |
|
|
Jun 25, 1996 |
464 |
| Analog Devices joins TSMC in joint venture to meet escalating customer demand for System ICs, DSPs and GSM chipsets; New fab marks the next wave of growth and strengthens commitment to customers; $1.2 billion US-based site will output over 30,000 8" wafers per month. |
|
|
Jun 25, 1996 |
689 |
| SEMICONDUCTOR PACKAGING MATERIALS CO., INC. ANNOUNCES MAJOR EXPANSION AT AMERICAN SILICON PRODUCTS |
|
|
Jun 24, 1996 |
229 |
| Ibis Technology Corporation receives $450K Phase II SBIR contract from the USAF Phillips Lab for improved commercial SIMOX wafers development. |
|
|
Jun 19, 1996 |
400 |
| ST ASSEMBLY TEST SERVICES BREAKS GROUND ON NEW FACILITY |
|
|
Jun 12, 1996 |
392 |
| Challenge of 300 mm Semiconductor Wafer Transition "A Matter of Economics, not Technology," SEMI Says; SEMI 300 mm Initiative Team Reports on Global Meetings Designed to Define the Issues Involved in $14 Billion Transition. |
|
|
Jun 11, 1996 |
887 |
| MEMC joint venture -- Taisil Electronic Materials Corp. produces Taiwan's first 200mm silicon wafers. |
|
|
May 30, 1996 |
429 |
| ACORN ANNOUNCES RESULTS FOR TWO SUBSIDIARIES |
|
|
May 8, 1996 |
325 |
| Motorola's MOS 12 operations awards Supplier of the Year. |
|
|
May 1, 1996 |
427 |
| Fusion Systems Corporation announces record revenues and operating profits for the first quarter of 1996. |
|
|
Apr 22, 1996 |
883 |
| CHARTERED SEMICONDUCTOR WINS ROCKWELL 'GOLDEN WAFER' AWARD |
|
|
Apr 10, 1996 |
446 |
| Xilinx Announces Resignation of President. |
|
|
Apr 9, 1996 |
442 |
| Knights Technology and Keithley Instruments form a strategic alliance to develop fab yield enhancement systems. |
|
|
Apr 8, 1996 |
621 |
| IBIS TECHNOLOGY BEGINS TRADING ON THE NASDAQ NATIONAL MARKET. |
|
|
Apr 4, 1996 |
136 |
| Philips Semiconductors Links with TriQuint in Wafer Sourcing Deal; Products Will Serve Portable Phone, Wireless LAN, High-Speed Transmission Equipment and Satellite Communications Markets. |
|
|
Apr 4, 1996 |
555 |
| IBIS TECHNOLOGY CORPORATION PUBLIC OFFERING OF COMMON STOCK DECLARED EFFECTIVE. |
|
|
Apr 3, 1996 |
269 |
| New Business Unit Structure Positions Novellus for Corporate Growth; SC Capital Equipment Leader Reorganizes to Meet Market Opportunity. |
|
|
Apr 1, 1996 |
681 |
| Mitel completes acquisition of ABB Hafo. |
|
|
Mar 29, 1996 |
444 |
| ATMI Partners With Wafer Technology Ltd.; Epitronics Subsidiary Gains Product Line and European Access. |
|
|
Mar 25, 1996 |
391 |
| Philips Semiconductors Links With TriQuint in Wafer Sourcing Deal; Products Will Serve Portable Phone, Wireless LAN, High-Speed Transmission Equipment, and Satellite Communications Markets. |
|
|
Mar 25, 1996 |
578 |
| MEMC ELECTRONIC MATERIALS, INC. AND KHAZANAH NASIONAL BERHAD HOLDINGS ANNOUNCE INTENTION TO FORM JOINT VENTURE |
|
|
Mar 18, 1996 |
263 |
| Motorola Qualifies ASM's A400 Clustered, Vertical Furnace; Orders System for MOS-15 at Research Triangle Park. |
|
|
Mar 18, 1996 |
453 |
| Electroglas Announces Stock Repurchase Program. |
|
|
Mar 14, 1996 |
161 |
| Siltec Corp. President and CEO Announces Resignation. |
|
|
Mar 14, 1996 |
359 |
| Ibis Technology Corporation announces filing of Registration Statement for public offering of Common Stock. |
|
|
Feb 9, 1996 |
299 |
| Tencor Instruments' Fourth Quarter Net Income Climbs 82 Percent to Record $18.8 Million on Revenues of $95.9 Million. |
|
|
Feb 8, 1996 |
1006 |
| Applied Materials to hold conference call in conjunction with the first quarter 1996 earnings announcement. |
|
|
Feb 1, 1996 |
254 |
| CMD Reports Continued Growth. |
|
|
Jan 23, 1996 |
1306 |
| Lam Expands Vancouver Presence To Meet Growing Customer Demand. |
|
|
Jan 22, 1996 |
334 |
| SubMicron Systems receives over $10 million in new orders. |
|
|
Jan 8, 1996 |
224 |
| IBIS TECHNOLOGY RECEIVES INITIAL PURCHASE ORDERS FOR SIMOX WAFERS FOR LOW POWER TECHNOLOGIES PROJECT. |
|
|
Dec 19, 1995 |
446 |
| LOGIC Devices Announces New Wafers Supply Relationship. |
|
|
Dec 19, 1995 |
279 |
| VLSI Technology Manufacturing Facility Fully Operational After Fire Incident. |
|
|
Dec 15, 1995 |
100 |
| Motorola Selects Electroglas for COM1 Wafer Fab; State-of-the-art application drives need for advanced probing capabilities. |
|
|
Dec 12, 1995 |
435 |
| Microchip Technology announces billion dollar Chandler, Ariz. expansion. |
|
|
Dec 6, 1995 |
651 |
| Ibis Technology Corporation completes $2 million financing transaction with financing for Science International, Inc. |
|
|
Dec 5, 1995 |
416 |
| ATMEL STARTS 8-INCH EUROPEAN FAB FACILITY |
|
|
Dec 4, 1995 |
637 |
| Koll to provide facility management services to Quantum and M/A-COM in Colorado Springs. |
|
|
Nov 28, 1995 |
240 |
| ACORN ANNOUNCES RESULTS FOR THREE PRINCIPAL PORTFOLIO COMPANIES, INCREASE IN NET ASSET VALUE |
|
|
Nov 21, 1995 |
743 |
| Philips' Newest Fab Expansion Nets Large Order for Applied Materials Systems; Order Covers Implant, PVD, CVD and Etch Technologies. |
|
|
Nov 8, 1995 |
443 |
| U.S. District court finds Applied Materials' epitaxial patents valid and infringed by ASM; Use of ASM's reduced pressure Epsilon One reactors properly enjoined. |
|
|
Nov 7, 1995 |
285 |
| Ibis Technology Corp. announces third quarter results. |
|
|
Oct 31, 1995 |
828 |
| TYLAN GENERAL WINS SUPPLIER CERTIFICATION AWARDS FOR TWO DIVISIONS FROM LAM RESEARCH CORPORATION |
|
|
Oct 4, 1995 |
528 |
| SUMITOMO SITIX SELECTS PHOENIX FOR NEW 8-INCH POLISHED WAFER PLANT |
|
|
Sep 21, 1995 |
351 |
| International Rectifier begins production in new wafer fab. |
|
|
Sep 15, 1995 |
210 |
| ISSI Announces Additional Capacity for 1996 and 1997 and Manufacturing Joint Venture. |
|
|
Sep 13, 1995 |
278 |
| Applied Materials announces intention to issue up to $267 million in notes. |
|
|
Aug 24, 1995 |
246 |
| TOWER SEMICONDUCTOR LTD. SIGNS LONG-TERM CONTRACT WITH HEWLETT-PACKARD COMPANY; Three Year Agreement Strengthens Strategic Alliance Between the Companies. |
|
|
Aug 24, 1995 |
331 |
| ACORN ANNOUNCES QUARTERLY RESULTS FOR THREE SUBSIDIARIES |
|
|
Aug 15, 1995 |
437 |
| AG Associates announces partial release of lock-up. |
|
|
Aug 10, 1995 |
278 |
| MEMC corrects weighted average shares used in computing earnings per share for Three Months Ended 6/30/95; should be 21,490,942. |
|
Correction Notice |
Aug 1, 1995 |
762 |
| ALBEMARLE SELLS ELECTRONIC MATERIALS BUSINESS |
|
|
Jul 31, 1995 |
213 |
| MEMC Electronic Materials reports 129 percent increase in second-quarter net income. |
|
|
Jul 31, 1995 |
768 |
| Dataquest Foresees 52 Percent Growth for Wafer Fab Market in 1995; Growth Continues into 1996. |
|
|
Jul 20, 1995 |
430 |
| Fluoroware Inc. is first to license 300mm Auto-Kinematic Cassette technology from Asyst Technologies Inc. |
|
|
Jul 12, 1995 |
539 |
| Lam Achieves Breakthrough Deposition on 300MM Wafers. |
|
|
Jul 10, 1995 |
758 |
| Applied Materials introduces family of Centura-based Dielectric CVD products; Dielectric CVD Group unveils Centura Platform Migration Strategy, introduces new "DxZ" process chamber. |
|
|
Jul 10, 1995 |
527 |
| FSI INTERNATIONAL, INC. SELLS ADDITIONAL 412,500 SHARES OF COMMON STOCK |
|
|
Jul 10, 1995 |
177 |
| APPLIED MATERIALS ANNOUNCES COMPLETION OF A PUBLIC OFFERING OF 3,500,000 SHARES OF COMMON STOCK. |
|
|
Jul 5, 1995 |
229 |
| Applied Materials expands oxide etch family with system for isotropic "wine glass" and bulk strip processes; RPS Centura takes isotropic dielectric etch processes to level needed for next generation applications. |
|
|
Jun 29, 1995 |
643 |
| PRI Automation wins $2.6-million order from Wacker Siltronic; Leading supplier of semiconductor factory automation systems to automate interbay wafer handling for major silicon wafer producer. |
|
|
Jun 28, 1995 |
320 |
| FastMAN Interactive Planning System Selected by Industry Leaders in U.S., Canada, and Europe; LAM Research, Harris Farinon, Proform Fitness Products, and The Trane Company Join Trend To Interactive Planning Systems. |
|
|
Jun 14, 1995 |
714 |
| Water adsorption at a polyimide/silicon wafer interface. |
Wu, Wen-Li; Orts, William J.; Majkrzak, Charles J.; Hunston, Donald L. |
|
Jun 1, 1995 |
2992 |
| Asyst unveils semiconductor industry's first 300mm wafer handling solution and its plan to openly license the revolutionary technology. |
|
|
Jun 1, 1995 |
1148 |
| IMP Offers Wafer Fabrication Services to Fabless Semiconductor Start-up Companies; Silicon Venture Partners program addresses entrepreneurs in the analog and mixed-signal IC market. |
|
|
May 23, 1995 |
868 |
| MEMC ELECTRONIC MATERIALS FILES FOR INITIAL PUBLIC OFFERING. |
|
|
May 18, 1995 |
271 |
| TI AND MEMC TO CREATE JOINT VENTURE TO MANUFACTURE SILICON WAFERS |
|
|
May 17, 1995 |
499 |
| SEMATECH to use TYECIN Systems' TestSim/X for Semiconductor Enterprise Modeling; Complete system of advanced simulation tools to support SEMATECH's recently announced packaging, assembly and test thrust. |
|
|
Apr 20, 1995 |
325 |
| Standard Microsystems Corp. announces record revenues and net income for the fourth quarter and for fiscal 1995. |
|
|
Apr 12, 1995 |
1941 |
| FSA announces first ever fabless wafer demand forecast; demand to increase 75% by 1997. |
|
|
Apr 11, 1995 |
952 |
| Tencor Instruments files registration statement with SEC for offering of common stock. |
|
|
Apr 4, 1995 |
330 |
| ATMEL EXPANDS SAN JOSE OPERATIONS |
|
|
Mar 17, 1995 |
278 |
| CONDUCTUS DEMONSTRATES SHARPEST THIN-FILM FILTER FOR USE IN WIRELESS COMMUNICATIONS SYSTEMS |
|
|
Mar 14, 1995 |
517 |
| LSI LOGIC MAKES EQUITY INVESTMENT IN CHARTERED SEMICONDUCTOR |
|
|
Mar 6, 1995 |
546 |
| Applied Materials Inc. files suit for misappropriation of intellectual property. |
|
|
Feb 23, 1995 |
289 |
| Siltec holds groundbreaking ceremony for new wafer facility. |
|
|
Feb 16, 1995 |
215 |
| Applied Materials announces record revenues of $506 million and record new orders of $740 million; revenues up 49 percent, net income up 76 percent, record backlog of $950 million. |
|
|
Feb 14, 1995 |
1255 |
| Electroglas reports record fourth quarter results. |
|
|
Feb 2, 1995 |
866 |
| MAXIM REPORTS 35th CONSECUTIVE QUARTER OF INCREASED EARNINGS. |
|
|
Feb 2, 1995 |
1049 |
| SUBMICRON SYSTEMS CORPORATION ANNOUNCES LOWER THAN EXPECTED RESULTS - 1995 Sales and Earnings Objectives Not Affected -. |
|
|
Jan 27, 1995 |
364 |
| Tencor Instruments selected by SEMATECH to lead automated defect classification project. |
|
|
Jan 24, 1995 |
625 |
| Applied Materials files suit against Novellus for patent infringement; use of patented TEOS-based, plasma-enhanced CVD process focus of lawsuit. |
|
|
Jan 24, 1995 |
298 |
| COGNEX AND ELECTROGLAS ENTER MULTI-MILLION DOLLAR AGREEMENT. |
|
|
Jan 20, 1995 |
313 |
| FSI INTERNATIONAL RECEIVES ISO 9001 REGISTRATION |
|
|
Oct 12, 1994 |
459 |
| LATTICE SEMICONDUCTOR TO ADVANCE SEIKO EPSON $42 MILLION FOR SUB-MICRON WAFERS |
|
|
May 16, 1994 |
360 |
| WESTERN DIGITAL SIGNS LETTER OF INTENT TO SELL WAFER FAB TO MOTOROLA INC.; CLOSING TARGETED BY YEAR-END |
|
|
Oct 25, 1993 |
482 |
| MICROCHIP TECHNOLOGY ANNOUNCES PURCHASE OF ADDITIONAL WAFER FABRICATION FACILITY |
|
|
Oct 8, 1993 |
383 |
| STATE AWARDS $450,000 IN LOANS TO BETHLEHEM FIRM |
|
|
Sep 28, 1993 |
264 |
| Chinese nanocheckers. |
|
Brief Article |
Nov 7, 1992 |
269 |
| Getting the bugs out of packaging. |
|
|
Mar 21, 1987 |
217 |
