Sarcon Will Use Sarnoff MEMS Facility For Uncooled Infrared Sensor Array Production.Business Editors KNOXVILLE, Tenn. & PRINCETON, N.J.--(BUSINESS WIRE)--Sept. 19, 2002 320 X 240 IR Array for IR Cameras and Temperature Measurement Systems Is 10X to 20X More Sensitive, Lower in Cost than Other Detectors Sarcon Microsystems of Knoxville today announced that it has awarded the production contract for its unique high-performance 320 X 240 microelectromechanical (MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. ) infrared sensor array to Sarnoff Corporation of Princeton, NJ (formerly RCA See RCA connector and video/TV history. Laboratories). The Sarcon uncooled IR array offers 10X to 20X the sensitivity of other competing detectors, at a lower cost. Customers for the device include manufacturers of thermal "see-in-the-dark" cameras and temperature sensors. Sarcon plans to deliver complete IR detector engines with associated ROIC ROIC Return On Invested Capital ROIC Return On Investment Capital ROIC Readout Integrated Circuit ROIC Resident Officer In Charge ROIC Regional Office Implementation Committee electronics for evaluation to OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and customers by the end of the first quarter of 2003. Commercial production is scheduled for the fourth quarter of 2003. The company will set up an IR detector engine packaging facility on Sarnoff's Princeton campus, for single-site production of complete component-level detectors. Sarcon expects that the high performance and low cost of the detector, based on MEMS microcantilever technology, will let OEMs expand existing markets and create new ones for their products. "This agreement marks our next step toward bringing high-performance, low-cost uncooled detector engines to the market," said Don Perrine, President & CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of Sarcon. "The transition to Sarnoff's fab for the MEMs processing has been extraordinarily efficient due to the ongoing R&D relationship between our two companies. We look forward to continuing our successful relationship to produce high quality infrared detector engines." According to Frank Pantuso, Vice President and General Manager at Sarnoff, the company's foundry will complete development of the 320 X 240 chips, then ramp up to full production. "We believe our knowledge of the Sarcon technology and our nearly thirty years of experience in making high-performance CCD CCD in full charge-coupled device Semiconductor device in which the individual semiconductor components are connected so that the electrical charge at the output of one device provides the input to the next device. and CMOS image sensors gives us a real advantage in moving these devices into production," he said. "We're gratified grat·i·fy tr.v. grat·i·fied, grat·i·fy·ing, grat·i·fies 1. To please or satisfy: His achievement gratified his father. See Synonyms at please. 2. that Sarcon has chosen us as its manufacturing partner." MEMS Process Lowers Costs Infrared imaging systems are used to monitor overheating Overheating An economy that is growing very quickly, with the risk of high inflation. in equipment and many manufacturing processes, and in Security and Surveillance night-vision equipment. Sarcon's uncooled IR detectors use a unique MEMS-based microcantilever structure for 10-20 times the sensitivity of competing technologies, with lower noise. The devices are also lower in cost, because they are produced with standard IC processes and techniques. "We fabricate each IR device with an array of microscopic cantilevered elements micromachined onto the surface of a standard CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. silicon wafer," said Scott Hunter, Sarcon's Vice President for R&D. "The cantilevers represent pixels in an image. As they bend in response to the heat of invisible infrared light, they generate electrical signals that create a thermal image of objects in a scene. "The key advantage of the microcantilever device, other than its low manufacturing cost, is its temperature conversion sensitivity, allowing very small differences in object temperatures to be accurately imaged." |
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