Printer Friendly

Samsung develops industry's first SiP; stacking processor with NAND flash and SDRAM.

Samsung Electronics, the world's second largest semiconductor manufacturer, has announced the industry's first System-in-Package (SiP) with an ARM-based processor, NAND flash and SDRAM for next-generation mobile phone and handheld applications. The new SiP solution integrates advanced logic and memory technology into a single package, reducing component count and shrinking form factors for handheld devices. This gives PDA and smartphone designers the flexibility to create a new range of cell phone designs and form factors that also support advanced features such as multimedia.

"The integration of data, voice and video in smartphones and PDA's requires higher performance, longer battery life, and increasing memory density in a sleek package," said Dr. Hyung Lae Roh, executive vice president, SOC R&D Center, Samsung Electronics. "Our SiP solution offers the world's first combination of an application processor with NAND flash, which will be the leading non-volatile storage solution for next-generation handhelds."

The SiP's small form factor, 17x17mm in size and 1.4mm high, integrates Samsung's S3C2410 ARM-based application processor, 256Mb of NAND flash memory and 256Mb of SDRAM memory. The S3C2410 is the world's first System-on-Chip (SOC) to have a NAND flash boot loader.

The S3C2410 features an ARM920T CPU core operating at 203 MHz. The chip supports major operating systems including Microsoft Windows CE, Palm OS, Symbian, and Linux.

The S3C2410 SOC offers a set of tailored peripherals for smartphones and other handheld devices that allows integrated support of features that consumers will find attractive and convenient. For example, the S3C2410 application processor includes USB host and device support to allow connectivity to a variety of other devices including PCs, printers, removable storage, and other handhelds. The processor also has SDIO support, which allows handhelds to be accessorized with upcoming SDIO protocol devices such as digital cameras, keyboards, etc.
COPYRIGHT 2003 Millin Publishing, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2003, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Comment:Samsung develops industry's first SiP; stacking processor with NAND flash and SDRAM.
Publication:EDP Weekly's IT Monitor
Geographic Code:9SOUT
Date:Feb 10, 2003
Words:296
Previous Article:Fujitsu combines with EMC to deliver integrated PRIMEPOWER and Symmetrix DMX solutions.
Next Article:IBM, United Devices and Accelrys aid DOD in search for smallpox cure.
Topics:


Related Articles
Samsung Signs Patent License Agreement With Rambus For SDRAM & DDR SDRAM Memory and Controllers.
FUJITSU INTRODUCES STACKED MCPS WITH NAND FLASH MEMORY AND FCRAM.
Samsung Develops Industry's First SiP Stacking Processor With NAND Flash and SDRAM.
Toshiba develops Multi-Chip Package (MCP) which realizes stacking of 9 layers with 1.4mm thickness.
Is SiP haunted by the MCM ghost? Thanks to cellphones, stacked-die packages are ringing up gains.
Samsung's' next-gen SIM card IC facilitates 3G mobile services.
Samsung NAND Flash software to enable higher performance in Palm Powered smart phones.
Samsung Electronics Underscores Mobile Technology Leadership at Annual Press Conference.
Samsung's Semiconductor Components Power Palm's New Color PDA for Consumers.
For consumer products, thin is in: but the ideal package solution is up for debate.

Terms of use | Copyright © 2014 Farlex, Inc. | Feedback | For webmasters