Samsung Electronics Underscores Mobile Technology Leadership at Annual Press Conference.SEOUL, South Korea -- Samsung Electronics Co., Ltd., a leader in advanced semiconductor solutions, announced three new technologies targeted at the expanding, multi-facetted mobile application industry. At a press conference held today in Seoul, Samsung Electronics' semiconductor business president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. , Dr. Chang-Gyu Hwang, introduced the following new devices:
A[micro] -- a 16Gb NAND flash memory using 50-nm technology for increased
mobile storage;
A[micro] -- a 7.2 Megapixel CMOS image sensor for high-end digital
pictures; and
A[micro] -- Fusion semiconductors for
A[micro] -- Next-generation smartphones and PDAs,
A[micro] -- MP3 music players, and
A[micro] -- Subscriber identity module card applications.
"Consumers are looking for ever smaller, more stylish mobile devices," said Dr. Hwang. "This poses a challenge for the semiconductor industry to create chips that meet the high-performance, high-density and minimum space requirements but don't become a power drain. We're uniquely positioned to address the market with high value products as we are the only company that manufactures all the discrete components that go into these new solutions." Increased Mobile Storage Samsung has developed the world's highest density NAND flash -- a 16Gb multi-level cell (MLC (MultiLevel Cell) A flash memory technology that stores more than one bit per cell. Traditional flash memory defines a 0 or 1 bit based on a single voltage threshold. ) NAND (Not AND) A Boolean logic operation that is true if any single input is false. Two-input NAND gates are often used as the sole logic element on gate array chips, because all Boolean operations can be created from NAND gates. See flash memory. memory. The 16Gb NAND density was achieved with the industry first use of 50-nanometer (nm) technology directly applicable to mass production processes and by using Samsung's proprietary 3D-transistor architecture. The finer geometry substantially reduces the noise level between cells and enables continued migration of storage platforms. Higher Resolution Reflects Industry Attention Samsung has developed a 7.2 Megapixel CMOS image sensor A CMOS-based chip that records the intensities of light as variable charges similar to a CCD chip. Although initially used in less expensive digital cameras, the quality of CMOS sensors has improved steadily. CMOS sensors have advantages over CCDs. (CIS Cis (sĭs), same as Kish (1.) (1) (CompuServe Information Service) See CompuServe. (2) (Card Information S ) for many different types of compact digital cameras. Higher resolution CIS chips reflect an industry-wide attention on CIS technology as a promising new imaging technology as well as a feasible replacement of charge-coupled device (CCD CCD in full charge-coupled device Semiconductor device in which the individual semiconductor components are connected so that the electrical charge at the output of one device provides the input to the next device. ), especially in mobile applications such as camera phones, digital still cameras and digital camcorders. Fusion Semiconductor Technology for Mobile Applications Leading the mobile convergence trend, Samsung has developed multi-featured Fusion Semiconductor solutions that provide space and power-sensitive packaging solutions for mobile applications. Fusion Semiconductor solutions combine memory and system LSI LSI: see integrated circuit. (Large Scale Integration) Between 3,000 and 100,000 transistors on a chip. See SSI, MSI, VLSI and ULSI. semiconductor devices into a single solution. Samsung's new package-on-package (PoP), the SC32442 MSP (1) (Management Service Provider or Managed Service Provider) An organization that manages a customer's computer systems and networks which are either located on the customer's premises or at a third-party datacenter. , stacks together a high-performance, low-power mobile application processor with a memory multi-chip package (MCP (1) See Microsoft certification. (2) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). ), which contains NAND flash and low-power mobile SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. . With dimensions of 14x14x1.6mm, Samsung's new PoP can offer up to a 60 percent space saving on mobile handheld printed circuit boards (PCBs), compared to using discrete processor and memory devices. The new SiP for MP3 players carries a low power MP3 decoder, audio CODEC chipset, NOR flash for code execution, and NAND flash for MP3 file storage. The SiP has a flexible design with NAND density of 512MB can easily be brought up to 1GB. The CODEC and NOR flash can also be selectively removed. The base design can then be utilized to meet the diverse features of MP3 players. Samsung's SiP can also resolve the large area coverage of the individual components and enable set designers to introduce even smaller or slimmer new MP3 players. The new S-SIM S-SIM Structural Similarity S-SIM S-Band Simulator for high-density SIM cards mounts a collective choice of in-house memory and system LSI technologies in a single package: a 128MB NAND Flash, a NAND Flash controller, and a SIM card IC. Samsung's S-SIM SiP solution provides a diverse set of high-speed interfaces including MMC See MultiMediaCard and Microsoft Management Console. , USB USB in full Universal Serial Bus Type of serial bus that allows peripheral devices (disks, modems, printers, digitizers, data gloves, etc.) to be easily connected to a computer. and several hundred-mega bits-per-second data transfer level that matches that of a PC. Further information about all four of these new technologies is available at www.samsungsemi.com. About Samsung Electronics Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2004 parent company sales of US$55.2 billion and net income of US$10.3 billion. Employing approximately 113,000 people in over 90 offices in 48 countries, the company consists of five main business units: Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing brands, Samsung Electronics is the world's largest producer of color monitors, color TVs, memory chips and TFT-LCDs. For more information, please visit www.samsung.com Editors Note: This release is accompanied by the following press releases: "Samsung Electronics Develops First 16-Gigabit NAND Memory Using 50-nm Technology for Sharp Jump in Mobile Storage Capacity," "Samsung Electronics at Center of Phenomenal 'Flash Rush'," and "Samsung Electronics Unveils 7.2 Megapixel CMOS Image Sensor." |
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