Samsung Electronics Delivers Next Generation Memory Modules for High Density Data Processing.SEOUL, Korea -- Samsung Electronics Samsung Electronics (SEC, Hangul:삼성전자; KSE: 005930, KSE: 005935, LSE: SMSN, LSE: SMSD) is a South Korean multinational corporation and the world's largest and leading electronics and information technology company. Co., Ltd., the world leader in advanced memory technology, today announced sample production of the next-generation memory module for servers and workstations - a fully buffered, dual in-line memory module See DIMM. (storage) Dual In-line Memory Module - Small circuit boards carrying memory integrated circuits, with signal and power pins on both sides of the board, in contrast to single-in-line memory modules (SIMM). (FB DIMM (Dual In-Line Memory Module) A printed circuit board that holds memory chips and plugs into a DIMM socket on the motherboard. See memory module. DIMM - Dual In-Line Memory Module ) based on DDR (Double Data Rate) Refers to an SDRAM memory chip that increases performance by doubling the effective data rate of the frontside bus. For more details, see SDRAM. DDR - Double Data Rate Random Access Memory 2 technology. The FB DIMM sharply boosts memory density and bandwidth of registered DIMMs to improve data processing data processing or information processing, operations (e.g., handling, merging, sorting, and computing) performed upon data in accordance with strictly defined procedures, such as recording and summarizing the financial transactions of a . An Advanced Memory Buffer (AMB AMB Ambient AMB Ambassador AMB Amber AMB Ambulance AMB Associação Médica Brasileira (Brazil) AMB Ambulatory AMB Advanced Memory Buffer (FBDIMM control unit on DRAM) ) chip has been added to each memory module to enable the use of high - and low-speed interfaces. The buffer can generate speeds from 3.2Gigabits per second (Gbps) to 4.8Gbps. The FB DIMM can attain a maximum speed of 4.8Gbps that is double the speed of a DDR2-400 registered DIMM, when utilizing DDR2-800 components. Until now, the access rate per channel for memory slots decreased as the memory bus speed increased, limiting density build-up. The FB DIMM eliminates this "stub-bus" channel bottleneck by using point-to-point links that enable up to eight multiple memory modules to be connected serially to a given channel. That will allow a capacity of up to 8GigaByte (GB) per channel or a total of up to 32GBs when incorporating 1GB FB DIMMs. The new FB DIMM also increases system efficiencies as board design is facilitated due to minimal circuiting. In addition, it prevents errors from occurring in conventional server systems when the number of memory modules exceeds two per channel. With FB DIMMs, servers can increase density levels eight-fold as the DIMM retrieves and stores data in a serial process. Samsung's 512MB and 1GB FB DIMM samples comply with existing industry (JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device ) standards. About Samsung Electronics Samsung Electronics Co. Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2004 parent company sales of US$55.2 billion and net income of US$10.3 billion. Employing approximately 123,000 people in 93 offices in 48 countries, the company consists of five main business units: Digital Appliance Business, Digital Media Business, LCD Business, Semiconductor Business and Telecommunication Network Business. Recognized as one of the fastest growing global brands, Samsung Electronics is the world's largest producer of color monitors, color TVs, memory chips and TFT-LCDs. For more information, please visit www.samsung.com. |
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