SUSS MicroTec Teams up with IMEC for Developing State-of-the-Art Bonding Methods of MEMS Packaging.Business Editors/High-Tech Writers
SAINT-JEOIRE, France--(BUSINESS WIRE)--Feb. 23, 2004
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SMH Screening for Mental Health, Inc. ), today announced it signed a Joint Development Program with IMEC, a world leading independent nanoelectronics and nanotechnology research center This article or section contains information about a building currently under construction.
It may contain information of a speculative nature, and the content may change dramatically as construction progresses and new information becomes available. .
MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. devices are set to have an enormous impact across the industrial spectrum - from biotechnology, through medical devices, process control to advanced mechanical systems. Microelectromechanical systems See MEMS. (MEMS) promises exciting solutions for a myriad of applications by allowing the micro-scale integration of mechanical elements with supporting integrated circuits Integrated circuits
Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. . The assembly and packaging of these tiny devices, however, has presented challenges for handling, maneuvering, and bonding sub-components with extreme exactness. But their commercialization is currently hampered by the lack of miniaturized and cost-effective 0-level bonding processes.
That's why IMEC and SUSS MicroTec will collaborate closely to develop innovative bonding technologies that will not influence the performance of these sensitive devices that MEMS are. Specifically, SUSS MicroTec has supplied IMEC with a FC150 Automated Device Bonder to perform all bonding tests realized in the frame of this one-year research program. More specifically, in this program IMEC and SUSS MicroTec will (i) develop new processes to solve the problem of oxidation of Indium used for high performance flip-chip bonds, (ii) develop innovative fluxless solder and polymer sealing processes for 0-level packaging of MEMS devices, and (iii) develop process for the handling and positioning of extreme thin chips and MEMS sealing caps. Additionally, IMEC will use the FC150 system for all its other advanced flip-chip bonding activities in the field of MEMS and high-density packaging.
Equipped with two bonding heads, the FC150 that will be installed at IMEC's facility in Leuven, Belgium, supports a broad range of various bonding processes: thermo-compression, solder reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. , UV curing, etc. This specific configuration results in the capability of applying very low forces down to 15 g while also supporting forces Forces stationed in or to be deployed to an operational area to provide support for the execution of an operation order. Combatant command (command authority) of supporting forces is not passed to the supported commander. of up to 200 kg. The FC150 ensures a unique ability to handle fragile and small components with the additional benefit of accommodating unusual shapes such as fiber optics fiber optics, transmission of digitized messages or information by light pulses along hair-thin glass fibers. Each fiber is surrounded by a cladding having a high index of refractance so that the light is internally reflected and travels the length of the fiber , ball lenses, preforms, thanks to a customized vacuum tooling design.
Furthermore, the SUSS FC150 produces the sub-micron alignment if required. Alignment is done before bringing parts into contact. When using the automatic alignment option, the system can align devices to a substrate using features instead of alignment marks. If components are very small or reflect the light poorly, SUSS offers an advanced laser leveling system that enables perfect leveling of even odd shaped pieces. The imaging system presents a total magnification of 400X and ensures a very high pre-alignment and post-bonding accuracy of +/- 1 micron.
For more than 10 years SUSS MicroTec has successfully developed equipment for MEMS processing. With Spin Coaters and Mask Aligners for imaging, Lift-off Tools for essential material processing, Substrate Bonders for mounting, Probers for testing, and Device Bonders for assembling SUSS provides the most influential range of production equipment for MEMS processing and testing.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America North America, third largest continent (1990 est. pop. 365,000,000), c.9,400,000 sq mi (24,346,000 sq km), the northern of the two continents of the Western Hemisphere. , Europe, Asia and Japan. SUSS MicroTec AG is listed in the Tec-DAX segment of the German Stock Exchange.
All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.