SUSS MicroTec Teams up with IMEC for Developing State-of-the-Art Bonding Methods of MEMS Packaging.
SAINT-JEOIRE, France--(BUSINESS WIRE)--Feb. 23, 2004
SUSS MicroTec S.A., French subsidiary of SUSS MicroTec AG (FWB:SMH), today announced it signed a Joint Development Program with IMEC, a world leading independent nanoelectronics and nanotechnology research center.
MEMS devices are set to have an enormous impact across the industrial spectrum - from biotechnology, through medical devices, process control to advanced mechanical systems. Microelectromechanical systems (MEMS) promises exciting solutions for a myriad of applications by allowing the micro-scale integration of mechanical elements with supporting integrated circuits. The assembly and packaging of these tiny devices, however, has presented challenges for handling, maneuvering, and bonding sub-components with extreme exactness. But their commercialization is currently hampered by the lack of miniaturized and cost-effective 0-level bonding processes.
That's why IMEC and SUSS MicroTec will collaborate closely to develop innovative bonding technologies that will not influence the performance of these sensitive devices that MEMS are. Specifically, SUSS MicroTec has supplied IMEC with a FC150 Automated Device Bonder to perform all bonding tests realized in the frame of this one-year research program. More specifically, in this program IMEC and SUSS MicroTec will (i) develop new processes to solve the problem of oxidation of Indium used for high performance flip-chip bonds, (ii) develop innovative fluxless solder and polymer sealing processes for 0-level packaging of MEMS devices, and (iii) develop process for the handling and positioning of extreme thin chips and MEMS sealing caps. Additionally, IMEC will use the FC150 system for all its other advanced flip-chip bonding activities in the field of MEMS and high-density packaging.
Equipped with two bonding heads, the FC150 that will be installed at IMEC's facility in Leuven, Belgium, supports a broad range of various bonding processes: thermo-compression, solder reflow, UV curing, etc. This specific configuration results in the capability of applying very low forces down to 15 g while also supporting forces of up to 200 kg. The FC150 ensures a unique ability to handle fragile and small components with the additional benefit of accommodating unusual shapes such as fiber optics, ball lenses, preforms, thanks to a customized vacuum tooling design.
Furthermore, the SUSS FC150 produces the sub-micron alignment if required. Alignment is done before bringing parts into contact. When using the automatic alignment option, the system can align devices to a substrate using features instead of alignment marks. If components are very small or reflect the light poorly, SUSS offers an advanced laser leveling system that enables perfect leveling of even odd shaped pieces. The imaging system presents a total magnification of 400X and ensures a very high pre-alignment and post-bonding accuracy of +/- 1 micron.
For more than 10 years SUSS MicroTec has successfully developed equipment for MEMS processing. With Spin Coaters and Mask Aligners for imaging, Lift-off Tools for essential material processing, Substrate Bonders for mounting, Probers for testing, and Device Bonders for assembling SUSS provides the most influential range of production equipment for MEMS processing and testing.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Tec-DAX segment of the German Stock Exchange.
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