SUSS MicroTec Introduces Equipment Package for High Topography Lithography at Productronica.

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MUNICH, Germany--(BUSINESS WIRE)--Nov. 12, 2003

SUSS MicroTec AG (ticker symbol FWB:SMH) is unveiling a new lithography package for high topography applications at the Productronica 2003 exhibition in Munich, Germany. The SUSS solution for high topography lithography combines a new patent-pending spray coating system with a SUSS SupraYieldTM-enabled exposure tool. Together, these systems yield unsurpassed pattern transfer capability over severe topography. The new SUSS spray coater uses a novel resist deposition method that enables conformal coats across flat and steeply sloped surfaces. Coupled with a SUSS aligner optimized for large depth of focus an unbeaten precise patterning on top, bottom and in the slope of structures with up to several hundreds of microns of topography is possible.

"With our novel resist spraying method, we are able to solve the main challenges of high topography lithography", explains Franz Richter, president and CEO of SUSS MicroTec. "Especially critical on sharp edges of V-grooves or AFM tips, our spray coating approach ensures reliable edge coverage without defects. The large exposure gap optics (LEGO) available in SUSS SupraYieldTM-enabled aligners allow exposure over high topography without the diffraction-related image degradation seen in other exposure tools. This results in precise control of the pattern over the whole topography range of several hundred microns. In addition we manage to keep the process costs low. For the large field of high topography lithography applications SUSS exposure and resist processing tools offer unsurpassed performance and cost-of ownership."

The coating and exposure of photoresists across substantial topography is not only a critical technology for advanced electronic packaging, it is also an indispensable element for process integration and required packaging of microelectromechanical systems (MEMS). For coating of extreme topographies conventional spin coating demonstrates inherent problems that are largely due to surface tension and fluid flow dynamics effects. Spray coating as an alternative to spin coating has been around since 1979 but never achieved the uniformity across the wafer that spin coating does.

With the introduction of the new lithography equipment package for high topographies SUSS has mastered the challenge to cover sharp edges while avoiding the accumulation of resist in trenches that has plagued both conventional spin coating as well as commercially available spray coating to date.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Tec-DAX segment of the German Stock Exchange.

All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.

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