SUSS MicroTec Enhances the BlueRay(TM) Probe System; The World's Only Prober That Can Be Upgraded on Site from a Semiautomatic to Fully-Automated System.

MUNICH, Germany -- SUSS MicroTec AG (FWB:SMH) (GER:SMH) has introduced the latest innovation of the BlueRay(TM) probe system, a high-throughput wafer prober capable of testing up to 70,000 dies per hour. It is now the world's only prober that can be upgraded from a semiautomatic to a fully-automated probe station in the field.

As the demand for discrete devices, MEMS, RF and optosemicondutor devices grows, manufacturers need a test system that can grow with their production needs. Producers also need efficient test processes to meet cost pressures and reduce time to market. SUSS recognized these factors and provides manufacturers with the test solution that fits their needs for today and in the future.

To meet growing production demands, a unique, wafer-handling robot can be docked onto the BlueRay probe system. Once completely docked, the robot handles all wafers automatically. The system is so flexible that the wafer-handling robot can be removed and docked onto another BlueRay as needed. Docking and undocking is quick and done on site, reducing down time to a minimum. In addition, the test platform can now remain constant from ramp-up to production, which minimizes changeover costs and capital investments.

"The BlueRay probe system is the most unique on-wafer test platform available today," said Stojan Kanev, International Product Manager for Test Systems at SUSS MicroTec. "Not only does it enable the device maker to test non-electrical properties with high precision and throughput, but it also provides a common test platform for manufacturers from ramp-up to production test. Essentially, it's the bridge from lab to fab."

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit www.suss.com.

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