SUSS MicroTec Boosts Full-Field Lithography with New SupraYield Technology; Provides Clear Path to Future Needs of Advanced Packaging and Other Markets.

Business Editors/High-Tech Writers

MUNICH, Germany--(BUSINESS WIRE)--June 18, 2003

SUSS MicroTec has significantly extended the capabilities of cost-effective 1X full-field lithography (1XFFL) with a package of four new technologies. Known collectively as SupraYield, the enhancements provide a high-performance 1XFFL solution for advanced thick-resist applications, such as wafer-level packaging, MEMS and optoelectronics. SUSS 1XFFL systems enhanced with SupraYield Technology can double throughput, achieve one-micron resolution and sub-micron overlay, and reduce lithography costs by up to 66 percent (compared to steppers) for those cost-sensitive applications.

SupraYield Technology ensures that economical 1XFFL systems can meet the demands of several future design generations. For example, in the next few years, pad separations of 5 microns will be required in gold bumping. The better resolution and higher overlay accuracy provided by SupraYield easily fulfill that requirement and enable high yields, with the unmatched throughput and cost efficiency provided by full-field tools.

"SUSS 1XFFL systems efficiently expose the entire wafer, up to 300mm, in one step, allowing twice the throughput at about half of the purchase price of comparable 1X stepper technology," said Dr. Franz Richter, president and CEO of SUSS MicroTec. "Due to those benefits, SUSS full-field lithography is the dominant technology in growth markets such as advanced packaging, MEMS and LED production, as well as in the production of other technology-driven but cost-sensitive applications.

"We believe that SupraYield will significantly expand our market opportunity into new and exciting areas. With SupraYield, our 1XFFL systems can now meet the most aggressive technology roadmaps for thick-resist applications, and keep costs low relative to other lithography solutions," noted Dr. Richter.

SupraYield is a package of four technologies: Mask Pellicle Technology (MPT(TM)), ThermAlign(TM) Chuck, advanced photoresists and Large Clearfield Mask Movement.

MPT, a special pellicle designed to cover full-field photomasks, reduces mask maintenance. Much like pellicles used for reticles, MPT prevents contamination from printing on the wafer by keeping the mask free of particles, even after hundreds of exposures. Additionally, full-field masks can be placed closer to the wafer, improving resolution without affecting yield. With MPT, SupraYield enables SUSS 1XFFL systems to achieve sub-micron resolution.

SupraYield's ThermAlign Chuck enables higher overlay accuracy than previous mask aligners. By modulating the temperature of the wafer, the ThermAlign Chuck compensates for differences in the CTE between mask and wafer, allowing the two to stay tightly aligned during exposure. The ThermAlign Chuck can reduce thermal run-out to sub-micron levels, and allows the use of soda-lime photomasks, which are less expensive than traditional quartz photomasks.

Advanced thick photoresists are key to the use of SupraYield Technology. By using modern formulations, manufacturers can extract the highest performance from their 1XFFL systems and achieve aspect ratios thought to be impossible only a few years ago. SUSS 1XFFL systems with SupraYield technology have the unique flexibility to make use of these new materials regardless of whether they require g-line, i-line or ghi-line exposure.

The final part of SupraYield is Large Clearfield Mask Movement (LCMM). LCMM simplifies photomask design and significantly improves target capture and alignment. LCMM consists of alignment hardware and software that eliminate the need for transparent chrome photomasks or special alignment target openings when dark-field masks are required.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Prime Standard segment of the German Stock Exchange.

All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe," "expect," "intend," "anticipate," "estimate," "should," "may," "will," "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.