SUSS MicroTec's New Substrate Bonders Offer Superior Process Control; Bonders Enable High Yields and Ensure Functionality of MEMS, Compound Semiconductors.Business Editors/High-Tech Writers MUNICH, Germany--(BUSINESS WIRE)--Aug. 26, 2003 SUSS suss tr.v. sussed, suss·ing, suss·es Slang 1. To infer or discover; figure out: "I think I'm good at sussing out what's going on" Ry Cooder. MicroTec has introduced new levels of process control to substrate bonding with the debut of its recently enhanced substrate bonders. SB6e and SB8e are designed for the development of MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. applications, compound semiconductors and advanced packaging. SB6e processes six-inch substrates, while SB8e handles eight-inch substrates. Combined with SUSS bond aligners, the SB6e and SB8e also offer the highest post-bond alignment accuracy of any commercially available bonders. Ideally suited for laboratories and small-series production, SB6e and SB8e can facilitate high device yields by providing superior process control. Both substrate bonders offer more temperature and force uniformity than competitive tools. In fact, SB6e and SB8e can maintain 1.5 percent uniformity of temperature setpoint across the wafer, which is twice the rate of uniformity provided by competitive tools. With this degree of temperature uniformity, the SUSS systems can ensure bond integrity across the entire substrate. Working in concert with SUSS bond aligners BA6 and BA8, SB6e and SB8e demonstrate post-bond alignment of less than 1 micron micron: see micrometer. One micrometer, which is one millionth of a meter or approximately 1/25,000 of an inch. The tiny elements that make up a transistor on a chip are measured in micrometers and nanometers. See process technology. for anodically bonded multiple wafer stacks. This high level of post-bond alignment accuracy helps boost yields and ensure device functionality. SUSS bond aligners leverage the proven advanced alignment technology of SUSS full-field lithography lithography (lĭthŏg`rəfē), type of planographic or surface printing. It is distinguished from letterpress (relief) printing and from intaglio printing (in which the design is cut or etched into the plate). systems. "Today's MEMS and compound semiconductor markets require flexibility, accuracy and reliability in the tools that enable the fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. of a wide variety of microdevices," said Jeff Dumas Jeff Dumas (Born: June 28th, 1971 in Chicago, Illinois, USA) is an American stage actor currently starring as Patsy in the first US national tour of Monty Python's Spamalot (Helen Hayes Award Winner - Actor in a Supporting Role). , international product manager for the substrate bonder line at SUSS MicroTec. "For devices requiring highly accurate aligned substrate bonding, the SUSS SB6e and SB8e can be used to design and fabricate novel microstructures with a level of process control previously not available." The SB6e and SB8e are semi-automatic, computer-controlled, stand-alone substrate bonders. Representing the latest generation of SUSS substrate bonders, the systems feature rigid vacuum-pressure chambers, upper and lower independent heaters, and wafer-stack loading arms. The bonders can be equipped with tooling and alignment fixtures that support all known bonding processes. A wide array of semiconductor materials Semiconductor materials are insulators at absolute zero temperature that conduct electricity in a limited way at room temperature (see also Semiconductor). The defining property of a semiconductor material is that it can be doped with impurities that alter its electronic properties with wafer and substrate diameters ranging from 20 mm x 20 mm to 200 mm can be accommodated, as well. SB6e and SB8e also have total stack thickness capabilities of 6 mm. Additionally, the chambers, tooling, fixtures, and process controls of the SB6e and SB8e are used in SUSS volume-production bonders ABS (Automatic Backup System) See backup program. 150e and ABS200 -- complete stand-alone substrate bonding systems. This allows easy and precise process transfer from lab or short product runs to fully automated volume production-level bonding. With its extensive portfolio of bonder products, SUSS is the most comprehensive bonder supplier in the semiconductor process equipment market. The portfolio includes substrate and wafer bonders, flip-chip and device bonders, fusion bonders, and temporary bonders. No other single company in the industry offers more bonding solutions, equipment functionality, applications expertise, and after-sales support. About SUSS MicroTec SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America North America, third largest continent (1990 est. pop. 365,000,000), c.9,400,000 sq mi (24,346,000 sq km), the northern of the two continents of the Western Hemisphere. , Europe, Asia and Japan. SUSS MicroTec AG is listed in the Prime Standard segment of the German Stock Exchange. All statements in this release other than historical facts are forward-looking statements forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. within the meaning of U.S. Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge diverge - If a series of approximations to some value get progressively further from it then the series is said to diverge. The reduction of some term under some evaluation strategy diverges if it does not reach a normal form after a finite number of reductions. numerically from expectations. The forward-looking statements reflect the view at the time they were made. |
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