SUSS MicroTec's NC-1 Non-Contact System Wins International Award.

MUNICH, Germany -- SUSS MicroTec AG (FWB:SMH)(GER:SMH) has announced that the world's first and only non-contact probe system, the NC-1, has been honored with the "Best in Test" award from the leading industry journal Test & Measurement World. As one of twelve products selected by the editors, it is the only probe system to be presented with the award, which recognizes particularly innovative and useful test products.

"SUSS MicroTec is honored to have one of its products selected as 'Best in Test' for 2006," states Dr. Claus Dietrich, Managing Director of the Test Systems division at SUSS MicroTec. "This shows that we are capable of offering the latest and most innovative technology for design and test engineers working on the most advanced devices in the world."

The NC-1 Non-Contact System uses a patented technique to acquire signals from very small features without loading the circuit under test or relying on optical emissions. The NC-1 supplies both voltage and timing information, and the integrated atomic force probe enables deep sub-micron scanning and positioning. To extract measurements from the device, the tip of the probe is stimulated with electrical pulses after being placed above the area of interest. The forces generated between the tip and the device under test are then measured and analyzed by the NC-1 software, and the signal voltage waveform is extracted. This data is presented to the user in an easy-to-read format.

"Our editorial panel was pleased to select the NC-1 as one of our Best in Test products for 2006," said Test & Measurement World Chief Editor Rick Nelson. "Its novel approach to acquiring voltage and timing information without physical or electrical contact should prove to be valuable in failure analysis and other applications," he added.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan.

For more information about SUSS MicroTec, please visit www.suss.com.

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