SST OFFERS FLASH MEMORY PRODUCTS IN INDUSTRY'S SMALLEST MICRO-BGA PACKAGE.

SST (Silicon Storage Technology, Inc.)(NASDAQ:SSTI) will offer its successful 39 series, SuperFlash based, Multi-Purpose Flash (MPF) family of products in a small 48-ball micro-BGA (ball grid array) package. Measuring only 6 mm x 8 mm, SST's new micro-BGA package represents the industry's smallest micro-BGA package for flash memory devices. SST's 39 series MPF flash memory products offered in the new micro-BGA package are ideal for space-constrained devices such as PDAs, GPS navigation devices, cellular phones, Bluetooth modules, handheld games and small form factor hard disk drives. Currently, SST is offering the 6 mm x 8 mm micro-BGA package for the SST39VF400A, a 4 Mbit device. SST will also soon offer the SST39VF800A, an 8 Mbit device, and the SST39VF200A, a 2 Mbit device, in the new micro-BGA package, and will eventually extend this package option to other MPF products.

"SST developed the new micro-BGA package to respond to the needs of our customers and the industry," said Y.G. Han, marketing manager, SST. "A trend we see in the industry is the integration of more and more functions, such as Bluetooth and GPS capability, into already space-constrained handheld consumer devices. The challenge for designers is to integrate added functionality to their products without increasing the overall size of the device. SST's new micro-BGA package is a key benefit to designers as it allows them to reduce the size of their designs while utilizing all the advantages that our SuperFlash technology has to offer."

Also, according to Han, SST's new micro-BGA package is easy for designers to implement because it has the same pin-out and ball locations as larger micro-BGA packages, which are now commonly used in handheld devices. Therefore, SST's new micro-BGA package is an easy drop-in replacement for larger micro-BGA packages without requiring any change to the existing board layout.

The SST39VF400A in the 6 mm x 8 mm micro-BGA package is available now and is priced at $3.34 each in quantities of 100K. SST's package code for the new micro-BGA package is B2K.

SST's SuperFlash technology is a NOR type, split-gate cell architecture which uses a reliable thick-oxide process with fewer manufacturing steps resulting in a low-cost, nonvolatile memory solution with excellent data retention and higher reliability. The split-gate NOR SuperFlash architecture facilitates a simple and flexible design suitable for high performance, high reliability, small or medium sector size, in- or off-system programming and a variety of densities, all in a single CMOS-compatible technology.

Headquartered in Sunnyvale, California, SST designs, manufactures and markets a diversified range of nonvolatile memory solutions, based on proprietary, patented SuperFlash technology, for high volume applications in the digital consumer, networking, wireless communications and Internet computing markets. SST's product families include high functionality flash memory components, flash mass storage products and 8-bit microcontrollers with on-chip flash memory. SST also offers its SuperFlash technology for embedded applications through its world-class manufacturing partners and technology licensees IBM, National Semiconductor, Motorola, Samsung Electronics Co. Ltd., SANYO Electric Co., Ltd., Seiko Epson Corp. and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). TSMC offers SuperFlash under its trademark Emb-FLASH.