SMTA recognizes two speakers.To reward exceptional achievement at two recent SMTA SMTA Surface Mount Technology Association SMTA Standard Material Transfer Agreement SMTA Subordinate Message Transfer Agent SMTA Sewing Machine Trade Association (UK) SMTA Sekolah Menengah Tingkat Atas (Minneapolis, MN) educational programs, Glenn Woodhouse, Plexus (formerly MCMS MCMS Microsoft Content Management Server MCMS Mobile Content Management System MCMS Madison County Medical Society (Alabama) MCMS Machinery Control and Monitoring System MCMS Microfabrication by Coextrusion Melt Spinning MCMS Maple Crest Middle School , Neenah, WI), and Janet Semmens, Sonoscan (Elk Grove Village Elk Grove Village, village (1990 pop. 33,429), Cook and Du Page counties, NE Ill., a suburb of Chicago; inc. 1956. With a population of c.100 at the time of its establishment on open farmland, the village has grown dramatically and steadily, largely because of its , IL), were named winners of the Best of Conference Awards at the SMTA Dallas Optoelectronics conference and the Seventh Annual Pan Pacific Symposium, respectively. Woodhouse was awarded for his work, Photonics Assembly in an EMS Environment. The paper introduces readers to photonic components, associated assembly and test processes and the unique manufacturing challenges and paradigm shift A dramatic change in methodology or practice. It often refers to a major change in thinking and planning, which ultimately changes the way projects are implemented. For example, accessing applications and data from the Web instead of from local servers is a paradigm shift. See paradigm. faced by manufacturers focused on surface-mount technology. Semmens was awarded for her article, Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging. Semmens' work specifically describes case studies where FFT (Fast Fourier Transform) A class of algorithms used in digital signal processing that break down complex signals into elementary components. FFT - Fast Fourier Transform frequency domain imaging has been used to reveal features down to only Angstroms in thickness in applications such as wafer bonding and flip chip. |
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