SMTA recognizes outstanding authors.The Surface Mount Technology Association (SMTA SMTA Surface Mount Technology Association SMTA Standard Material Transfer Agreement SMTA Subordinate Message Transfer Agent SMTA Sewing Machine Trade Association (UK) SMTA Sekolah Menengah Tingkat Atas , Minneapolis, MN, www.smta.org) recently announced the outstanding authors from SMTA International 2002. To reward exceptional achievement, SMTA gives $1,000 awards and plaques for the Best of Conference Paper, Best of Proceedings Paper and the Best International Paper. Respectively, the winners are Ian Fleck, Cookson Electronics; Fay Hua et al., Intel Corp.; and W.T. Chen et al., National Central University. Fleck was awarded the Best of Conference Paper for his work, "A New Dimension in Stencil stencil, cutout device of oiled or shellacked tough and resistant paper, thin metal, or other material used in applying paint, dye, or ink to reproduce its design or lettering upon a surface. Print Optimization." The paper described and helped clear some of the widely perceived misconceptions regarding stencil design and the different manufacturing processes. The research team investigated the issue with a test matrix comprised of all possible combinations of stencil aperture design and manufacturing processes currently used in electronics assembly and manufacturing. Hua and her co-authors won the Best of Proceedings Paper award for their article, "Solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. Joint Reliability of Sn-Ag-Cu BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. Components Attached with Eutectic Pb-Sn Solder Paste Solder paste (or solder cream) is a mix of small solder particles and flux. It is used extensively in the automated soldering processes wave soldering and reflow soldering. ." In their work, they presented the results of solder joint reliability evaluation of very fine-pitch ball grid arrays “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (VFBGAs) and stacked lead-free chip-scale packages (SCSPs) attached to printed circuit boards (PCBs) with eutectic lead-tin (Pb-Sn) pastes. The packages were assembled under various fellow profiles using standard Pb-Sn assembly conditions. Chen and his co-authors received the Best International Paper award for their article, "Effect of Cu Concentration on the Solid-State Aging Reactions Between SnCu Lead-Free Solders and NL" The work extended the authors' earlier effort to investigate the effect of a small perturbation perturbation (pŭr'tərbā`shən), in astronomy and physics, small force or other influence that modifies the otherwise simple motion of some object. The term is also used for the effect produced by the perturbation, e.g. in the copper concentration on the solid-state aging reaction between the tin-copper (Sn-Cu) solders and nickel (Ni). They found that the strong sensitivity to copper composition disappeared after solid-state aging at high temperatures for a sufficient period of time. The authors will formally be presented their awards at the SMTA Annual Meeting during SMTA International 2003 in September. |
|
||||||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion