Printer Friendly
The Free Library
14,507,882 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

SMTA announces Pan Pacific Symposium program, keynotes.


The ninth annual Pan Pacific Microelectronics Symposium and Exhibit will take place on Feb. 10-12, 2004, at the Turtle Bay Resort The Turtle Bay Resort is a luxury resort located in Kahuku, Hawaii. The hotel is the only major hotel on the North Shore of Oahu, and is a 50 minute drive from Honolulu.

The hotel is situated on 880 acres of land at Turtle Bay, and features 375 rooms, 26 suites, and 42 Beach
, Kahuku, Oahu, HI. The event promotes international technical interchange and provides a forum for networking among microelectronics professionals and business leaders throughout the Pacific Basin.

Sponsored by the Surface Mount Technology Association (SMTA SMTA Surface Mount Technology Association
SMTA Standard Material Transfer Agreement
SMTA Subordinate Message Transfer Agent
SMTA Sewing Machine Trade Association (UK)
SMTA Sekolah Menengah Tingkat Atas
, Minneapolis, MN, www.smta.org), the symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, assembly, global markets and related business issues.

The 2004 event technical program will consist of 15 sessions with 53 papers on topics including flip chip, 3-D packaging, novel chip connection, embedded components, design and modeling, reliability, printed wiring board (PWB (Printed Wiring Board) An alternate term for printed circuit board. See printed circuit board. ) materials and processes, suface-mount assembly optimization, packaging materials, inspection and test, industry and research standards, lead-free, power device packaging, optics and microelectromechanical systems (MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. ) and nanotechnologies in high reliability applications.

Also featured are three keynote addresses: "Flip Chip Packaging--Current Trends and Roadmap," presented by Maniam Alagaratnam, LSI Logic; "A Key Role of PCB PCB: see polychlorinated biphenyl.
PCB
 in full polychlorinated biphenyl

Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound.
 in Recent Packaging Solutions," by Yutaka Tsukada, Kyocera SLC Technologies; and "Technical Challenges in Memory Packaging," by Se Yong Oh, Samsung.
COPYRIGHT 2004 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2004, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Title Annotation:Industry News
Publication:Circuits Assembly
Date:Jan 1, 2004
Words:188
Previous Article:Elcoteq, Siemens enter manufacturing agreement.(Industry News)
Next Article:Productronica 2003: the numbers are in.(Industry News)



Related Articles
Pan Pacific Call for Papers.(Brief Article)
SMTA recognizes two speakers.(Industry News)(Brief Article)
SMTA announces Annual Awards.(Industry News)
Events.(Happenings)(Calendar)
Events.(Happenings)(Calendar)
Events.(Happenings)(Calendar)
Got paper?
Events.(Happenings)(Calendar)
Events.(Happenings)(Calendar)
Events.(HAPPENINGS)(Calendar)

Terms of use | Copyright © 2009 Farlex, Inc. | Feedback | For webmasters | Submit articles