SEZ INTRODUCES NEW GENERATION SPIN-PROCESSOR FOR 4-6" WAFER FABRICATION.

The SEZ Group has announced the availability of its newest Spin-Processor for 4-6 inch chip fabrication. The Spin-Processor 102 adapts SEZ's proven state-of-the-art 200 and 300 mm equipment design for 4, 5 and 6 inch wafer diameters. The tool also meets SEMI's automation and communication (GEM implemented) standards.

The main advantages of the Spin-Processor 102 in comparison to its predecessor are smaller footprint, compact design and faster handling which result in cost saving, faster installation and higher throughput. More flexibility is offered by the tool's availability of different handling systems, including Bernouilli handling for ultra-thin wafers.

The SEZ 102 is a single-task, multi level wet processing machine with fully automatic cassette-to-cassette handling. The system includes a Chemical Dispense System to provide up to three chemicals at the required quantity and temperature. Additional features of the Spin-Processor 102 are an integrated controller, integrated suck back box, flipmodule, uses through beam sensors and is GEM compatible, The tool requires no flat-alignment and offers frontside and backside processing with no equipment changes needed.

The main applications are backside film removal and cleaning, stress relief and wafer thinning of silicon, GaAs or other compound material wafers, wafer reclaim, post-etch polymer removal and oxide etching.