SEMICONDUCTOR CHARACTERIZATION AND METROLOGY CONFERENCE AT NIST.The 2000 International Conference on Characterization and Metrology for Ultra Large Scale Integration (ULSI (Ultra Large Scale Integration) More than one million transistors on a chip. See SSI, MSI, LSI and VLSI. ) Technology was hosted by NIST (National Institute of Standards & Technology, Washington, DC, www.nist.gov) The standards-defining agency of the U.S. government, formerly the National Bureau of Standards. It is one of three agencies that fall under the Technology Administration (www.technology. in June 2000. The conference is the third in a series; the first was held at NIST in 1995 and the second in 1998. The 2000 conference was highly successful, bringing in more than 220 attendees from the United States United States, officially United States of America, republic (2005 est. pop. 295,734,000), 3,539,227 sq mi (9,166,598 sq km), North America. The United States is the world's third largest country in population and the fourth largest country in area. , the Netherlands, Belgium, France, Spain, Germany, Switzerland, Israel, Korea, China, Japan, and Taiwan. Forty invited talks were presented, nearly 100 poster papers were displayed, and a panel was hosted to summarize key issues emerging from the conference. Under NIST leadership, the conference was organized to provide extensive coverage of metrology and characterization methods. Perspectives on industrial metrology requirements were highlighted as well as a review of the 1999 International Technology Roadmap for Semiconductors The International Technology Roadmap for Semiconductors is a set of documents produced by a group of semiconductor industry experts. These experts are representative of the sponsoring organisations which include the Semiconductor Industry Associations of the US, Europe, Japan, as a benchmark for characterization and metrology needs. Topics for the conference included challenges, front-end processing, contamination and defect analysis (programming) defect analysis - Using defects as data for continuous quality improvement. Defect analysis generally seeks to classify defects into categories and identify possible causes in order to direct process improvement efforts. , lithography lithography (lĭthŏg`rəfē), type of planographic or surface printing. It is distinguished from letterpress (relief) printing and from intaglio printing (in which the design is cut or etched into the plate). , interconnect and backend processing, thin films, and critical analytical techniques. The conference proceedings will be available in the spring of 2001. Orders may be placed on-line at www.aip. org/catalog/cpreq_form.html. Additionally, many of the talks will be made available for viewing on the conference web site at www.eeel.nist.gov/812/conference, as well as an ongoing dialogue about issues posed by the panel. |
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