SEMATECH to Update Industry on Next-Generation Wafers at SEMICON Japan.CHIBA, Japan -- A microchip industry briefing on progress toward next-generation wafer manufacturing, along with demonstrations of cost-effective R&D for advanced chips, will highlight offerings of SEMATECH SEMATECH Semiconductor Manufacturing Technology and its subsidiaries during events at SEMICON SEMICON Semiconductors Equipment and Material International Conference Japan here Dec. 5-8. Executives of the International SEMATECH Manufacturing Initiative (ISMI ISMI Institute for the Study of Modern Israel (Emory University) ISMI International Student Mobility Initiative ) will focus on next-generation factory productivity options during the ISMI 300 Prime/450 mm Industry Briefing starting at 9 a.m. Dec. 6 in Room 301, 3F, International Conference Hall, Makuhari Messe Makuhari Messe (幕張メッセ| convention center. Discussion leaders will include Joe Draina, ISMI associate director; Tom Abell, manager of ISMI's 450 mm Program; and Jackie Ferrell, manager of ISMI's Standards Program. They and other speakers will outline 300 Prime progress to date and program direction for 2007, while reviewing opportunities for industry collaboration in next-wafer activities. Also, representatives of ATDF ATDF American Tap Dance Foundation ATDF Advanced Technology Development Facility, Inc (Austin, TX) ATDF ASCII Test Data Format (semi-conductor industry) ATDF Automated Target Data Fusion , the global R&D foundry and wholly owned SEMATECH subsidiary, will staff Booth 304, Hall 5A in the nano-marketing area of Makuhari Messe. ATDF specializes in offering custom development services in its state-of-the-art R&D wafer fab, where customers can confidentially test new designs, integration methodologies, and prototype systems while protecting their own intellectual property. Other SEMATECH-related activities will include: * ISMI e-Manufacturing Workshop at 9 a.m. Tuesday, Dec. 5, Room 301, International Conference Hall, Makuhari Messe. ISMI engineers Harvey Wohlwend, Lance Rist, and Gino Crispieri will discuss equipment data quality issues in the microchip industry, recipe management implementation experiences, and lessons learned from ISMI evaluations of supplier Interface A implementations. * Organizational meeting for the International Energy Conservation Coordinating Committee (IECCC), 11 a.m. Dec 5 in Room 203 in the International Conference Hall at Makuhari Messe. IECCC is a global effort to track and coordinate energy conservation programs throughout the industry. Meeting participants will identify committee members and refine the panel's charter. The meeting also will include updates from IECCC founding members JEITA JEITA Japan Electronics and Information Technology Industries Association (merger of JEIDA and EIAJ) , SEAJ SEAJ Semiconductor Equipment Association of Japan , JACA Jaca (hä`kä), town (1990 pop. 10,874), Huesca prov., NE Spain, in Aragón, in the Pyrenees (alt. c.2,700 ft/820 m), near the French border on the Aragón River. , SEMI, and ISMI. * SEMI Global Environment Symposium, 1 p.m. Dec 5, in Room 302 of the International Conference Hall, Makuhari Messe. Walter Worth, SEMATECH Fellow, and James Beasley, ISMI project engineer, will provide SEMATECH's perspective on water and wastewater opportunities and challenges. * Manufacturing Technology Forum (MTF (1) (Modulation Transfer Function) A measurement of monitor sharpness. MTF compares the contrast ratio between alternating black and green lines that are one pixel thick. ) Workshop, 1 p.m. Wednesday, Dec. 6, in Room 301B, International Conference Hall, Makuhari Messe. As a newly established SEMI advisory panel, the MTF works to improve the SEMI standards process by providing a venue for collective understanding of user requirements and industry direction. This workshop will explain the need for MTF, its organization, opportunities for participation, and relationship to the SEMI Standards Program. * Ben Bunday, Member of Technical Staff at ISMI, will deliver a keynote address on "The Future of CD Metrology" at 2:20 p.m. Wednesday during the Hitachi High Tech CTE (Coefficient of Thermal Expansion) The difference between the way two materials expand when heat is applied. This is very critical when chips are mounted to printed circuit boards, because the silicon chip expands at a different rate than the plastic board. Forum in Hotel Springs Makuhari, near Makuhari Messe. Bunday also will speak at 2:40 p.m. Thursday, Dec. 7, during the STEP/Standardization of LER/LWR Measurement seminar in the VIP Conference Room, International Conference Hall, Makuhari Messe. * "300 mm Productivity Detractors" will be the topic of a presentation by Tom Abell, Manager of ISMI's 450 mm Program, at 10 a.m. Dec. 7 in Room 202 of the International Conference Hall, Makuhari Messe. Abell's talk will be part of a SEMI forum, "Issues and Challenges for Next Generation Fab." SEMATECH is the world's catalyst for accelerating the commercialization of technology innovations into manufacturing solutions. By setting global direction, creating opportunities for flexible collaboration, and conducting strategic R&D, SEMATECH delivers significant leverage to our semiconductor and emerging technology partners. In short, we are accelerating the next technology revolution. For more information, please visit our website at www.sematech.org. SEMATECH, the SEMATECH logo, AMRC AMRC Association of Medical Research Charities AMRC Advanced Manufacturing Research Centre (UK) AMRC Association of Municipal Recycling Coordinators AMRC Accès Multiple par Répartition en Code (French) , Advanced Materials Research Center, ATDF, the ATDF logo, Advanced Technology Development Facility, ISMI and International SEMATECH Manufacturing Initiative are servicemarks of SEMATECH, Inc. |
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