SCP Global Technologies Launches Single-wafer Immersion Surface Preparation System.Business Editors/High-Tech Writers BOISE, Idaho--(BUSINESS WIRE)--May 12, 2004 Emersion e·mer·sion n. The act of emerging; emergence. [From Latin  mersus, past participle of 300 Single-Wafer Precision Cleaning System Designed for Critical Cleans and Etches at 65nm and Below SCP (1) (Service Control Point) A node in an SS7 telephone network that provides an interface to databases, which may reside within the SCP computer or in other computers. Global Technologies (SCP), a leading supplier of semiconductor capital equipment, announced it has expanded its portfolio of surface preparation tools with the introduction of the Emersion 300(TM) single-wafer precision cleaning system. The tool was designed to address several critical roadblocks to 65nm-and-below processing, such as particle removal, film loss, structure damage, and watermarks. The Emersion 300(TM) system employs rapid single-wafer immersion processing with multiple chemical solutions to process wafers one-at-a-time in a single process chamber. This system provides extraordinary precision for a variety of wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. steps including Front End of Line (FEOL FEOL Front End Of Line (semiconductor manufacturing) ) critical cleans and etches, Back End of Line (BEOL BEOL Back-End-Of-Line BEOL Bent's Old Fort National Historic Site (La Junta, Colorado) BEOL Bent's Old Fort National Historic Site (US National Park Service) ) cleans, and specialized applications to address unique issues facing fabs processing wafers at and below the 65nm node. The Emersion 300(TM) tool is the logical progression in wafer processing beyond batch immersion tools. This system meets or exceeds the particle, etch To create a design in a material by digging out the material. The circuit designs on printed circuit boards and chips are etched by acid. See chip and printed circuit board. and drying requirements for sub-65nm process technologies. Emersion 300(TM) combines a unique configuration of megasonics transducers with state-of-the-art Enhanced Marangoni(TM) drying to achieve cycle times of 2-3 minutes for a critical pre-diffusion clean vs. typical hour-long batch process times. This tool's flexible megasonics configuration and control capability allows high particle removal efficiency without damaging delicate structures. Ultra-dilute chemistries and short process times help prevent film loss. And with the most demanding high aspect ratio structures, Emersion technology cleans and dries without bridging. SCP's Emersion 300(TM) processor consists of two or four single-wafer immersion chambers featuring multiple megasonics transducers which can be used individually or in multiple combinations during any process or rinse step, depending upon the process application. Chemistries can be introduced in a single-pass, point-of-use fashion or a recirculated filtered mode for improved cost of ownership. Other features include a fluid distribution manifold manifold In mathematics, a topological space (see topology) with a family of local coordinate systems related to each other by certain classes of coordinate transformations. Manifolds occur in algebraic geometry, differential equations, and classical dynamics. for introducing multiple chemistries or DI rinse water into the chamber, and a novel drying manifold which combines IPA IPA - International Phonetic Alphabet vapor condensation drying with the wafer extraction from the chamber. This innovative drying process, Enhanced Marangoni(TM) dry, yields a 30-second drying sequence and provides watermark-free performance. The Emersion 300(TM) is a new wet-processing technology, developed from the wafer surface outward, that merges the best capabilities of batch Automated Wet Stations with the work-flow efficiencies of a single-wafer tool. Its combination of precision capabilities addresses the cleaning and etching etching, the art of engraving with acid on metal; also the print taken from the metal plate so engraved. In hard-ground etching the plate, usually of copper or zinc, is given a thin coating or ground of acid-resistant resin. requirements of leading-edge wafer fabrication and enables the development of processes not possible with today's equipment. The Emersion 300(TM) not only meets existing customer needs, but will provide solutions to many of the industry's future surface preparation challenges as its capabilities are implemented. About SCP Global Technologies Established in 1975, SCP Global Technologies is a leader in the development of wet processing technology and equipment used in the manufacture of semiconductor wafers. SCP holds patents on single-wafer drying technologies, and also on Marangoni(R), GreenDry(R) and GreenDry CI(TM) (Chemical Inject in·ject v. 1. To introduce a substance, such as a drug or vaccine, into a body part. 2. To treat by means of injection. ) drying technologies for today's most complex cleaning and drying challenges. The company is committed to being the worldwide leader in surface preparation technology, systems and services to the semiconductor and related industries. Learn more about SCP at www.scpglobal.com. |
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